JPH0359653U - - Google Patents

Info

Publication number
JPH0359653U
JPH0359653U JP1989121502U JP12150289U JPH0359653U JP H0359653 U JPH0359653 U JP H0359653U JP 1989121502 U JP1989121502 U JP 1989121502U JP 12150289 U JP12150289 U JP 12150289U JP H0359653 U JPH0359653 U JP H0359653U
Authority
JP
Japan
Prior art keywords
emitting diode
lead
light
sealed
transparent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989121502U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989121502U priority Critical patent/JPH0359653U/ja
Publication of JPH0359653U publication Critical patent/JPH0359653U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図は本考案の一実施例を説明する断面図、
第２図は本考案の第２の実施例を説明する断面図
であり、第３図は従来の例を示す断面図である。 １……カソードリード、２……アノードリード
、３……ペレツト、４……ボンデイングワイヤ、
５……不透明樹脂、６……透明樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. １つのリードの端部に発光ダイオードペレツト
    がマウントされ、発光ダイオードペレツトから他
    のリードヘボンデイングワイヤが接続され、これ
    らをドーム形の透明樹脂で封入して成る発光ダイ
    オードにおいて、前記透明樹脂に接してリードの
    付け根部分が不透明樹脂で封入されていることを
    特徴とする発光ダイオード。
JP1989121502U 1989-10-16 1989-10-16 Pending JPH0359653U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989121502U JPH0359653U (ja) 1989-10-16 1989-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989121502U JPH0359653U (ja) 1989-10-16 1989-10-16

Publications (1)

Publication Number Publication Date
JPH0359653U true JPH0359653U (ja) 1991-06-12

Family

ID=31669536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989121502U Pending JPH0359653U (ja) 1989-10-16 1989-10-16

Country Status (1)

Country Link
JP (1) JPH0359653U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006273268A (ja) * 2005-03-30 2006-10-12 Railway Technical Res Inst 車両用吊り手

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006273268A (ja) * 2005-03-30 2006-10-12 Railway Technical Res Inst 車両用吊り手

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