JPH0345937U - - Google Patents
Info
- Publication number
- JPH0345937U JPH0345937U JP1989106355U JP10635589U JPH0345937U JP H0345937 U JPH0345937 U JP H0345937U JP 1989106355 U JP1989106355 U JP 1989106355U JP 10635589 U JP10635589 U JP 10635589U JP H0345937 U JPH0345937 U JP H0345937U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- gas supply
- chamber
- heating means
- supply chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
Landscapes
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Description
第１図は本考案に係る加熱硬化装置の実施例を
示す一部透視を含む平面図、第２図は第１図中に
於けるＡ−Ａ線上に沿う断面図、第３図は第２図
の要部拡大図、第４図は第１図中に於けるＢ−Ｂ
線上に沿う断面図、第５図は試料部内の実施例を
示す平面図、第６図は本発明に係る加熱硬化装置
で作成された温度プロフアイルの実施例を示す説
明図である。
１６ａ……温度監視孔、２０……ガス供給室、
２２……加熱室、２４……仕切板、２４ａ……ガ
ス通過孔、２８……試料部材、３４……ヒートブ
ロツク、３６，３８……ワイヤロープ、４２ａ…
…排気口。
FIG. 1 is a partially transparent plan view showing an embodiment of the heat curing apparatus according to the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. An enlarged view of the main part of the figure, Figure 4 is from B-B in Figure 1.
FIG. 5 is a cross-sectional view taken along a line, FIG. 5 is a plan view showing an example inside the sample section, and FIG. 6 is an explanatory diagram showing an example of a temperature profile created by the heat curing apparatus according to the present invention. 16a...Temperature monitoring hole, 20...Gas supply chamber,
22... Heating chamber, 24... Partition plate, 24a... Gas passage hole, 28... Sample member, 34... Heat block, 36, 38... Wire rope, 42a...
…exhaust port.
補正 平２．７．２０
考案の名称を次のように補正する。
考案の名称 加熱硬化装置
実用新案登録請求の範囲、図面の簡単な説明を
次のように補正する。Amendment 2002.7.20 The name of the invention is amended as follows. Title of the invention: Heat curing device The scope of the utility model registration claim and the brief description of the drawings are amended as follows.
【実用新案登録請求の範囲】
(1) 複数の加熱手段が設けられた加熱室と、
加熱室に仕切板を介して設けられ、前記加熱手
段に向けて高温ガスを吹き出すガス供給室と、
前記加熱室の加熱手段上に試料部材を順次間欠
搬送する搬送手段と、
前記ガス供給室から吹き出した高温ガスを加熱
手段の下方から加熱室外に排気する排気口と、
から成ることを特徴とする加熱硬化装置。
(2) 前記仕切板のガス通過隙間に対応して前記
ガス供給室の上部に開閉自在な温度監視孔が形成
されたことを特徴とする請求項(1)の加熱硬化装
置。[Claims for Utility Model Registration] (1) A heating chamber provided with a plurality of heating means; a gas supply chamber provided in the heating chamber via a partition plate and blowing out high-temperature gas toward the heating means; Heating characterized by comprising: a conveying means for sequentially and intermittently conveying the sample members onto the heating means of the heating chamber; and an exhaust port for exhausting the high temperature gas blown out from the gas supply chamber to the outside of the heating chamber from below the heating means. Curing equipment. (2) The heating curing device according to claim (1), wherein a temperature monitoring hole that can be opened and closed is formed in the upper part of the gas supply chamber corresponding to the gas passage gap of the partition plate.
【図面の簡単な説明】
第１図は本考案に係る加熱硬化装置の実施例を
示す一部透視を含む平面図、第２図は第１図中に
於けるＡ−Ａ線上に沿う断面図、第３図は第２図
の要部拡大図、第４図は第１図中に於けるＢ−Ｂ
線上に沿う断面図、第５図は試料部材の実施例を
示す平面図、第６図は本発明に係る加熱硬化装置
で作成された温度プロフアイルの実施例を示す説
明図である。
１６ａ……温度監視孔、２０……ガス供給室、
２２……加熱室、２４……仕切板、２４ａ……ガ
ス通過隙間、２８……試料部材、３４……ヒート
ブロツク、３６，３８……ワイヤロープ、４２ａ
……排気口。[Brief Description of the Drawings] Fig. 1 is a partially transparent plan view showing an embodiment of the heat curing device according to the present invention, and Fig. 2 is a sectional view taken along line A-A in Fig. 1. , Figure 3 is an enlarged view of the main part of Figure 2, Figure 4 is B-B in Figure 1.
5 is a plan view showing an example of a sample member, and FIG. 6 is an explanatory diagram showing an example of a temperature profile created by the heat curing apparatus according to the present invention. 16a...Temperature monitoring hole, 20...Gas supply chamber,
22... Heating chamber, 24... Partition plate, 24a... Gas passage gap, 28... Sample member, 34... Heat block, 36, 38... Wire rope, 42a
……exhaust port.
Claims (1)
段に向けて高温ガスを吹き出すガス供給室と、 前記加熱室の加熱手段上に試料部材を順次間欠
搬送する搬送手段と、 前記ガス供給室から吹き出した高温ガスを加熱
手段の下方から加熱室外に排気する排気口と、 から成ることを特徴とする加熱硬化装置。 (2) 前記仕切板のガス通過孔に対応して前記ガ
ス供給室の上部に開閉自在な温度監視孔が形成さ
れたことを特徴とする請求項(1)の加熱硬化装置
。[Claims for Utility Model Registration] (1) A heating chamber provided with a plurality of heating means; a gas supply chamber provided in the heating chamber via a partition plate and blowing out high-temperature gas toward the heating means; Heating characterized by comprising: a conveying means for sequentially and intermittently conveying the sample members onto the heating means of the heating chamber; and an exhaust port for exhausting the high temperature gas blown out from the gas supply chamber to the outside of the heating chamber from below the heating means. Curing equipment. (2) The heating curing device according to claim 1, wherein a temperature monitoring hole that can be opened and closed is formed in the upper part of the gas supply chamber in correspondence with the gas passage hole of the partition plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106355U JPH0619546Y2 (en) | 1989-09-11 | 1989-09-11 | Heat curing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106355U JPH0619546Y2 (en) | 1989-09-11 | 1989-09-11 | Heat curing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0345937U true JPH0345937U (en) | 1991-04-26 |
| JPH0619546Y2 JPH0619546Y2 (en) | 1994-05-25 |
Family
ID=31655086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989106355U Expired - Lifetime JPH0619546Y2 (en) | 1989-09-11 | 1989-09-11 | Heat curing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0619546Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307353A (en) * | 1994-05-11 | 1995-11-21 | Matsushita Electric Ind Co Ltd | Cure device |
| JP2001246630A (en) * | 2000-03-07 | 2001-09-11 | Hitachi Chem Co Ltd | Production equipment for thermosetting resin composition cured products |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021257748A1 (en) * | 2020-06-18 | 2021-12-23 | Kulicke And Soffa Industries, Inc. | Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992539A (en) * | 1982-11-19 | 1984-05-28 | Hitachi Ltd | Wire bonding process |
| JPS61185990U (en) * | 1985-05-08 | 1986-11-20 | ||
| JPS63239957A (en) * | 1987-03-27 | 1988-10-05 | Nec Corp | Manufacture of semiconductor device |
| JPS63316444A (en) * | 1987-06-19 | 1988-12-23 | Hitachi Electronics Eng Co Ltd | Heating device in silver paste curing device |
| JPS63316443A (en) * | 1987-06-19 | 1988-12-23 | Hitachi Electronics Eng Co Ltd | Silver paste curing device |
-
1989
- 1989-09-11 JP JP1989106355U patent/JPH0619546Y2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992539A (en) * | 1982-11-19 | 1984-05-28 | Hitachi Ltd | Wire bonding process |
| JPS61185990U (en) * | 1985-05-08 | 1986-11-20 | ||
| JPS63239957A (en) * | 1987-03-27 | 1988-10-05 | Nec Corp | Manufacture of semiconductor device |
| JPS63316444A (en) * | 1987-06-19 | 1988-12-23 | Hitachi Electronics Eng Co Ltd | Heating device in silver paste curing device |
| JPS63316443A (en) * | 1987-06-19 | 1988-12-23 | Hitachi Electronics Eng Co Ltd | Silver paste curing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307353A (en) * | 1994-05-11 | 1995-11-21 | Matsushita Electric Ind Co Ltd | Cure device |
| JP2001246630A (en) * | 2000-03-07 | 2001-09-11 | Hitachi Chem Co Ltd | Production equipment for thermosetting resin composition cured products |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0619546Y2 (en) | 1994-05-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R323531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R323533 |
|
| R370 | Written measure of declining of transfer procedure |
Free format text: JAPANESE INTERMEDIATE CODE: R370 |