JPH034585A - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a hybrid integrated circuit device that can be used in electrical circuits of electronic communication equipment such as televisions, VTRs, and audio equipment.

BACKGROUND OF THE INVENTION Printed resistors have traditionally been used as a means of increasing the packaging density of hybrid integrated circuit devices. In this case, the printed resistor is formed for each single layer or multiple layers.

Conventional examples are shown in Figs. 5 and 6. Fig. 5 is an example of a single layer of a conventional hybrid integrated circuit device, and Fig. 5 (a) is a cross-sectional view of the resistor portion, and Fig. 5 (b) is a cross-sectional view of the resistor portion. 6 shows a perspective view of the same, and FIG. 6 shows a cross-sectional view of a resistor portion in an example of a multilayer conventional hybrid integrated circuit device.

5 and 6, 21 and 22 are single-layer printed resistors, 23 is a conductor, 24 is a substrate, 25 is a multilayer lower layer printed resistor, 26 is an insulating layer, and 27 is a multilayer upper layer printed resistor. , 28 are trimming grooves.

Problems to be Solved by the Invention However, in the conventional example described above, (1) the area occupied by the printed resistor is the sum of the area of each main body and the dead space for trimming, etc., which is an obstacle to increasing the packaging density.

(2) Only in the case of multiple layers (a) The insulating layer 26 is destroyed during trimming, which adversely affects the resistance value.

The insulating layer 26 is as thin as several tens of microns, and if there is a conductor or the like underneath it, there is a risk of damage during trimming.

(C) There is a resistor trimming process for each layer, which increases the number of man-hours.

(d) After trimming the lower layer resistor, heat treatment such as forming an insulating layer is required, and there are problems such as difficulty in controlling the final resistance value.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a hybrid integrated circuit device that increases packaging density, produces printed resistors with high precision, and reduces man-hours.

Means for Solving the Problems In order to solve the above-mentioned problems, a hybrid integrated circuit device of the present invention includes forming a printed resistor based on ruthenium oxide on a hollow substrate, and forming an inorganic glass based printed resistor on a portion of the printed resistor. Alternatively, an organic insulating layer is formed, and a ruthenium oxide or organic printed resistor is formed on the insulating layer to cross over with the printed resistor.

Function: With the above configuration, the present invention can reduce the area occupied by the printed resistor and increase the packaging density. In addition, all the trimming of the printed resistors is done on the enamel board and all at once at the end, so the accuracy of the resistance value is 5% compared to the conventional example.
While there is a variation of ~10%, the present invention can reduce the variation to 1% or less. Furthermore, the number of man-hours for trimming can be reduced.

Embodiment Hereinafter, a hybrid integrated circuit device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a printed resistor portion of a hybrid integrated circuit device according to a first embodiment of the present invention, and FIG. 2 is a perspective view of the same printed resistor portion.

In Figures 1 and 2, 1 is a lower layer ruthenium oxide resistor, 2 is an inorganic glass insulating layer such as borosilicate glass, and 3 is a ruthenium oxide printed resistor that crosses over with the ruthenium oxide printed resistor 1. body, 4 is Ag, /Pd
5 is a hollow substrate, and 6 is a trimming groove.

A method of forming a hybrid integrated circuit device including the above-mentioned components will be described below. A printed resistor 1 containing ruthenium oxide as a main component is printed on a substrate 5, dried, and then fired in an air atmosphere at a temperature of about 850°C. Thereafter, an inorganic glass-based insulating layer 2 is printed and dried on the printed resistor l and fired in an air atmosphere at a temperature of around 850°C. Thereafter, a printed resistor 3 of ruthenium oxide, which is electrically insulated from the printed resistor 1 by an insulating layer 2 and crosses over with the printed resistor 1, is printed and dried in an air atmosphere at a temperature of around 850°C. Fire and form. In this way, overlapping printed resistors 1.3 are formed which are electrically insulated by the insulating layer 2. Trimming of the resistors is then done collectively.

Incidentally, the conductor 4, such as Ag/Pd, is formed before the lower printed resistor 1 is formed.

As described above, according to the embodiment, a part of the lower resistor 1 is covered with the insulating layer 2, and the upper resistor 3 is formed by crossing over to the lower resistor 1 on the insulation 112, thereby increasing the packaging density. , the resistor can be trimmed with high precision and the number of trimming steps can be reduced.

FIG. 3 is a sectional view of a printed resistor portion of a hybrid integrated circuit device according to a second embodiment of the present invention, and FIG. 4 is a perspective view of the same printed resistor portion.

In Figures 3 and 4, 1.4 to 6 are the same as in Figures 1 and 2, respectively, 1 is the lower layer ruthenium oxide printed resistor, 4 is a conductor such as Ag/PD, and 5 is enamel. On the substrate, 6 represents a trimming groove. 11 is an organic insulating layer made of epoxy resin or the like, and 12 is an organic printed resistor whose main component is carbon or the like.

After printing and drying ruthenium oxide printed resistor 1,
After firing in an air atmosphere at a temperature of around 50″C,
An organic insulating layer 11 is printed on the printed resistor 1.

After that, it is cured at a temperature of about 50 to 200°C, and then the printed resistor 1 and the insulating layer 11 are electrically insulated, and the organic printed resistor 1 crosses over with the printed resistor 1.
2 is printed and cured at a temperature of about 150 to 200°C.

In this way, overlapping printed resistors 1.12 are formed which are electrically insulated by the insulating layer 11.

As described above, according to the present example, the same effects as the first example can be achieved, and the insulating layer can be formed at a lower temperature than the first example.

Effects of the Invention As described above, according to the present invention, a part of the lower layer resistor is covered with an insulating layer, and the upper layer resistor is formed by crossing over to the lower layer resistor on the insulating layer, thereby increasing the packaging density. , the resistor can be trimmed accurately and the number of trimming steps can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a printed resistor portion of a hybrid integrated circuit device according to a first embodiment of the present invention, FIG. 2 is a perspective view of the same resistor portion, and FIG. FIG. 4 is a cross-sectional view of the printed resistor portion of an integrated circuit device, FIG. 4 is a perspective view of the resistor portion, and FIG. 5(a) is a cross-sectional view of the resistor portion of a conventional single-layer hybrid integrated circuit device. (C) is a perspective view of the resistor portion, and FIG. 6 is a sectional view of the printed resistor portion of the conventional multilayer hybrid integrated circuit device. 1... Lower layer printed resistor (ruthenium oxide type)
2... Insulating layer (inorganic glass type), 3...
・Top layer printed resistor (ruthenium oxide type), 4...
...Conductor such as Ag/Pd, 5...Enamel board, 6...Resistance trimming groove, 11...
Insulating layer (organic), 12... Upper layer printed resistor (
machine).

Claims (1)

[Claims] a resistor mainly composed of ruthenium oxide formed on a hollow substrate; an insulating layer made of at least one of inorganic glass and organic insulator formed on a portion of the resistor; and the insulating layer on the resistor. 1. A hybrid integrated circuit device comprising: a resistor whose main component is ruthenium oxide or an organic resistor;