JPH0357258A - Resin-molded electronic component - Google Patents

Abstract

PURPOSE:To prevent conductive patterns from deforming therebetween by forming the pattern on an insulating film, and so correcting the film that at least the connecting part between the pattern and the film becomes flat. CONSTITUTION:A rectangular flexible insulating film 6 has a region 6a on which an electronic component 7 is mounted at its center. Conductive patterns 8 extending at the intermediate parts and the other end parts in parallel from the vicinity of the region 6a are laminated on the film 6. The patterns 8 are connected to electrodes of electronic component body 7 via wirings 9, and the body 7 on the film 6 exposed at the parallel parts of the patterns 8 is covered with resin 10. The patterns 8 exposed from the resin 10 are bent at parts 6b to be bent. The patterns 8 are prevented from being deformed therebetween merely by so correcting the film 6 that the connecting parts 8 to the film 6 become flat. Thus, even if an outer force is applied to the film 6, an interval between the patterns 8 becomes constant.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to resin molded electronic components, and particularly to the structure of electronic components with leads.

FIG. 7 shows an example of a semiconductor device, which is one of the resin molded electronic components. In the figure, 1 is an island on which a semiconductor pellet (electronic component main body) 2 is mounted; 3 is an island with one end disposed near the semiconductor pellet 2;
A set of multiple leads whose other ends are arranged in parallel, 4 is a wire that electrically connects the electrode (no code) on the semiconductor pellet 2 and the lead 3, 6 is the semiconductor beresoto 2
shows the resin that coats the base of the lead 3. Note that 1a indicates hanging pins extending from both ends of the island 1. This semiconductor device is manufactured using a lead frame in which leads 3 and islands 1 are integrated, and after coating with resin, unnecessary portions of the lead frame are cut and removed and separated into individual semiconductor devices. This semiconductor device is used by bending and forming the leads 3 as necessary.

By the way, in the semiconductor device shown in FIG. 7, when the connecting portion 3a (shaded area in the figure) that connects the leads 3 of the lead frame is cut and removed, torsional stress is applied to the leads 3, the leads are torsionally deformed, and the lead spacing is reduced. Sometimes it was uneven. Furthermore, when the leads are bent and formed, there is a problem in that the lead spacing becomes noticeably uneven, making mounting on a printed wiring board difficult. Also, when handling lead 3
Another problem was that it easily bent when external force was applied to it.

The present invention in ゜ 5 was proposed with the aim of solving the above-mentioned problem, and includes mounting a component body on an insulating film having a conductive pattern portion, electrically connecting electrodes of the component body to the pattern, and discharging the component body. To provide a resin molded electronic component characterized in that a main body is coated with a resin and a conductive pattern portion exposed from the resin is bent.

According to the present invention, since the leads are formed on the film in a mutually insulated state, there is no need to cut between the leads, and there is no need to worry about the lead spacing becoming uneven even if an external force is applied. do not have.

resting place An embodiment of the present invention will be described below with reference to FIG.

In the figure, reference numeral 6 denotes a rectangular flexible insulating film, which has a region 6a in the center for mounting an electronic component main body (for example, a semiconductor device) 7, and extends from the vicinity of this region 6a to the middle part or the other end. conductive patterns 8 extending in parallel are laminated. Reference numeral 9 indicates a wire that electrically connects the electrodes of the electronic component body 7 and the conductive pattern 8, and 10 indicates a resin that covers the electronic component body 7 on the insulating film 6 with the parallel portions of the conductive pattern 8 exposed. 8b indicates a portion of the insulating film 6 to be bent.

In this electronic component, the exposed part of the conductive pattern 8 which becomes the external lead is formed on the flexible insulating film 6, so the film 6 is bent and inserted into the hole ILa of the printed wiring board 11 as shown in FIG. By inserting it, the conductive pattern 8 and the conductive pattern 1lb of the printed wiring board 12 can be connected by solder 12.

Since the conductive patterns 8 serving as leads are formed on the insulating film 6 in this way, the conductive patterns 8, 8, ... can prevent torsional deformation between the conductive patterns 8, 8 . . . even if an external force is applied to the insulating film 6. The interval between ... is constant.

FIG. 3 shows another embodiment of the invention. In the figure, the same reference numerals as in FIG. 1 indicate the same parts, and the explanation will be omitted. What is different in the figure is that the widths Wl and W2 of the front and back surfaces of the resin 10 with respect to the insulating film 6 are different, and cuts tabs are made at both ends of the narrow resin portion 10a to reduce the diameter toward the outer wall. The only difference is that iob is provided.

This electronic component is made by bending the exposed base of the insulating film 6 at a substantially right angle, and forming protrusions 1 on the inner periphery that fit into the notches 10b, 10b.
2 al l 2 a are fitted together as shown in FIG. 4.

As a result, this electronic component has the same effect as the electronic component shown in FIG. 1, and furthermore, the conductive pattern 8, which becomes the external lead, can be made independent.

The embodiment shown in FIG. 3 can be modified as shown in FIG. That is, a notch recess 10 is formed in the lead-out portion of the resin insulating film 6.
By using a frame body that has a notch 6c extending from the outer periphery of the insulating film 6 to the step of the recess 10c, and a protrusion that enters the recess 10c on the inner periphery of the frame 12 in FIG. The arrangement pitch of the conductive patterns can be changed, and by making the arrangement pitch asymmetrical, it can also serve as a polarity display.

In addition, in all of the embodiments shown in FIGS. 1, 3, and 5, the adhesion between the insulating film 6 and the resin 10 can be improved by providing a through hole in the portion of the insulating film 6 that is covered with the resin 10. Furthermore, by forming a through hole in a portion spanning the resin 10 between the conductive patterns 8, 8 of the insulating film 6, in addition to improving the adhesion of the resin 10, the bending property of the insulating film 6 is improved. can be improved.

Further, direct electrical connection is possible by providing conductive protrusions on the electrodes of the electronic component main body 7 or on the inner ends of the conductive patterns 8.

Furthermore, by placing the insulating film 6 along the main surface of the resin 10 and arranging both ends in parallel, the mounting area can be reduced. In the figure, l3 is a screw that is inserted into a hole (not shown) opened in the resin 10 and fixes the insulating film 6 to the resin 10. An adhesive can also be used as long as it fixes the insulating film 6.

As described above, according to the present invention, it is only necessary to cut the outline of the insulating film after resin molding, there is no need to cut between the leads, and even if the insulating film is deformed, it can be easily corrected. The spacing between the conductive patterns is also constant.

Furthermore, a set of multiple conductive patterns can be inserted into holes in a printed wiring board at once, making mounting easy.

FIG. 1 is a perspective plan view showing a first embodiment of the present invention, FIG. 2 is a side sectional view showing a mounting state of the electronic components shown in FIG. 1, and FIG. 3 is a perspective view showing a second embodiment of the present invention. 4 is a side sectional view of the electronic component shown in FIG. 3, FIGS. 5 and 6 are perspective views showing other embodiments, and FIG. 7 is a perspective plan view showing a conventional electronic component. It is.

6... Insulating film, 6a...Mount area, 7...Electronic component body, 8... Conductive pattern, 10...Resin.

Claims (1)

[Claims] The component body is mounted on an insulating film having a conductive pattern, the electrodes of the component body are electrically connected to the pattern, the component body is coated with a resin, and the conductive pattern exposed from the resin is bent. Characteristic resin molded electronic parts.