JPH01157434U - - Google Patents
Info
- Publication number
- JPH01157434U JPH01157434U JP4756388U JP4756388U JPH01157434U JP H01157434 U JPH01157434 U JP H01157434U JP 4756388 U JP4756388 U JP 4756388U JP 4756388 U JP4756388 U JP 4756388U JP H01157434 U JPH01157434 U JP H01157434U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- sealed semiconductor
- stamp
- embedding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の半導体装置の縦断面図、第
２図は、従来の半導体装置の縦断面図である。 １，４……捺印インク、２，５……半導体装置
、３，６……捺印面。
２図は、従来の半導体装置の縦断面図である。 １，４……捺印インク、２，５……半導体装置
、３，６……捺印面。
Claims (1)
- 樹脂封止型半導体装置の捺印面とは異なる色を
もつ物質を、前記樹脂封止型半導体装置の捺印面
に埋め込むことによつて、捺印を明示したことを
特徴とする樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4756388U JPH01157434U (ja) | 1988-04-08 | 1988-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4756388U JPH01157434U (ja) | 1988-04-08 | 1988-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157434U true JPH01157434U (ja) | 1989-10-30 |
Family
ID=31273764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4756388U Pending JPH01157434U (ja) | 1988-04-08 | 1988-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157434U (ja) |
-
1988
- 1988-04-08 JP JP4756388U patent/JPH01157434U/ja active Pending