JPH0353559A - Integrated circuit package - Google Patents

Abstract

PURPOSE:To realize an integrated circuit package of high mounting density by a method wherein the integrated circuit package is provided with a cavity formed like the terminals of a sealed semiconductor integrated circuit and wirings which connect two or more sealed semiconductor circuits fitted into the cavity with each other and external terminals. CONSTITUTION:A hollow package 1 is composed of package inner terminals 2 connected to the input-output terminals of sealed semiconductor circuits which are housed in the cavity of the package 1, external terminals 3, and package inner wirings 4 which connect the sealed semiconductor integrated circuits with each other and the package inner terminals 2 with the external terminals 3. When eight PLCC type static RAMs 6 of 64kbits are inserted through an opening 5 and the input-output terminals of the 64kbit static RAMs 6 are brought into contact with the package inner terminals 2 inside the hollow package 1, the hollow package 1 can be made to serve as a static RAM of 64kX8 bits.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit package, and more particularly to an integrated circuit package in which a plurality of encapsulated semiconductor integrated circuits can be mounted. [Prior Art] Conventionally, when mounting an encapsulated semiconductor integrated circuit on a printed wiring board, two-dimensional arrangement as shown in FIG. 3 or one-dimensional arrangement as shown in FIG. A method is used in which encapsulated semiconductor integrated circuits 24 having external terminals 23 only in one direction are vertically arranged in a three-dimensional manner. However, in response to recent user demands for high-density packaging of semiconductor integrated circuits, the method shown in Figure 3 makes it difficult to achieve higher-density packaging than the current level, while the method shown in Figure 4 does not allow for higher-density packaging. However, since the density of terminals connected to the printed wiring board per unit area increases, mounting becomes difficult, and the encapsulated semiconductor integrated circuit 24, which has terminals only in one direction, is a semiconductor with many input/output terminals. The drawback was that it was not compatible with integrated circuits.

[Problem to be solved by the invention]

In the conventional semiconductor integrated circuit mounting method described above, high-density mounting is difficult in the case of the method shown in FIG. 3 because of the two-dimensional arrangement, and in the case of the method shown in FIG. It is difficult to implement due to the high density of connection terminals, and it also has the disadvantage of not being compatible with semiconductor integrated circuits that have many input/output terminals. An object of the present invention is to provide a semiconductor integrated circuit package that can be relatively easily mounted in three dimensions and that can be easily mounted at high density. [Means for Solving the Problems] The integrated circuit package of the present invention includes a hollow portion having an opening at at least one end into which an encapsulated semiconductor integrated circuit including a molded terminal can be inserted, and an encapsulated semiconductor integrated circuit including a molded terminal inserted into the hollow portion. The package has internal terminals that connect between the terminals of each of the plurality of encapsulated semiconductor integrated circuits and between the terminals and external terminals led out from the hollow portion, and package internal wiring. [Example] Next, an example of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of one embodiment of the present invention. As shown in FIG. 1, the hollow package 1 has package internal terminals 2 and external terminals 3 that are connected to the input/output terminals of the encapsulated semiconductor integrated circuits to be delivered into the hollow part of the hollow package 1, and between the encapsulated semiconductor integrated circuits. and package internal wiring 4 that connects the package internal terminals 2 and external terminals 3.

Figures 2 (a) and (b) show the PL in the hollow package in Figure 1.
It is a perspective view and its circuit diagram when eight CC type 64kbit static RAMs are built-in.

As shown in FIG. 2(a), from the opening 5 in FIG.
Eight CC type 64kbit static RAMs 6 are inserted so that the input/output terminals of the 64kbit static RAMs 6 and the package internal terminals 2 in the hollow package 1 are in contact with each other. At this time, if the package internal wiring 4 is connected as shown in FIG. 2(b), the hollow package 1 shown in FIG. 2(a) can be used as a 64k×8bit static RAM.

In other words, multiple encapsulated semiconductor integrated circuits can be inserted into one hollow package and the terminals and semiconductors can be shared.
By connecting terminals that can be completed between circuits within the hollow package 1 and extracting the minimum necessary signals from the external terminals 3, high-density mounting can be achieved when installed on a printed wiring board. [Effects of the Invention] As explained above, the present invention has a hollow part shaped like a terminal of an encapsulated semiconductor integrated circuit, and connects a plurality of encapsulated semiconductor integrated circuits fitted in the hollow part and external terminals. By creating an integrated circuit package with wiring that allows for three-dimensional placement on a printed wiring board, the density of connection terminals on the printed wiring board can be reduced and high-density mounting can be facilitated. Now.

[Brief explanation of drawings]

Figure 1 is a perspective view of one embodiment of the present invention, Figures 2 (a) and (
b) is a PLCC type 64 in the hollow package shown in Figure 1.
Fig. 3 is a perspective view showing an example of a conventional integrated circuit implementation, and Fig. 4 is a perspective view showing an example of a conventional integrated circuit implementation. It is a perspective view showing an example. DESCRIPTION OF SYMBOLS 1...Hollow package, 2...Package internal terminal, 3.13.23...External terminal, 4...Package internal wiring, 5...Package opening, 6...64k
bit static RAM, 7... power supply terminal, 8...
・GND terminal, 9... Chip select terminal, 10...
・Write enable terminal, 11...Data input and data output terminal, 12...Address input terminal, 14.2
4... Enclosed semiconductor integrated circuit, l5... Inside the package.

Claims (1)

[Claims] a hollow part having an opening at at least one end into which an encapsulated semiconductor integrated circuit including a molded terminal can be inserted; and a space between the terminals of each of the plurality of encapsulated semiconductor integrated circuits inserted into the hollow part; a package internal terminal connecting the terminal and an external terminal led out from the hollow part;
1. An integrated circuit package comprising package internal wiring.