JPH0353477A - Socket for flat package ic - Google Patents

Abstract

PURPOSE:To simplify the work of lead terminal position alignment by tilting a loading surface made in a plane of an elastic material so that one corner is lower than the other three corners and providing the loading surface with stoppers for the position alignment between the lead terminal of a flat package IC and a receiving terminal. CONSTITUTION:A rectangular loading surface 12 having a receiving terminal 15 for receiving a lead terminal 72 of a flat package 70 is constituted with an insulation material 16 having elasticity. One corner of the loading surface 12 is made lower than the other three corners so that the surface 12 is tilted. Stoppers 13 are arranged for position alignment between a lead terminal 72 of the flat package 70 and the receiving terminal 15 on the edge of the lowest corner of the loading surface. As a result, the position alignment between the lead terminal 72 and the receiving terminal 15 is made by simply placing the IC on the loading surface 12 as the IC slides down the surface 12. Thus, the work is simplified.

Description

[Detailed Description of the Invention] [Summary] Relating to sockets for mounting ICs (integrated circuits), in particular sockets for Furanotopano cage ICs, work for mounting ICs on socket 1, positioning work for lead terminals, etc. In order to facilitate this, a rectangular mounting surface with equally spaced receiving terminals on which the lead terminals of the flant package IC are placed is configured flat with an elastic insulating material, and one corner of the mounting surface is separated from the other. A stopper is provided which is lower than the triangular corner and has an inclination, and which aligns the lead terminal and receiving terminal of the flat package IC at the lowest corner.

[Industrial application field]

The present invention relates to a socket for mounting an IC (integrated circuit) used when performing measurement tests and acceptance inspections of IC characteristics, and particularly relates to a socket for a flat package IC.

In recent years, with the miniaturization and high-density packaging of devices, the miniaturization of ICs and the use of SMD (surface mount devices) have been remarkable, and the spacing between terminals has become narrower in proportion to the miniaturization of ICs.

[Conventional technology]

FIG. 7 shows a flat pan cage IC 70. In the figure, 71 is a package that protects the Ic, 72
are lead terminals, which are connected to the internal circuit of the IC, protrude from both sides at equal intervals, and have conductivity.

Figure 8 (a) shows the conventional sockent for flat package IC.
). In the figure, 81 is an IC mounting stand. 82 is the lid, 83 is I
C lead terminal holding part, 84 is IC mounting part, 85 is IC
Lead terminal receiving part. 86 is a terminal. IC mounting stand 81
and the lid 82 can be opened and closed, and by closing 182,
The IC lead terminal holding part 83 presses the IC lead terminal 72 mounted on the IC lead terminal receiving part 85, so that the IC can be firmly connected and fixed.

FIG. 8(b) shows an enlarged view of the IC lead terminal receiving portion 85 viewed from the direction of arrow X8 in FIG. 8(a). 87 in the figure is an IC positioning pin, and this IC positioning pin 8
7 is the same as the gap between the glue 1 and the terminal 72 of the flat package IC 70, and by inserting the lead terminal 72 here, the lead terminal 72 of the flat T-pan cage IC 70 is inserted.
All of them are placed exactly on the IC lead terminal receiver 85. Further, the IC lead terminal receiving portion 85 is connected to a terminal 86 protruding from the lower surface of the IC mounting table 8l.

By the way, since the IC mounting portion 84 is a recessed portion, the flat package IC70 is mounted using tweezers.

[Problem to be solved by the invention]

The socket used to perform the above-mentioned IC characteristic measurement tests and reception inspections requires detailed work such as mounting the small IC in the socket and positioning the lead terminals, so the insertion work is troublesome. Requires skill.

SUMMARY OF THE INVENTION An object of the present invention is to provide a socket that allows easy alignment of a J-type terminal when mounting an IC on a socket.

[Means to solve the problem]

The solution according to the present invention for achieving the above object is to cover a rectangular mounting surface 12 having receiving terminals 15 on which lead terminals of a flat pan cage IC are mounted with an elastic insulating material l6, as shown in FIG. Structured flatly, F? One corner of the 5-mounting surface is made lower than the other triangular corners to give an inclination, and a stopper 13 is provided to align the lead terminals of the flat package IC and the receiving terminals 15 at the lowest corner angle. .

[For production]

In the present invention, since the mounting surface of the lead terminal of a flat panocage IC is flat and tilted, the IC can be simply placed on the mounting surface and the IC can be slid on the mounting surface to align the lead terminal and the receiving terminal. is possible, and the work is easy.

〔Example〕

Hereinafter, the present invention will be explained in detail by examples with reference to the drawings.

Figure 1(a). (b) and (c) are views of a first embodiment of the present invention. (a) is a perspective view, (b) and (C) are (a)
) is a top view seen from the direction of arrow X1 perpendicular to the IC mounting surface 12, (b) is before the IC is mounted, and (c) is when the IC 13 is mounted. (a) In the figure,
In the figure, I1 is the socket main body, which is approximately rectangular parallelepiped and has one corner (point A) of the ICJi mounting surface l2 and another triangular corner (point B).
Points C and D), the height from the bottom of the rectangular parallelepiped to point ＼ is a, the height from the bottom of the rectangular parallelepiped to point B is b,
Let C be the height from the bottom of the rectangular parallelepiped to point C, and let d be the height from the bottom of the rectangular parallelepiped to point D. At this time, a. <b≦co
d, and the plane ABCD was rectangular and flat.

12 is the rC mounting surface, and a flanto pan gauge IC70 is mounted on a flexible insulating rubber (for example, silicone rubber) 16.
The metal (
For example, a thin conductive layer that will become the receiving terminal 15 is provided by vapor deposition of gold (Au), so that the flat PC cage IC 70 can slide thereon. 13. 13' is a stopper, and edges are provided on the two adjacent sides AB and AC at point A, and the mounting surface 12 is attached to the mounted flaso L/bunkage IC 10.
The corner of the full package IC 10 can be easily set at point A by sliding the upper part of the IC bungee 7 as shown in the figure (C).
1 (Fig. 7) is the stopper 13 on i22AB.
At this time, the end face portion of the lead terminal row 72 comes into contact with the stopper +3' on the side AC, so that the lead terminals 72 of rC and the receiving terminals 15 can be aligned. 14 is an IC fixing plate, which has a hook shape and is attached to the surface of the side CD of the socket 1 and the wooden body 11. Then, the mounted flannel cage IC 70 is held down from above by the IC fixing plate 14, and the lead terminals 7 of the IC are held down by the elasticity of the mounting plate 12.
2 and the receiving terminal 15 of the socket are securely in contact with each other.

Next, the rc fixing plate 14 will be explained. Figure 2(a)
, (b) is a cross-sectional view of the socket main body I1 of FIG. 1 taken in the vertical direction parallel to the side AC, and (C) is a rear view seen from the direction of arrow X2 in FIG.

The socket main body l1 is provided with a groove that supports the IC fixing plate 14 so as to be movable up and down with the IC fixing plate l4 as a fitting guide. Further, a spring 21 acting downward is attached to the IC fixing plate 14, and is configured to be moved up and down by a knob 522. Also, since it has a hook shape as shown at 23 in (C), by moving the knob 22 to the top of the hook shape as shown in figure (a), the IC mounting surface is opened and the flant package IC70 is installed. By moving the knob 22 to the bottom of the hook shape as shown in FIG.
It can be suppressed by 1.

Figure 3 (a) is a partial perspective view of the knob, and Figure 3 (b) is (
a) It is a cross-sectional view of the figure viewed from the arrow X1 direction. (a) As shown in the figure, the knob 22 is made of a cylinder 22 having a narrow diameter portion 22a in the middle.

131 is fitted into the guide groove of the socket body l1 from the direction of arrow Y3 to close the lower end, forming a cavity in which the knob 22 can be moved up and down. Hook the 2L hook attached to 14.

In this way, the IC fixing plate 14 can be moved up and down using the knob 22.

Figure 4 shows the IC mounted in Figure 1(a), with a metal of 7A attached to l2.
1 is a cross-sectional view of a main part of a conductor layer with a shape of 1. Shallow grooves are provided in a sheet-like flexible insulating rubber 16 at the same intervals as the IC board terminals 72, and a conductor metal is vapor-deposited. 9 terminals 17 are made so that the mounting surface 12 becomes flat when the receiving terminal 15 is produced and the electrical mesolayer is made into a thick film.
is inserted into the socket body 11, and the receiving terminal 15
It is connected to and fixed by soldering 41.

FIG. 5 shows a second embodiment of the present invention, and FIG. 5(a) is a perspective view. (C) As shown in the figure, 17. of the stopper 13 on the side AB side in FIG. This is a diagram of an embodiment in which a stopper 13° is provided, which is lower than the height E from the IC park, cage 71, and lead terminal 72. (b) As shown in the figure, it aligns the first row of terminals of the flant package IC 10 and the terminal receiving terminals 15 on the mounting surface.
The terminals can be aligned regardless of the distance F between the edge of the IC bass cage portion and the first terminal.

FIG. 6 shows a third embodiment of the present invention, in which the I of FIG.
Socket body including C mounting surface 12] 1 with conductive rubber 61
and a non-conductive rubber 62.
The 4th grade is combined to form an ellipse.

〔Effect of the invention〕

As explained in detail above, according to the present invention, detailed work such as mounting an IC and aligning the bins, which was required in the conventional method, becomes easier, and since two sides of the socket are open, the size of the IC can be reduced. Since the IC mounting surface is made of an elastic material, even if the IC is pressed from above, there is no excessive stress on the IC and a reliable connection can be achieved. Furthermore, by making the IC fixing plate movable up and down, the mounting area only needs to be that of the socket itself, and high-density mounting is possible.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention. (a) Perspective view of socket of first embodiment (b) Top view of socket before IC mounting (c) Top view of socket when IC is installed FIG. 2 is an explanatory diagram of the main parts of FIG. 1. (a) Side view of socket in front of IC holder (b) Side view of Sokent when equipped with RC (b) Rear view of socket FIG. 3 is an explanatory diagram of the main parts of the knob in FIG. 1. (a) Partial perspective view of the knob ξ part (b) Cross-sectional view of Mi standing state FIG. 4 is a diagram of conductor vapor deposition. FIG. 5 is a diagram showing a second embodiment of the present invention. (a) Second embodiment socket diagram (b) (C) Figure 6 shows Figure 7 shows Figure 8 shows (a) (b) In the figure, 11 l2 13 l4 15 l6 17 Sokent side view when equipped with rc Front view of Sokent with IC installed FIG. 3 is a diagram showing a third embodiment of the present invention. Flat pack IC diagram. Traditional Sokent diagram. socket diagram Enlarged view of lead terminal receiver :Socket body ;IC mounting surface ：Stotsupa :IC fixing plate :Receiving terminal : Insulating rubber two terminals (b) (C) Head office watch ¥1 Broiled proportional diagram 蔀 2 (α) (!)) ζG) 1 Medication Mature 2 2 Prefecture'1 1'P! Example knob explanation oak Man 3 (2) Lecture {honzen diagram} ￥4 figure 11 (b) Book Zetsuroka Isamu 2 example of strength 2 Male 5 9 The third step of the present invention example figure Father-in-law 4 figure Fufu tsu to pa tsu 7 no Engineering C figure No. Wa figure (1)) subordinate Group tsu to A sad winter 2n 8 Distribution

Claims (1)

[Claims] A rectangular mounting surface (12) having equally spaced receiving terminals (15) on which the lead terminals of a flat package IC are placed is constructed in a planar manner using an elastic insulating material (16), and one corner of the mounting surface is fixed to the other corner. A socket for a flat package IC, characterized in that it is lower than a triangular corner and has an inclination, and is provided with a stopper (13) that aligns the lead terminal and receiving terminal (15) of the flat package IC at the lowest corner.