JPH0346503Y2 - - Google Patents
Info
- Publication number
- JPH0346503Y2 JPH0346503Y2 JP1987044896U JP4489687U JPH0346503Y2 JP H0346503 Y2 JPH0346503 Y2 JP H0346503Y2 JP 1987044896 U JP1987044896 U JP 1987044896U JP 4489687 U JP4489687 U JP 4489687U JP H0346503 Y2 JPH0346503 Y2 JP H0346503Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- spacer
- cover
- side plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は回路基板に関するもので、詳しくは実
装基板に実装する回路基板に関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a circuit board, and more specifically to a circuit board mounted on a mounting board.
（従来の技術とその問題点）
従来、実装基板に実装する回路基板A′には、
例えば第４図に示す構造のものがある。この従来
構造の回路基板について説明すると、基板本体
１′上面のマウント部５周囲にダムリング３を固
着し、更にその上面へ平板形状のカバー２′を接
着剤で固着すると共に、基板本体１′の下面に外
部引出用リードピン１５の脚杆１５ａを突出させ
て実装基板へ装着していた。(Conventional technology and its problems) Conventionally, the circuit board A' mounted on the mounting board has a
For example, there is a structure shown in FIG. To explain this circuit board of the conventional structure, a dam ring 3 is fixed around the mount part 5 on the upper surface of the board body 1', and a flat plate-shaped cover 2' is further fixed with adhesive to the upper surface of the dam ring 3. The leg rod 15a of the lead pin 15 for external extraction was made to protrude from the lower surface of the lead pin 15, and the lead pin 15 was attached to the mounting board.
しかしながら上記構成による回路基板A′は、
カバー２′によりマウント部５のみを被冠するた
め基板本体１′の上面にリードピン１５の頭部が
露出された状態になつており非常に見栄えが悪
い。 However, the circuit board A′ with the above configuration is
Since only the mount portion 5 is covered by the cover 2', the heads of the lead pins 15 are exposed on the upper surface of the board body 1', resulting in a very unsightly appearance.
又、基板本体の下面と実装基板との接触を防止
するためには何らかのスペーサーを両者間に介在
させる必要があり、そのスペーサーを別工程によ
り製造しなければならないため作業効率の低下及
び生産コストの高騰を招くものであつた。 Furthermore, in order to prevent contact between the bottom surface of the board body and the mounting board, it is necessary to interpose some kind of spacer between the two, and the spacer must be manufactured in a separate process, which reduces work efficiency and increases production costs. This led to a rise in prices.
（考案が解決しようとする技術的課題）
以上の問題点を解決しようとする本考案の技術
的課題は、基板本体に取り付けるカバーにスペー
サーを一体に設けることである。(Technical Problem to be Solved by the Invention) A technical problem to be solved by the invention to solve the above-mentioned problems is to provide a spacer integrally with the cover attached to the substrate body.
（技術的課題を達成する為の手段）
以上の技術的課題を達成する為の本考案の手段
は、基板本体上面に被着するカバーの周縁に側面
板を垂下状一体に延設し、該側面板下端を前記基
板本体下面より所望長さ突出させてスペーサーを
形成することである。(Means for Achieving the Technical Problem) The means of the present invention for achieving the above-mentioned technical problem is to extend a side plate integrally in a hanging manner around the periphery of the cover that is attached to the upper surface of the board main body. The lower end of the side plate is made to protrude from the lower surface of the substrate body by a desired length to form a spacer.
（作用）
上記構成によれば、基板本体の上面は全てカバ
ーにより被冠されるとともに、回路基板を実装基
板に実装した際カバーの側面板下端に形成したス
ペーサーが該基板と実装基板間に〓間を形成す
る。(Function) According to the above configuration, the entire top surface of the board body is covered by the cover, and when the circuit board is mounted on the mounting board, the spacer formed at the lower end of the side plate of the cover is spaced between the board and the mounting board. form a gap.
（効果）
本考案は以上の様な構成にしたことにより下記
の効果を有する。(Effects) The present invention has the following effects by having the above configuration.
回路基板の上面をカバーで被冠したので、リ
ードピンの頭部が覆われて見栄えが良くなる。 Since the top surface of the circuit board is covered with a cover, the heads of the lead pins are covered and the appearance improves.
基板本体上面に被着するカバーの側面板下端
を前記基板本体下面より所望長さ突出させてス
ペーサーを一体に形成したので、スペーサーを
別工程で製造する必要がなくなると共に、基板
本体にカバーを被着すると同時にスペーサーも
装着されスペーサーを取り付ける工程を必要と
せず、依つて作業効率がよく生産コストの安価
な回路基板を提供する。 Since the spacer is integrally formed by making the lower end of the side plate of the cover that is attached to the upper surface of the substrate body protrude from the lower surface of the substrate body by a desired length, there is no need to manufacture the spacer in a separate process, and it is possible to cover the cover on the substrate body. To provide a circuit board with good work efficiency and low production cost, since a spacer is also attached at the same time as the spacer is attached, and there is no need for a step of attaching the spacer.
（実施例）
以下本考案に係る回路基板の実施例を図面に基
づいて説明する。(Example) Examples of the circuit board according to the present invention will be described below based on the drawings.
回路基板Ａは基板本体１の上面にカバー２を被
冠して形成し、実装基板Ｂに実装される。 The circuit board A is formed by covering the top surface of a board body 1 with a cover 2, and is mounted on a mounting board B.
基板本体１はセラミツク、ガラスエポキシ樹脂
等からなる方形状の基板１１と、基板１１の上面
中央マウント部１２に接着固定したチツプ１３
と、チツプ１３の電極を基板１１上面に形成され
た導体回路（図示せず）へ接続するボンデイング
ワイア１４と、導体回路と接続し基板１１へ半田
付けにより固定した外部引出用のリードピン１５
とから構成する。 The board body 1 includes a rectangular board 11 made of ceramic, glass epoxy resin, etc., and a chip 13 adhesively fixed to a central mount part 12 on the top surface of the board 11.
, bonding wires 14 that connect the electrodes of the chip 13 to a conductive circuit (not shown) formed on the upper surface of the substrate 11, and lead pins 15 for external extraction connected to the conductive circuit and fixed to the substrate 11 by soldering.
It consists of
カバー２は前記基板本体１上面を覆う上面板２
１と、該上面板２１周縁から垂下状に延設された
側面板２２とからなり、基板本体１の上面及び側
面へ被冠して接着剤により固定する。 The cover 2 is a top plate 2 that covers the top surface of the board main body 1.
1, and a side plate 22 extending downwardly from the periphery of the top plate 21, which is covered with the top and side surfaces of the substrate body 1 and fixed with an adhesive.
上面板２１は前記基板１１と略同一形状の平板
で、周縁を基板本体１周縁から若干突出させてそ
の下面に側面板２２を垂下状に延設する。 The top plate 21 is a flat plate having substantially the same shape as the substrate 11, and has a peripheral edge slightly protruding from the peripheral edge of the substrate main body 1, and a side plate 22 extending downwardly from the lower surface thereof.
側面板２２は、前記基板１１の側面上端から下
端迄延設し該側面を囲周する平面囲形に形成する
と共に、該側面板２２下端周縁へスペーサー２３
を突出状に形成する。 The side plate 22 extends from the upper end to the lower end of the side surface of the substrate 11 and is formed into a planar encircling shape surrounding the side surface, and a spacer 23 is provided around the lower end of the side plate 22.
is formed into a protruding shape.
スペーサー２３は側面板２２下端周縁を基板１
１の下面より所望長さ延長突出させ内側に折り返
した折り返し片で、前記回路基板Ａを実装基板Ｂ
に実装した際に、実装基板Ｂとの間に介在して基
板本体１の下面が実装基板Ｂに接触するのを防止
する。 The spacer 23 connects the lower edge of the side plate 22 to the substrate 1.
The circuit board A is attached to the mounting board B using a folded piece that protrudes from the lower surface of the circuit board A by a desired length and is folded back inward.
When mounted on the mounting board B, it is interposed between the board body 1 and the mounting board B to prevent the lower surface of the board body 1 from coming into contact with the mounting board B.
又、該スペーサー２３は折り返した先端を側面
板２２と直交する方向へ屈曲させて基板本体１の
下面に当接し、前記カバー２の基板本体１への固
定を確実なものにする。 Further, the folded end of the spacer 23 is bent in a direction perpendicular to the side plate 22 and comes into contact with the lower surface of the board main body 1, thereby ensuring the fixation of the cover 2 to the board main body 1.
尚、本実施例においてはカバー２上面に、前記
マウント部１２と対向する開口部２４を設けると
共に、該開口部２４開口縁にマウント部１２周縁
上方を囲周する周壁２５を立設し、該周壁２５上
端にキヤツプ２６を被冠して周壁２５内にシール
剤１６を充填してマウント部１２をシールする。 In this embodiment, an opening 24 is provided on the upper surface of the cover 2, facing the mount 12, and a peripheral wall 25 is provided on the edge of the opening 24 to surround the upper periphery of the mount 12. A cap 26 is placed on the upper end of the peripheral wall 25, and a sealant 16 is filled in the peripheral wall 25 to seal the mount portion 12.
周壁２５は基板本体１上面の導体回路のリード
部外側から該リード部を囲むように開口部２４開
口縁から起立状に屈曲形成する。 The peripheral wall 25 is bent to stand up from the opening edge of the opening 24 so as to surround the lead portion of the conductor circuit on the upper surface of the substrate body 1 from the outside.
図面は本考案に係る回路基板の一実施例を示
し、第１図は回路基板の中央縦断面図、第２図は
同底面図、第３図は同斜視図で一部切欠して示
す、第４図は従来の回路基板の中央縦断面図であ
る。
尚、図中、回路基板……Ａ、基板本体……１、
カバー……２、上面板……２１、側面板……２
２、スペーサー……２３とする。
The drawings show an embodiment of the circuit board according to the present invention, in which FIG. 1 is a central vertical cross-sectional view of the circuit board, FIG. 2 is a bottom view of the circuit board, and FIG. 3 is a perspective view of the circuit board with a portion cut away. FIG. 4 is a central longitudinal sectional view of a conventional circuit board. In addition, in the figure, the circuit board...A, the board body...1,
Cover……2, Top plate……21, Side plate……2
2. Spacer...23.
Claims (1)
を垂下状一体に延設し、該側面板下端を前記基板
本体下面より所望長さ突出させてスペーサーを形
成した回路基板。 A circuit board in which a side plate is integrally extended in a hanging manner around the periphery of a cover that is attached to the upper surface of the board body, and the lower end of the side plate is made to protrude a desired length from the lower surface of the board body to form a spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987044896U JPH0346503Y2 (en) | 1987-03-25 | 1987-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987044896U JPH0346503Y2 (en) | 1987-03-25 | 1987-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62177041U JPS62177041U (en) | 1987-11-10 |
| JPH0346503Y2 true JPH0346503Y2 (en) | 1991-10-01 |
Family
ID=30863138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987044896U Expired JPH0346503Y2 (en) | 1987-03-25 | 1987-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0346503Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62249458A (en) * | 1986-04-23 | 1987-10-30 | Hitachi Vlsi Eng Corp | Semiconductor device |
-
1987
- 1987-03-25 JP JP1987044896U patent/JPH0346503Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62177041U (en) | 1987-11-10 |
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