JPH0347332Y2 - - Google Patents
Info
- Publication number
- JPH0347332Y2 JPH0347332Y2 JP2081786U JP2081786U JPH0347332Y2 JP H0347332 Y2 JPH0347332 Y2 JP H0347332Y2 JP 2081786 U JP2081786 U JP 2081786U JP 2081786 U JP2081786 U JP 2081786U JP H0347332 Y2 JPH0347332 Y2 JP H0347332Y2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- substrate
- electronic component
- sealing
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 23
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010407 anodic oxide Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000012790 adhesive layer Substances 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000004043 dyeing Methods 0.000 description 2
- 230000036571 hydration Effects 0.000 description 2
- 238000006703 hydration reaction Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000005457 Black-body radiation Effects 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、基板上に搭載される電子部品を封止
するためのキヤツプに関するものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a cap for sealing electronic components mounted on a substrate.
（従来の技術）
この種の電子部品封止用キヤツプは、電子部品
搭載用基板に搭載された電子部品を覆つた状態で
当該基板に固定することにより、基板上の電子部
品を外部からの湿気や衝撃等から保護する目的で
使用されているものである。(Prior art) This type of electronic component sealing cap is fixed to an electronic component mounting board while covering the electronic components mounted on the board, thereby preventing the electronic components on the board from moisture from the outside. It is used for the purpose of protection from shock and damage.
従来の電子部品封止用キヤツプとしては、第５
図に示すセラミツクス製のキヤツプ２２に見られ
るように、金型等で凹部２３を形成したものがあ
り、基板２１上の電子部品２６を覆つた場合に、
電子部品２６及びボンデイグワイヤー２７と前記
キヤツプ２２が接触して断線、または短絡等の不
良を引き起こさないようになされている。また、
第６図に示すように、最も単純な平板状のキヤツ
プ２２もあり、基板２１上に接合一体化された堰
部材２４を介して接着固定されることにより、電
子部品２６を封止する目的に使用されている。 As a conventional cap for sealing electronic components, the fifth
As seen in the ceramic cap 22 shown in the figure, there is one in which a recess 23 is formed using a mold or the like, and when the electronic component 26 on the board 21 is covered,
This prevents the electronic component 26 and bonding wire 27 from coming into contact with the cap 22 and causing defects such as disconnection or short circuit. Also,
As shown in FIG. 6, there is also the simplest flat plate-shaped cap 22, which is adhesively fixed onto the substrate 21 via a weir member 24 that is integrally bonded, and is used for the purpose of sealing electronic components 26. It is used.
しかしながら、これら従来のキヤツプ２２にあ
つては、キヤツプ２２の位置決めをすることがで
きないため、封止工程の際の作業効率が悪いとい
う欠点を有していた。 However, these conventional caps 22 have the drawback of poor working efficiency during the sealing process because the cap 22 cannot be positioned.
（考案が解決しようとする問題点）
本考案は、以上のような実状に鑑みてなされた
ものであり、その解決しようとする問題点は、キ
ヤツプを基板に接着固定する際の位置決めの困難
さである。(Problems to be solved by the invention) The invention was made in view of the above-mentioned circumstances, and the problem to be solved is the difficulty in positioning when bonding and fixing the cap to the board. It is.
そして、本考案の目的とするところは、この種
の電子部品封止用キヤツプ自体に要求される耐蝕
性及び耐衝撃性を充分備えながら、基板にしつか
りと固定できるようにして電子部品の封止後の信
頼性を高めるとともに、基板に対する固定のため
の位置合わせを容易に行なえるようにした電子部
品封止用キヤツプを提案することにある。 The purpose of the present invention is to seal electronic components in such a way that it can be securely fixed to a board while having sufficient corrosion resistance and impact resistance required of this type of cap for encapsulating electronic components. It is an object of the present invention to propose a cap for sealing electronic parts that has improved reliability and that can be easily aligned for fixing to a board.
（問題点を解決するための手段）
以上の問題点を解決するため本考案が採つた手
段は、基材８を安価で加工性の良いアルミニウム
板とし、この基材８からなるキヤツプ２が固着さ
れる電子部品搭載用基板１の形状に合せて、基材
８に曲げ加工を施し、基板１の側面に嵌合し得る
嵌合部３を形成したことである。(Means for Solving the Problems) The means adopted by the present invention to solve the above problems is to use an aluminum plate that is inexpensive and has good workability as the base material 8, and to fix the cap 2 made of this base material 8. The base material 8 is bent to match the shape of the electronic component mounting board 1 to be used, and a fitting part 3 that can be fitted to the side surface of the board 1 is formed.
（考案の作用）
本考案に係るキヤツプ２は、次のようにして基
板１に固定されるのである。つまり、キヤツプ２
の嵌合部３は、基板１の側面形状に対応している
から、その一部を基板１のいずれか一面に係合さ
せれば、その基板１に対する位置合わせが完了す
る。(Operation of the invention) The cap 2 according to the invention is fixed to the substrate 1 in the following manner. In other words, cap 2
Since the fitting portion 3 corresponds to the shape of the side surface of the substrate 1, the alignment with respect to the substrate 1 is completed by engaging a portion thereof with any one surface of the substrate 1.
このように位置合わせが完了した後、当該キヤ
ツプ２を基板１に対して嵌合すれば、当該キヤツ
プ２は基板１に対してその嵌合部３において嵌合
され、しつかりと基板１に固定されるのである。
また、このキヤツプ２は、これによつて基板１全
体を覆うことができるため、基板１上の電子部品
６を確実に封止する。 After the alignment is completed in this way, when the cap 2 is fitted to the board 1, the cap 2 is fitted to the board 1 at its fitting part 3, and is firmly fixed to the board 1. It will be done.
Furthermore, since the cap 2 can cover the entire substrate 1, the electronic components 6 on the substrate 1 are reliably sealed.
特に、キヤツプ２の表面側の陽極酸化被膜９に
のみ着色及び封孔処理を施し、かつこの着色及び
封孔処理が施されていない裏面側の前記陽極酸化
被膜９の一部または全面に有機系樹脂素材からな
る接着層５を略均一な厚みで形成させれば、その
外観を美麗に仕上げることが可能となる。そし
て、上記の着色及び封孔処理の方法が、樹脂また
は塗料による有機物封孔処理か、或いは染色した
後に、その他の封孔処理（例えば、水和封孔処理
や金属塩封孔処理）によつてなされた場合には、
この種の電子部品封止用キヤツプ自体に要求され
る耐蝕性及び耐衝撃性を充分備えたキヤツプとな
る。なお、本キヤツプ２の電子部品搭載用基板１
との接着面である裏面側を、陽極酸化被膜９の素
地を生かしたものとし、かつこの被膜９に直接均
一な厚みの接着層５を形成すれば、基板１との接
着性が良く、実装効率も高めることができるもの
である。 In particular, only the anodic oxide coating 9 on the front side of the cap 2 is colored and sealed, and a part or the entire surface of the anodic oxide coating 9 on the back side, which has not been colored and sealed, is made of an organic material. By forming the adhesive layer 5 made of a resin material to have a substantially uniform thickness, it is possible to achieve a beautiful appearance. The above method of coloring and sealing treatment may be organic sealing treatment using resin or paint, or other sealing treatment (for example, hydration sealing treatment or metal salt sealing treatment) after dyeing. If you are invited,
The cap itself has sufficient corrosion resistance and impact resistance required of this type of cap for sealing electronic components. In addition, the electronic component mounting board 1 of this cap 2
By making use of the base material of the anodic oxide film 9 on the back side, which is the adhesive surface with the substrate, and by forming the adhesive layer 5 of uniform thickness directly on this film 9, the adhesiveness with the substrate 1 will be good and mounting will be easier. Efficiency can also be increased.
（実施例）
次に、本考案を図面に示した実施例に基づいて
より詳細に説明する。(Example) Next, the present invention will be described in more detail based on an example shown in the drawings.
第１図には、本考案に係る電子部品封止用キヤ
ツプ２を電子部品搭載用基板１に接着固定した状
態が示してある。また、第３図は第１図に対応す
る断面図である。つまり、この電子部品封止用キ
ヤツプ２は、基板１の形状に合せて、基板１の側
面に嵌合し得る嵌合部３を曲げ加工により形成し
てあり、基板１と接合一体化された堰部材４を介
して接着材（接着層５になる）により接着固定さ
れることにより、基板１に搭載された電子部品６
を封止したものである。 FIG. 1 shows a state in which an electronic component sealing cap 2 according to the present invention is adhesively fixed to an electronic component mounting board 1. As shown in FIG. Further, FIG. 3 is a sectional view corresponding to FIG. 1. In other words, this electronic component sealing cap 2 has a fitting part 3 that can be fitted to the side surface of the substrate 1 formed by bending according to the shape of the substrate 1, and is bonded and integrated with the substrate 1. The electronic components 6 mounted on the board 1 are fixed by an adhesive (which becomes the adhesive layer 5) through the weir member 4.
It is sealed.
本考案が対象とする電子部品封止用キヤツプ２
としては、第２図に示す斜視図と第２図に対応す
る第４図の断面図に示すような形状のものも含ま
れる。即ち、上述した嵌合部３を有するととも
に、中央部に絞り加工による凸部１２を一体的に
有した形状のものである。 Cap for encapsulating electronic components targeted by this invention 2
Examples include those having shapes as shown in the perspective view shown in FIG. 2 and the sectional view in FIG. 4 corresponding to FIG. That is, it has the above-mentioned fitting portion 3, and also has a convex portion 12 integrally formed by drawing in the center portion.
これら各電子部品封止用キヤツプ２の電子部品
搭載用基板１に対する接着面は、第７図の拡大断
面図に示したようになつている。即ち、当該電子
部品封止用キヤツプ２の両面には陽極酸化被膜９
なる絶縁層が形成してあり、表面側の陽極酸化被
膜９には、樹脂または塗料による有機物封孔処理
か、或いは染色した後、水和封孔処理または金属
塩封孔処理が施されているのに対し、裏面側の陽
極酸化被膜９には何ら処理が施されておらず、基
板１と接着するための接着層５が、その裏面の陽
極酸化被膜９に直接形成されている。 The adhesive surface of each of these electronic component sealing caps 2 to the electronic component mounting substrate 1 is as shown in the enlarged sectional view of FIG. That is, the anodic oxide film 9 is formed on both sides of the electronic component sealing cap 2.
The anodic oxide film 9 on the surface side is subjected to organic sealing treatment using resin or paint, or after dyeing, hydration sealing treatment or metal salt sealing treatment. On the other hand, the anodic oxide film 9 on the back side is not subjected to any treatment, and the adhesive layer 5 for adhering to the substrate 1 is directly formed on the anodic oxide film 9 on the back side.
したがつて、上述の電子部品封止用キヤツプ２
が電子部品搭載用基板１と接着固定された場合に
あつては、接着材がキヤツプ２の陽極酸化被膜９
の微細孔１０にも侵入して、強固な接着状態を形
成することができるのである。 Therefore, the above-mentioned electronic component sealing cap 2
is adhesively fixed to the electronic component mounting board 1, the adhesive is the anodic oxide coating 9 of the cap 2.
It can also penetrate into the micropores 10 of the pores 10 and form a strong adhesive state.
実施例 １
基材８としてアルミニウム板を使用するととも
に、このアルミニウム板に基板１の形状に合わせ
て、基板１の側面に嵌合し得るような嵌合部３を
曲げ加工により形成した。この基材８に硫酸アル
マイト処理を施して、両面に陽極酸化被膜９を形
成した。Example 1 An aluminum plate was used as the base material 8, and a fitting portion 3 that could be fitted to the side surface of the substrate 1 was formed on the aluminum plate by bending according to the shape of the substrate 1. This base material 8 was subjected to sulfuric acid alumite treatment to form an anodic oxide film 9 on both sides.
ついで、この基材８の電子部品搭載用基板１と
の接着面（裏面）に耐封孔処理用のマスキングテ
ープ（図示せず）を張り付けた後、黒色染料を溶
かした水溶液に基材８を浸漬して表面側の陽極酸
化被膜９を染色させた。その後に、酢酸ニツケル
を主剤とする金属塩水溶液に基材８を浸漬して表
面側の陽極酸化被膜９に封孔処理を施した後、マ
スキングテープを剥離した。ついで、裏面に接着
剤（接着層５となる）を均一な厚みで塗布して、
乾燥またはＢ−ステージの状態にした後、この電
子部品封止用キヤツプ２を第１図及び第３図に示
したように電子部品搭載用基板１と接合一体化さ
れた堰部材４を介して接着固定した。 Next, a masking tape (not shown) for pore-proofing treatment is applied to the adhesive surface (back side) of the base material 8 to the electronic component mounting board 1, and then the base material 8 is soaked in an aqueous solution containing a black dye. The anodic oxide film 9 on the surface side was dyed by dipping. Thereafter, the base material 8 was immersed in a metal salt aqueous solution containing nickel acetate as a main ingredient to seal the anodic oxide film 9 on the surface side, and then the masking tape was peeled off. Next, apply adhesive (becomes adhesive layer 5) to the back side with a uniform thickness,
After drying or in a B-stage state, the electronic component sealing cap 2 is bonded and integrated with the electronic component mounting board 1 via a weir member 4 as shown in FIGS. 1 and 3. Fixed with adhesive.
実施例 ２
基材８としてアルミニウム板を使用するととも
に、このアルミニウム板に基板１の形状に合わせ
て基板の側面に嵌合し得る嵌合部３を曲げ加工に
より形成すると同時に中央部に絞り加工を施して
凸部１２を一体に形成した。この基材８に硫酸ア
ルマイト処理を施して、両面に陽極酸化被膜９を
形成した。Example 2 An aluminum plate is used as the base material 8, and a fitting part 3 that can be fitted to the side surface of the board is formed on this aluminum plate by bending according to the shape of the board 1, and at the same time, the center part is drawn. Then, the convex portion 12 was integrally formed. This base material 8 was subjected to sulfuric acid alumite treatment to form an anodic oxide film 9 on both sides.
ついで、この基材８の表面側のみに黒色染料を
塗布して乾燥させた。 Then, a black dye was applied only to the surface side of this base material 8 and dried.
そして、電子部品搭載用基板１との接着面（裏
面）に接着材（接着層５となる）を均一な厚みで
塗布し、乾燥またはＢ−ステージの状態にした。 Then, an adhesive material (to become the adhesive layer 5) was coated with a uniform thickness on the adhesive surface (back surface) with the electronic component mounting substrate 1, and the substrate was dried or brought to a B-stage state.
この電子部品封止用キヤツプ２を第２図及び第
４図に示すように電子部品搭載用基板１に接着固
定した。 This electronic component sealing cap 2 was adhesively fixed to the electronic component mounting substrate 1 as shown in FIGS. 2 and 4.
（考案の効果）
以上詳述したように本考案にあつては、上記実
施例に示した如く、
基板１上に搭載される電子部品を封止するため
のキヤツプ２であつて、
このキヤツプ２の基材８を、その両面に陽極酸
化被膜９を形成したアルミニウム板によつて構成
するとともに、この基材８に、基板１の形状に合
せて、基板１の側面に嵌合しうる嵌合部３を形成
したことに特徴がある。(Effects of the invention) As detailed above, in the present invention, as shown in the above embodiment, the cap 2 is for sealing electronic components mounted on the substrate 1. The base material 8 is made of an aluminum plate with an anodic oxide film 9 formed on both sides thereof, and a fitting that can be fitted to the side surface of the substrate 1 according to the shape of the substrate 1 is provided on the base material 8. The feature is that part 3 is formed.
即ち、本考案に係る電子部品封止用キヤツプ２
にあつては、電子部品搭載用基板１の形状に合せ
て、基板１の側面に嵌合し得る嵌合部３を形成し
たことにより、キヤツプ２で基板１全体を覆う形
の封止構造となり、封止工程でのキヤツプ２の位
置決めが不要となり、封止作業効率を高めること
ができるのである。 That is, the electronic component sealing cap 2 according to the present invention
In this case, by forming the fitting part 3 that can fit on the side surface of the substrate 1 in accordance with the shape of the electronic component mounting substrate 1, a sealing structure is created in which the cap 2 covers the entire substrate 1. This eliminates the need for positioning the cap 2 during the sealing process, thereby increasing sealing efficiency.
また、本考案に係るキヤツプ２によれば、基板
１に対する固定は基材８と一体的に形成した嵌合
部３によつて基板１の側面に嵌合してなされるた
め、当該キヤツプ２は基板にしつかりと固定する
ことができるのである。 Further, according to the cap 2 according to the present invention, the cap 2 is fixed to the substrate 1 by fitting into the side surface of the substrate 1 by the fitting part 3 formed integrally with the base material 8. It can be firmly fixed to the board.
なお、特にキヤツプ２の表面側の陽極酸化被膜
９にのみ着色及び封孔処理を施し、かつこの着色
及び封孔処理が施されていない裏面側の前記陽極
酸化被膜９の一部または全面に有機系樹脂素材か
らなる接着層５を略均一な厚みで形成したキヤツ
プ２においては、キヤツプ２の表面側にあつて
は、着色及び封孔処理されたことにより、外観上
は美観を有し、キズや汚れが付きにくく、耐蝕性
及び耐衝撃性に優れている。また、色調が黒色で
ある場合にあつては、黒体輻射によつて放熱性に
も優れたものとなるのである。 In particular, only the anodic oxide film 9 on the front side of the cap 2 is colored and sealed, and part or all of the anodic oxide film 9 on the back side, which has not been colored and sealed, is coated with organic material. In the cap 2, in which the adhesive layer 5 made of a resin material is formed with a substantially uniform thickness, the surface side of the cap 2 is colored and sealed, so that it has a beautiful appearance and is free from scratches. It is hard to get dirty and has excellent corrosion resistance and impact resistance. Furthermore, when the color tone is black, the heat dissipation property is also excellent due to black body radiation.
さらに、キヤツプ２の裏面側にあつては、陽極
酸化被膜９の素地が生かされたことにより電子部
品搭載用基板１との密着性を保つことができ、し
かも接着層５の保持性をも向上させることができ
て、電子部品搭載用基板１に対する接着固定をよ
り強固かつ耐久性に優れたものとすることができ
たのである。また、このような電子部品封止用キ
ヤツプ２の裏面に接着層５を予め形成したような
ものにあつては、その実際の接着固定の際の作業
性を向上させることができるのである。 Furthermore, on the back side of the cap 2, by making use of the base material of the anodic oxide film 9, it is possible to maintain adhesion with the electronic component mounting board 1, and also improve the retention of the adhesive layer 5. As a result, the adhesive fixation to the electronic component mounting board 1 could be made stronger and more durable. Further, in the case where the adhesive layer 5 is previously formed on the back surface of the electronic component sealing cap 2, the workability during actual adhesive fixing can be improved.
第１図及び第２図は本考案の実施例を示す斜視
図、第３図及び第４図はそれぞれ第１図及び第２
図に対応する断面図、第５図及び第６図は従来の
電子部品封止用キヤツプの断面図、第７図は本考
案の電子部品封止用キヤツプを電子部品搭載用基
板に接着固定した状態を示す拡大断面図である。
符号の説明、１……電子部品搭載用基板、２…
…電子部品封止用キヤツプ、３……嵌合部、４…
…堰部材、５……接着層、６……電子部品、７…
…ボンデイングワイヤー、８……基材、９……陽
極酸化被膜、１０……微細孔、１１……着色物、
１２……凸部。
1 and 2 are perspective views showing an embodiment of the present invention, and FIGS. 3 and 4 are perspective views showing an embodiment of the present invention, respectively.
5 and 6 are cross-sectional views of conventional electronic component sealing caps, and FIG. 7 is a cross-sectional view of the electronic component sealing cap of the present invention adhesively fixed to an electronic component mounting board. It is an enlarged sectional view showing a state. Explanation of symbols, 1...Substrate for mounting electronic components, 2...
...Cap for sealing electronic components, 3... Fitting part, 4...
...Weir member, 5... Adhesive layer, 6... Electronic component, 7...
... bonding wire, 8 ... base material, 9 ... anodized film, 10 ... micropore, 11 ... colored material,
12...Protrusion.
Claims (1)
ヤツプであつて、 このキヤツプの基材を、その両面に陽極酸化被
膜を形成したアルミニウム板によつて構成すると
ともに、基板の側面に嵌合しうる嵌合部を基材と
一体的に形成したことを特徴とする電子部品封止
用キヤツプ。[Scope of Claim for Utility Model Registration] A cap for sealing electronic components mounted on a board, the base material of which is composed of an aluminum plate with an anodized film formed on both sides, and 1. A cap for sealing an electronic component, characterized in that a fitting part that can be fitted to a side surface of a substrate is integrally formed with a base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2081786U JPH0347332Y2 (en) | 1986-02-14 | 1986-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2081786U JPH0347332Y2 (en) | 1986-02-14 | 1986-02-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62134250U JPS62134250U (en) | 1987-08-24 |
| JPH0347332Y2 true JPH0347332Y2 (en) | 1991-10-08 |
Family
ID=30816677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2081786U Expired JPH0347332Y2 (en) | 1986-02-14 | 1986-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0347332Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7233167B2 (en) * | 2018-01-31 | 2023-03-06 | 株式会社ファルテック | vehicle molding |
-
1986
- 1986-02-14 JP JP2081786U patent/JPH0347332Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62134250U (en) | 1987-08-24 |
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