JPH0351850U - - Google Patents
Info
- Publication number
- JPH0351850U JPH0351850U JP1989112174U JP11217489U JPH0351850U JP H0351850 U JPH0351850 U JP H0351850U JP 1989112174 U JP1989112174 U JP 1989112174U JP 11217489 U JP11217489 U JP 11217489U JP H0351850 U JPH0351850 U JP H0351850U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- package
- tip
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案実施例による半導体装置の斜視
外形図、第２図は実装組立図、第３図、第４図は
第１図の応用実施例の側面図、第５図は従来の半
導体装置の実装組立図である。図において、 １……半導体素子、２……外部リード、２ａ…
…先端部、２ｂ……湾曲成形部、３……パツケー
ジ。
外形図、第２図は実装組立図、第３図、第４図は
第１図の応用実施例の側面図、第５図は従来の半
導体装置の実装組立図である。図において、 １……半導体素子、２……外部リード、２ａ…
…先端部、２ｂ……湾曲成形部、３……パツケー
ジ。
Claims (1)
- パツケージより引出した外部リードを細線に加
工した上で、その先端部との間の中間部位をカー
ル状に湾曲成形したことを特徴とする半導体装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989112174U JPH0351850U (ja) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989112174U JPH0351850U (ja) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351850U true JPH0351850U (ja) | 1991-05-20 |
Family
ID=31660623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989112174U Pending JPH0351850U (ja) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351850U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003024200A (ja) * | 2001-07-17 | 2003-01-28 | Ado:Kk | 装寝具 |
| JP2009119194A (ja) * | 2007-11-19 | 2009-06-04 | Hinomoto Shingu Kk | 袋体およびその製法 |
-
1989
- 1989-09-26 JP JP1989112174U patent/JPH0351850U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003024200A (ja) * | 2001-07-17 | 2003-01-28 | Ado:Kk | 装寝具 |
| JP2009119194A (ja) * | 2007-11-19 | 2009-06-04 | Hinomoto Shingu Kk | 袋体およびその製法 |