JPH0351304Y2 - - Google Patents

Description

[Detailed description of the invention] A. Purpose of the invention Industrial application field The present invention relates to a powder adhesive-coated molded article that can be used for adhesive sewing, temporary adhesion, and various other types of adhesion of sewn products.

Conventional technology and its problems Conventionally, as an adhesive for sewing, for example,
As disclosed in Publication No. 14431, a tape-like material made of fibers made of hot melt resin is used, but it is difficult to align the fibers on the adhered object, and the slight wind or contact may cause the tape to This has the disadvantage that it takes a lot of effort because it causes misalignment, and furthermore, the sewn product bonded with this tape has a hard texture.

Also, Utility Model Application No. 58-38741 and Utility Model Application No. 58-38741
As disclosed in Publication No. 42124, there is a method of applying hot melt resin powder using a scatterer, but the powder is only scattered and placed on the object to be adhered, and after application, it is not possible to apply the hot melt resin powder to the object to be adhered, such as fabric. There are major drawbacks such as the powder adhesive scattering when moved, and the need for a scatterer also poses problems in terms of cost and handling.

In order to improve the above-mentioned conventional technology, the inventors of the present invention
First, we made a prototype of hot melt resin powder that was pressure molded into a rod shape, but although this product could be applied to objects to be adhered, the molded object itself was prone to crumbling.
It was discovered that the applied powder was also easily scattered.

The inventors of the present invention have carried out studies with the aim of eliminating the drawbacks of these conventional techniques and obtaining a molded object that can be stably coated with powder adhesive simply by rubbing it in a similar manner.

In other words, the purpose of this invention is to create a powder adhesive-coated molded product that can be easily and accurately applied and stably adhered to an object by simply sliding it into contact with the object without using any special tools. This is what we are trying to provide.

B. Structure of the invention The structure of the invention is a molded article that adheres a powder adhesive to an object to be adhered by slidingly contacting the object while causing the sliding contact portion to be removed. A molded article coated with a powder adhesive, characterized in that the body is formed by fusing and integrating 50 to 90 parts by weight of hot melt resin powder with 50 to 10 parts by weight of a binder having a lower melting point than the hot melt resin powder. The gist of this paper is as follows.

Measures to solve the problem We considered forming a molded product by adding a binder to the hot melt resin powder, and added a substance with a melting point lower than that of the hot melt resin powder, such as wax, in an appropriate proportion as the binder. They discovered that if they were mixed together, an extremely excellent adhesive-coated molded article could be obtained.

FIG. 1 is a partially enlarged sectional view of the molded article of the present invention.

As shown in this figure, in the present invention, hot melt resin powder 1 is fused and integrated with a binder 2. Note that 3 in the figure indicates the sky.

The molded product of the present invention is a solid molded product having a fine structure as shown in FIG. 1, and is molded into, for example, a chiyoke or chiako shape.

Hot melt resin powder in the present invention includes, for example, polyethylene resin, polyester resin,
These are powders of polyamide resins, ethylene/vinyl acetate resins, and copolymers of these, and their melting points can be selected appropriately depending on the application. For example, for sewing purposes, powders with melting points of 85 to 150°C are suitable. Preferably, the particle size is preferably 100 μm or less.

If the amount of the hot melt resin powder is less than 50 parts by weight, the adhesive strength will be insufficient, while if the amount exceeds 90 parts by weight, the molded product will be brittle and unsuitable for practical use.

Furthermore, the binder used in the present invention is one having a lower melting point than the above-mentioned hot melt resin powder, preferably one having a melting point lower by 20°C or more, such as paraffin wax, microcrystalline wax, montan wax, Low molecular weight polyethylene and its derivatives, fatty acid esters and modified products thereof, microwax derivatives, fatty acid amides, etc. can be suitably used, and their melting points are 40 to 110.
℃ is preferable.

The reason why the melting point of this binder is lower than that of the hot melt resin powder is to prevent the hot melt resin powder from melting when making a molded object, and also because it melts together with the hot melt resin powder during bonding and exhibits adhesive properties. It is necessary for this purpose.

If the amount of the binder exceeds 50 parts by weight, the hot melt resin powder will be too tightly bound and cannot be applied to the object to be adhered, while if the amount is less than 10 parts by weight, the molded product will become brittle. be.

The method for manufacturing the molded article of the present invention includes, for example, mixing hot melt resin powder and binder powder, further adding other additives such as pigments and talc (lubricant) as necessary, and forming the molded article into a predetermined shape (for example, a rod shape). ) and then heated at a temperature above the melting point of the binder and below the melting point of the hot melt resin powder, only the binder will melt and bind the hot melt resin powders with appropriate strength. be.

It should be noted that the heating conditions are of course selected depending on the type of binder, and the heating conditions are determined based on the "moderate strength" mentioned above.
This indicates a range in which the obtained molded product has a chipping property such that it can be coated by sliding contact with an object to be adhered, and there is no problem in terms of strength as a molded product.

Function The present invention has the above-described configuration, and the powder adhesive can be applied simply by sliding the molded object onto the object to be adhered, that is, by "writing" or "rubbing" it.

FIG. 2 is a schematic perspective view showing how to use the molded article of the present invention.

As shown in this figure, when the molded article a of the present invention is brought into sliding contact with the object s to be adhered as shown by the arrow A, the hot melt resin powder etc. at the sliding contact part will be lost and applied to the object s in a streaky manner. Furthermore, this hot melt resin powder adheres to the object s quite stably due to the adhesive force of the binder.

In other words, even if the object to be adhered is moved after the adhesive has been applied, the adhesive will not scatter.

After applying the hot-melt resin powder in this manner, the other object to be adhered is placed on it and heated under pressure with an iron or the like, thereby achieving the desired adhesion.

Example: 70 parts by weight of copolymerized polyamide powder of nylon 6.6 and nylon 12 with an average particle size of 60μ (melting point 100℃) and paraffin wax powder (melting point 60℃)
30 parts by weight were mixed, molded into a yoke shape using a pressure press, heated at 80°C, and then cooled and solidified.

The obtained molded article could be easily applied as a sewing adhesive by sliding it on fabric, and the adhesive did not scatter and had a good feel after adhesion.

In addition, when the above blending ratio was 95 parts by weight of polyamide powder and 5 parts by weight of wax powder, the molded product itself became brittle and could not be used.

Furthermore, when the above-mentioned mixing ratio was 40 parts by weight of polyamide powder and 60 parts by weight of wax powder, it became impossible to apply the adhesive due to sliding contact.

C. Effects of the invention The present invention is as described above, and it is easy to use and can be applied accurately because the adhesive can be applied little by little by simply sliding it into contact with the object to be adhered. Moreover, since the applied adhesive is stably attached due to the viscosity of the binder, it has the effect of not falling off or scattering.

Moreover, the molded body itself has appropriate strength and is easy to handle.

It goes without saying that the molded article of the present invention can be used to glue and sew sewn products, but it can also be used to make temporary gluing before sewing to make it easier to sew, and it has an excellent texture. Hot-melt bonding can be achieved with an iron or the like simply by sliding contact with various objects to be bonded, and there is no need to use special tools, making it very convenient and at the same time, economically advantageous as it can be manufactured at low cost. It has become a thing.

[Brief explanation of the drawing]

FIG. 1 is a partially enlarged sectional view of the molded article of the present invention. FIG. 2 is a schematic perspective view showing how to use the molded article of the present invention. 1...Hot melt resin powder, 2...Binder,
3...Empty, a...Molded object, s...Subject to be adhered.

Claims (1)

[Scope of utility model registration request] A molded article that adheres a powder adhesive to an object to be adhered by slidingly contacting the object while causing the sliding contact portion to be removed, wherein the molded object is made of 50 to 90 parts by weight of hot melt resin powder. A molded article coated with a powder adhesive, characterized in that it is formed by fusing and integrating the following with 50 to 10 parts by weight of a binder having a lower melting point than the hot melt resin powder.