JPH0357621B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to positioning technology, particularly to a technology that is effective when applied to bonding technology for attaching pellets to a mounting substrate such as a lead frame.

[Background Art] As a pellet bonding apparatus for attaching a semiconductor pellet to a substrate to be attached such as a lead frame, a structure as shown in FIGS. 1a and 1b can be considered.

When exchanging the pellet jig in this pellet bonding apparatus, the XY table 1 moves to the pellet jig exchange position, and when it stops, the shaft 2 moves and comes into contact with the ball bearing 3. When the shaft 2 moves further than the contact point, the positioning pin 4 is moved by the link mechanism.
descends. Further, the jig pusher 5 is moved in the same direction by the same drive system 6 as the shaft 2, and the pellet jig 7 is stored in the XY table 1 on which the positioning pin 4 is lowered. After storing the pellet jig 7, the jig pusher 5 and the shaft 2 move in opposite directions, and the positioning pin 4 finishes rising when the shaft 2 leaves the ball bearing 3.
At this point, the pellet positioning when replacing the pellet jig is completed and the XY table 1 begins to move to the pellet bonding position, even though the pellet jig 7 has already been stored in the XY table 1. While the shaft 2 is in contact with the ball bearing 3, the positioning pin 4 of the pellet jig 7 is not raised, so the positioning is not completed, and the XY table 1 cannot be moved, which reduces the jig replacement time. The inventor has discovered that there are problems such as a longer time and poor work efficiency.

[Object of the Invention] An object of the present invention is to provide a positioning technique that can efficiently replace a storage jig for a bonded object in a short time.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

That is, after horizontally moving the XY table on which the storage jig containing the object to be bonded is placed and positioned at a predetermined portion thereof by a positioning device to a desired position, the object to be bonded is placed on the object to be bonded. In the bonding device that performs bonding, the positioning device includes a support shaft connected to the lower part of the XY table, a link bar that is swingably supported by the support shaft, and a positioning device that is connected to the support shaft of the link bar. a positioning means connected to one end and capable of reciprocating movement for positioning the storage jig at a predetermined portion of the XY table while penetrating the XY table; and a contact member provided on the other hand with respect to the spindle of the link bar. and a fixed contact block having an inclined surface with which the contact member moves while contacting the link bar, which is supported by the XY table as the XY table moves horizontally. The contact member moves up and down by moving in contact with the inclined surface of the contact block, and the movement of the positioning means and the movement of the contact member of the link bar are relative to each other by the support shaft. When the contact member of the link bar moves to the lower part of the inclined surface of the contact block, the positioning means penetrates the XY table and the storage jig is positioned. It is characterized by being equipped with a positioning device.

Embodiment 1 FIG. 2 is a schematic explanatory diagram of a bonding apparatus which is an embodiment of the present invention, and FIGS. 3a and 3b are a perspective view and a side view, respectively, of an embodiment of the positioning block.

In this first embodiment, the bonding apparatus is used for bonding semiconductor pellets, and parts corresponding to those of the apparatus shown in FIG. 1 are designated by the same reference numerals and redundant explanation will be omitted.

In this pellet bonding apparatus, semiconductor pellets (not shown), which are objects to be bonded, are stored in a pellet jig 7 (storage jig) that is placed and positioned on an XY table 1.

This pellet jig 7 is attached to the XY table 1 by vertically extending positioning pins 4 (positioning means).
positioned above. The lower end of this positioning pin 4 is connected to a long hole 1 formed in the link bar 9 of the link mechanism 8.
0 through a pin 11. Link bar 9 is attached to mounting block 13 by pin 12
The mounting block 13 is connected to the XY table 1 and can move therewith in the XY directions. Further, a contact pin 14 (contact member) for positioning is fixed to the lower surface of one end of the link bar 9 (the left end in FIG. 2).

As the XY table 1 moves in the XY direction, this contact pin 14 moves against the slope 16 of the contact block 15.
The vertical movement of the contact pin 14 at the time of sliding causes the link bar 9 to rotate around the pin 12, and the positioning pin 4
It moves up and down.

That is, for example, when the contact pin 14 does not ride on the inclined surface 16 of the contact block 15, or when it rides on it but is still in a low position, the right end of the link bar 9 (as viewed in FIG. 2) does not move the pin 12. The positioning pin 4 rotates counterclockwise around the center and is at a relatively high position, and the positioning pin 4 rises above the pellet jig 7 as shown by the two-dot chain line 4a in FIG. I do. On the other hand, when the contact pin 14 slides to a relatively high position on the inclined surface 16, the right end of the link bar 9
Rotate clockwise around positioning pin 4.
is lowered to a position where the tip thereof is lower than the lower surface of the pellet jig 7. Thereby, the pellet jig 7 can be moved on the XY table 1 by the drive system 6 via the jig pusher 5.

Therefore, the contact block 15 of this embodiment has a substantially fan-shaped shape when viewed from the top, and when the contact pin 14 moves in either the X or Y directions of the It is now possible to easily climb onto the ground.

Next, the operation of this embodiment will be explained.

When exchanging the pellet jig 7 in the bonding apparatus of this embodiment, first, the positioning pins 4 are brought into a state where the lowering is completed when the XY table 1 moves to the pellet jig exchange position and stops. While moving the XY table 1 to the pellet jig exchange position, the contact pin 14 is brought into contact with the inclined surface 16 of the contact block 15 and slid;
The positioning pin 4 is lowered by the link mechanism 8. Next, the jig pusher 5 is moved by the drive system 6, the pellet jig 7 is stored in the XY table 1, the pellet jig is exchanged, and the XY table 1 is moved immediately after the storage exchange. Then, the positioning pin 4 is raised to perform positioning.

Therefore, according to this embodiment, the pellet jig can be positioned immediately after replacing the pellet jig, so that the time for replacing the pellet jig can be shortened, and the number of man-hours during pellet bonding can be reduced.

Embodiment 2 FIGS. 4a and 4b are a perspective view and a side view, respectively, of another embodiment of a contact block that can be used in the present invention.

In this embodiment, the contact block 15a has the shape of a sector in plan view and a right triangle in side view, with an inclined surface 16 on which the contact pin 14 slides.
It has a.

In this case as well, the contact pin 14 can ride on the inclined surface 16a from any direction in the XY direction, and the pellet jig 7 can be positioned immediately after replacing the pellet jig, reducing the time required for replacing the pellet jig. is possible.

Embodiment 3 FIGS. 5a and 5b are a perspective view and a side view, respectively, of still another embodiment of a contact block that can be used in the present invention.

In this embodiment, the inclined surface 16b of the contact block 15b has an approximately fan-shaped or approximately triangular shape when viewed from a plan view, and the central side of the inclined surface has a slightly arcuate curved shape. There is.

Due to this curved shape, the contact pin 14 has an inclined surface 1
6b can be more easily climbed on from any direction in the XY direction.

[Effects] (1) By being able to position the storage jig immediately after replacing it, the time required to replace the storage jig can be shortened and work efficiency can be improved.

(2) Since the contact member can contact the inclined surface of the contact block from any direction in the X and Y directions and can move along the inclined surface, the storage jig can be positioned more easily and in a shorter time. be able to.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples described above, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say.

For example, as the contact member, a contact ball bearing or the like can be used in addition to the contact pin. Further, the structure of the contact block can be modified in various ways, such as making it square in plan view.

[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to pellet positioning of a bonding device, which is the background field of application, but the present invention is not limited to this. For example, it can be widely applied to bonding techniques for other small items.

[Brief explanation of drawings]

Figures 1a and b are schematic explanatory diagrams showing the raised and lowered states of the positioning pin of a pellet bonding device devised by the present inventor, respectively, and Figure 2 is a bonding device that is an embodiment of the present invention. FIGS. 3a and 3b are a perspective view and a side view of one embodiment of each contact block, and FIGS. 4a and 4b are a perspective view and a side view of another embodiment of the contact block, respectively. Figures 5a and 5b are a perspective view and a side view, respectively, showing still another embodiment of the contact block. 1...XY table, 2...axis, 3...ball bearing, 4, 4a...positioning pin (positioning means),
5... Jig pusher, 6... Drive system, 7... Pellet jig (storage jig), 8... Link mechanism, 9
...link bar, 10...long hole, 11...pin,
12...Pin, 13...Mounting block, 14
...Contact pin, (contact member), 15, 15a, 15
b...Contact block, 16, 16a, 16b...
Slope.

Claims (1)

[Scope of Claims] 1. After horizontally moving an XY table on which a storage jig containing an object to be bonded is placed and positioned at a predetermined portion thereof by a positioning device to a desired position, In the bonding apparatus for bonding the object to be bonded, the positioning device includes a support shaft connected to the lower part of the XY table, a link bar swingably supported by the support shaft, and a link bar that is swingably supported by the support shaft. a positioning means connected to one side to the support shaft and capable of reciprocating movement for positioning the storage jig at a predetermined portion of the XY table while passing through the XY table; and the other side to the support shaft of the link bar. and a contact block that is fixed and has an inclined surface that the contact member moves while being in contact with, and is supported by the XY table as the XY table moves horizontally. The contact member of the link bar that is attached to the contact block moves up and down by moving in contact with the inclined surface of the contact block, and the operation of the positioning means and the contact member of the link bar are related to the support shaft. When the contact member of the link bar moves to the lower part of the inclined surface of the contact block, the positioning means penetrates the XY table and moves the storage jig. 1. A bonding device comprising a positioning device for positioning. 2. The bonding apparatus according to claim 1, wherein the contact member is capable of contacting the inclined surface from any direction in the XY direction and operating along the inclined surface. 3. The bonding apparatus according to claim 1 or 2, wherein the inclined surface has a substantially fan-shaped planar shape.