JPH0355871A - Integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to integrated circuits such as large-scale integrated circuits.

[Conventional technology]

Conventional large-scale integrated circuits of this type. @ Shown in Figure 3. The figure shown is a wafer that is the basis of a semiconductor substrate. 《1》 is a large-scale integrated circuit. (2) ~《The ship is the large-scale integrated circuit mentioned above《
1) Built-in. Circuit A to achieve the desired function
-C. Also. am is the cutting part. @． (to) is a test circuit that measures performance variations such as speed of integrated circuits.

For example, divide it into three large parts. Each circuit A (21, circuit B
(3) , Realize the partial function with circuit C《4》, and then connect the wiring between these circuits A(2) to C《4》. A case in which the desired function is realized will be explained.

First, when realizing circuit ^(2). Configure transistors at predetermined locations. Next, depending on the wiring pattern. Connect these transistors. It constitutes logic elements such as inverter elements, NAND elements, and registers.

next. between these logic elements. Connect using the wiring pattern. Realize partial functionality. Similarly. Circuit B (3)
．． Realizes the partial function of circuit C(4). next. These circuits A (1). Circuit B (2). By making a D connection between the circuits C (3) using a wiring pattern, a large-scale integrated circuit that realizes the desired function can be obtained.

Next, the measurement of performance discrepancies will be explained. Test circuit (
To). (to) is. Hold the monitor pad>D.
Will the probe pin from the measuring device be hit? It has become. Test results. If the specified performance is not met. Integrated circuits from that wafer or that lot. removed from the product. The test circuit (own) is. Wafer cutting part QD
Since it is made on top, it will be destroyed after cutting. Ota. The test circuit (to) is originally. It is made using the partial metal from which integrated circuits are made.

[Problem to be solved by the invention]

Conventional integrated circuits are realized as described above, so if you want to change some of the desired functions. First, add a transistor. There are no seven lines deleted. Rearrange. Connecting metal between connected logic elements between transistors. A connection must be made between circuits A and C. All manufacturing process costs must be changed and implemented. Also. This is done by rearranging the transistors.
The shape of circuits A to C changes. It is necessary to increase or decrease each wiring pattern. There is a drawback in that physical layout and wiring checks and electrical performance/timing checks for all parts included in the integrated circuit must be re-performed.

Also. Regarding the test circuit. The drawback was that there was no means to measure the performance of individual integrated circuits after cutting.

This invention... This was done to solve the problems mentioned above. Just change the wiring pattern connection. easily.
and. Functions can be changed without changing most physical/electrical conditions. Furthermore, it is an object of the present invention to obtain an integrated circuit whose performance variations can be measured even after cutting.

[Means to solve the problem]

The integrated circuit according to this invention is. An additional circuit consisting of logic elements for changing functions is built in in advance in the empty area. This additional circuit can be connected as desired, and it is also possible to measure performance variations in integrated circuits using this additional circuit.

[Effect]

Regarding this invention. By connecting additional circuits with arbitrary wiring patterns, it is possible to easily change the function of the integrated circuit. It is also recommended to include a monitor pad etc. in the additional circuit. This makes it possible to measure performance variations of the integrated circuit.

〔Example〕

below. An embodiment of the present invention will be described with reference to the drawings.

Figure 1 is. It is a block diagram showing a large-scale integrated circuit according to the present invention. The same reference numerals are used for the same or corresponding parts as in FIG. 3, and the explanation thereof will be omitted.

In the diagram. {I) is a large-scale integrated circuit. {2}～{4}
divides the functions targeted by large-scale integrated circuits (1). The circuits A-C, (5) to (7), which have real partial functions, are inverter elements, NAND *children, etc. This is an additional circuit consisting of logic elements such as registers.

Figure 2(a) is. It is a block diagram showing a specific example of the configuration of the additional circuits (5) to <<7>>. an.aa indicates an inverter element, and a3 and Q- indicate a NAND element.

Next, the operation will be explained.

Change the partial function of circuit A《2》. A case will be described in which the intended function of a large-scale integrated circuit is changed.

Kazu. When adding an inpart function to the function of one logic element in circuit A (2). @Route A (Connect the output terminal of the above logic element of 21 and the input terminal of the inverter element +111 built in the nearest additional circuit (5) with a wiring pattern. Next, connect the inverter and the input terminal of the inverter element 0υ The output terminal and the logic element adding the invert function in the circuit A(2) are connected to the input terminal of the logic element, which was not connected conventionally, by a wiring pattern.

Next, Figure 2(b) shows. b. is a block diagram showing an example of using the additional circuit as a test circuit; h is a monitor pad. Monitor pads are provided at the input/output terminals of inperter element 0 and NAND element αj.

This monitor pad (goods) is. A probe pin from a measuring instrument is applied to measure the performance variations of this integrated circuit, and through this monitor pad it is possible to check whether the integrated circuit satisfies the intended specifications.

If you do it like this. Conventional. After cutting, as shown in the inspection circuit @ on the cutting section 61) of the wafer ■. No test circuit is lost. Also. Like the test circuit @. This eliminates the drawback of using useful parts for testing that could otherwise be used to create integrated circuits. It is now possible to measure the performance of each integrated circuit even after the casing and disconnection.

As mentioned above, this example. Regarding large-scale integrated circuits. In addition to circuits to achieve the desired function. By incorporating an additional circuit consisting of logic elements whose functions can be changed, even if there is a defect in the circuit to realize the intended function. Large-scale integrated circuits can be easily rebuilt using only the manufacturing process of wiring connections between the logic elements of the additional circuits mentioned above and the circuits that achieve the intended functions. Furthermore. This figure shows a large-scale integrated circuit characterized by being able to measure performance variations of the large-scale integrated circuit.

inside. In the above example. I explained the case where there are three additional circuits. Any number would be possible. Also, the built-in functions are explained about the inverter element and NAND element, but the register x
The same is possible for other elements and circuits such as memory, RAM, ROM, and PLO.

Also. In the above example. When using the additional circuit as a test circuit. I explained about inverter elements and NAND elements. It is also possible to use other elements or circuits that combine these elements.

Also. In the above example. When using the additional circuit as a test circuit, we have shown an example of how it can be measured using a monitor panel. It may also be possible to connect to a pin protruding from the panocage of the integrated circuit for measurement.

Ota. The additional circuit is. When used to change the function of the collection tR@road. Both or when used for performance measurement. It may be used for either one.

〔Effect of the invention〕

As described above, according to this invention. Since additional circuits are pre-built into the free space, when changing functions, there is no change in the integrated circuit's physical characteristics (size) or electrical characteristics (performance/timing). Additionally, changes can only be made in the wiring process, which is the final manufacturing process. It is possible to significantly reduce the period/cost.

or. Let's measure the inverter elements of this additional circuit with a tester. Performance variations in integrated circuits can be easily measured. or. By standardizing this additional circuit.
It is possible to easily measure performance variations across integrated circuits with different functions. Quality control of the production line becomes possible easily.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing one embodiment of this invention. FIG. 2 is a block diagram showing an embodiment of the additional circuit of the present invention. FIG. 3 is a block diagram showing a conventional large-scale integrated circuit. In the figure. (1) is a large-scale integrated circuit. 《2》～(4)
are circuits A to C, (51 to (7) are additional circuits.
an. (h2 Heinharter element. α3. α- is NA
ND element. ω is the wafer (C) is the cutting part, (O). ? !
3 is a test circuit. inside. The same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] An integrated circuit having the following elements on a semiconductor substrate: (a) an integrated circuit section having a predetermined function in which a plurality of logic elements are arranged and wired; Additional circuit section consisting of logic elements.