JPH0346779A - Ic socket - Google Patents

Abstract

PURPOSE:To increase the package mounting number per space and to automate the package installation easily by moving a carrier installed to the package parallel to a holding lid so as to install the carrier to the holding lid. CONSTITUTION:A package 5 is put in to a carrier 3. Then, the carrier 3 with the package 5 is inserted and set to a holding lid 20 while sliding the carrier 3 to the guide grooves 21 of the holding lid 20. Then the holding lid 20 is lowered and fixed to a socket base 1 with a clasp 40. In this case, a positioning guide 31 of the carrier 3 and a positioning pin 12 of the socket base 1 are geared, the relative positions are regulated minutely, and a contact pin 11 of the socket base 1 and a lead 51 of the package 5 are contacted accurately. Consequently, the carrier can be installed only by opening upward at the angle about 40-50 deg., and by applying a one-direction force from the upper side.

Description

[Detailed Description of the Invention] [Summary] Regarding the improvement of IC sockets, the present invention aims to reduce the processing space, increase the number of packages mounted per space, and facilitate the automation of package mounting. Move the carrier with the package attached from the side parallel to the presser lid,
The carrier is attached to the presser cover, and then the presser cover is configured to be press-locked to the socket substrate.

[Industrial application field]

The present invention relates to improvements in IC sockets.

Recently, the manufacturing process of semiconductor devices has been increasingly automated, and testing and burn-in processing are no exception, and labor saving is desired.

[Conventional technology]

As semiconductor devices such as ICs and LSIs become more highly integrated, the density increases and multi-layer wiring is formed, but problems such as wiring short circuits due to patterning defects, disconnections, and breakdown of interlayer insulating films occur. It is difficult to prevent these problems through process control alone, so burn-in has traditionally been used as a screening method.
Processing is in progress.

This burn-in process is a sorting process in which devices are operated by applying a bias at high temperatures, and easily destroyed items such as short circuits and disconnections in wiring are destroyed during the operation, and defective products are removed by subsequent testing.

This kind of burn-in processing is a process that is performed on all products, so one product is placed in each IC socket mounted on the board.
They are installed one by one.

Fig. 2 shows a perspective view of a conventional IC socket, in which symbol 1 is the socket board and 2 is the retainer cover.

3 is a carrier, 4 is a latch, 5 is a package (processed I
C product), 11 is the contact pin of the socket board, 12
13 is a positioning pin, 13 is a rotation support shaft, 31 is a carrier positioning guide, and 51 is a package lead. Third
The figure shows a plan view of the carrier to which the package is attached, and the pan cage 5 is fitted into the square hole of the carrier 3 and is pressed and held at the four corners by support pins 32.

Next, referring to FIG. 2, a method for mounting a carrier on an IC socket will be described. The carrier 3 with the package attached is placed on the socket board 1 with the positioning pins 12 and the positioning guides 31 aligned.

Then, the contact pins 11 of the socket board and the leads 51 of the package come into contact. Next, lower the presser cover 2 in an arc (as shown by the arrow) and press the socket base tfi.
The hook on 1 is locked with gold 4.

[Problem to be solved by the invention]

However, when the above mounting method is used, the presser foot lid 2
Since it is necessary to open the board upward at an angle of more than a right angle (90°) using the rotational support shaft 13 as a fulcrum, the space required for the board increases and it is difficult to increase the number of packages mounted on one board. There is.

In addition, in this way, the presser cover 2 is opened upward at an angle greater than a right angle (this method requires applying force to draw an arc, making automation of attachment complicated and difficult).

The present invention eliminates these problems and provides an IC socket structure for the purpose of reducing the burn-in processing space, increasing the number of package mounting units per space, and facilitating automation of package mounting. This is a proposal.

[Means to solve the problem]

The problem is as shown in the embodiment shown in FIG.
The carrier 3 with the package attached thereto is moved parallel to the holding lid from the side of 0, and the carrier 3 is attached to the holding lid 20. Next, the holding lid 20 is pressed and locked to the socket board l, and the above-mentioned The solution is an IC socket that makes contact with the leads of the package.

[For production]

That is, in the present invention, the carrier 3 with the package attached thereto is slid in parallel to the presser cover 20, and the carrier 3 is attached to the presser cover 20.

In this way, there is no need to open the presser cover 20 upward at an angle greater than a right angle, and the carrier can be attached by simply opening it upward at an angle of about 40 to 50 degrees. Therefore, the burn-in processing space is reduced, and Easily automate mounting.

〔Example〕

Examples will be described in detail below with reference to the drawings.

FIG. 1 shows a perspective view of an IC socket according to the present invention, and the symbols in the figure are the same as in FIG. 2: 1 is the socket substrate, 3 is the carrier, and 5 is the package.

11 is a contact pin of the socket board, 12 is a positioning pin, 13 is a rotating shaft, 31 is a carrier positioning guide, 51 is a package lead, and 20 is a holding lid.

Reference numeral 21 indicates a guide groove provided in the presser cover, and reference numeral 40 indicates a metal hook.

That is, this example has a structure in which a guide groove 21 is provided in the presser cover 20, and the carrier 3 is inserted into this guide groove 21 by sliding it from the side in parallel with the presser cover.

Referring to FIG. 1, the method of attaching a carrier to an IC socket will be described. The package 5 is fitted into the carrier 3 using the same conventional carrier for attaching the package (see FIG. 3).

Next, the carrier 3 with the package 5 attached thereto is inserted and set into the guide groove 21 of the presser lid 20 while sliding. Next, lower the presser foot 120 (as shown by the arrow)
The hook is secured to the socket board 1 with a metal fitting 40. At this time, the positioning pins 12 of the carrier 3 and the positioning guides 31 of the socket board 1 are fitted, their mutual positions are finely aligned, and the contact pins 11 of the socket board and the package glue 51 are brought into proper contact.

If such an IC socket is constructed, the carrier can be attached by simply opening it upward at an angle of about 40 to 50 degrees, so the burn-in processing space is small (thereby, the number of packages mounted per space can be increased, and it is possible to install the carrier from above). Since it can be installed simply by applying force in one direction, automation of installation becomes easy.

Although the above example has a structure in which the guide groove 21 is provided in the presser foot M2O, it is also possible to create another structure in which the carrier 3 is moved and set in parallel to the presser foot lid.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the burn-in processing space is reduced and packaging density is improved, and automatic mounting is easily devised because of the structure that allows mounting by simply applying force in the -force direction. It is possible to obtain the desired effect.

Furthermore, it is a matter of course that the IC socket according to the present invention can be applied not only to burn-in processing but also to other testing processes.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an IC socket according to the present invention, FIG. 2 is a perspective view of a conventional IC socket, and FIG. 3 is a plan view of a carrier to which a package is attached. In the figure, l is the socket board, 2.20 is the presser cover, 3 is the carrier, 4.40 is the latch, 5 is the package (IC product to be processed), 11 is the contact pin, 12 is the positioning pin, 13 is the rotation The supporting shaft, 31 is a positioning guide, 51 is a lead of the package, and 21 is a guide groove provided in the presser cover.

Claims (1)

[Claims] The carrier (3) to which the package (5) is attached is moved from the side of the retainer lid (20) parallel to the retainer lid, the carrier is attached to the retainer lid, and then the retainer lid is attached to the socket board (1). 2.) An IC socket characterized in that the IC socket is press-locked to contact the leads of the package.