JPH0353850U - - Google Patents
Info
- Publication number
- JPH0353850U JPH0353850U JP1989114509U JP11450989U JPH0353850U JP H0353850 U JPH0353850 U JP H0353850U JP 1989114509 U JP1989114509 U JP 1989114509U JP 11450989 U JP11450989 U JP 11450989U JP H0353850 U JPH0353850 U JP H0353850U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package
- mold
- protrusions
- encapsulated semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図および第２図は、それぞれ本考案の第１
及び第２の実施例において用いられるモールド封
入型半導体装置の斜視図、第３図は従来のモール
ド封入型半導体装置の斜視図である。 図において、１……パツケージ捺印面、２……
突起物。
及び第２の実施例において用いられるモールド封
入型半導体装置の斜視図、第３図は従来のモール
ド封入型半導体装置の斜視図である。 図において、１……パツケージ捺印面、２……
突起物。
Claims (1)
- パツケージ捺印面に突起物を有するモールド封
入型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989114509U JPH0353850U (ja) | 1989-09-29 | 1989-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989114509U JPH0353850U (ja) | 1989-09-29 | 1989-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353850U true JPH0353850U (ja) | 1991-05-24 |
Family
ID=31662874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989114509U Pending JPH0353850U (ja) | 1989-09-29 | 1989-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353850U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109462A (ja) * | 2005-10-12 | 2007-04-26 | Emuden Musen Kogyo Kk | 端子台装置 |
-
1989
- 1989-09-29 JP JP1989114509U patent/JPH0353850U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109462A (ja) * | 2005-10-12 | 2007-04-26 | Emuden Musen Kogyo Kk | 端子台装置 |