JPH0385669U - - Google Patents

Info

Publication number
JPH0385669U
JPH0385669U JP1989147630U JP14763089U JPH0385669U JP H0385669 U JPH0385669 U JP H0385669U JP 1989147630 U JP1989147630 U JP 1989147630U JP 14763089 U JP14763089 U JP 14763089U JP H0385669 U JPH0385669 U JP H0385669U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
view
sectional
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989147630U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989147630U priority Critical patent/JPH0385669U/ja
Publication of JPH0385669U publication Critical patent/JPH0385669U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図は本願考案に係る発光ダイオードの縦断
面図、第２図は第１図の平面的断面図、第３図は
他の実施例の縦断面図、第４図は第１図における
発光の軌跡を示す縦断面図、第５図は第３図にお
ける発光の軌跡を示す縦断面図、第６図は従来の
発光ダイオードの縦断面図、第７図は第６図の平
面断面図を示している。第８図は従来の発光ダイ
オードの縦断面図、第９図は従来の発光ダイオー
ドの縦断面図、第１０図は第８図の発光ダイオー
ドにおける発光の軌跡を示す図面、第１１図は第
９図の発光ダイオードにおける発光の軌跡を示す
図面、第１２図は本願考案の場合における基本的
光学的等価図、第１３図は従来技術における基本
的光学的等価図である。 １……ＬＥＤチツプ、２……導電性接着材、３
……リードピン、４……導線、５……封止材、６
……インナーレンズ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 封止材の屈折率とは異なる屈折率を有するイン
    ナーレンズを１枚または複数枚ＬＥＤチツプの近
    傍の位置に封止してあることを特徴とするインナ
    ーレンズ付き発光ダイオード。
JP1989147630U 1989-12-21 1989-12-21 Pending JPH0385669U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147630U JPH0385669U (ja) 1989-12-21 1989-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147630U JPH0385669U (ja) 1989-12-21 1989-12-21

Publications (1)

Publication Number Publication Date
JPH0385669U true JPH0385669U (ja) 1991-08-29

Family

ID=31694135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147630U Pending JPH0385669U (ja) 1989-12-21 1989-12-21

Country Status (1)

Country Link
JP (1) JPH0385669U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116194A (ja) * 1995-10-17 1997-05-02 Alps Electric Co Ltd 発光ダイオード装置
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225583A (ja) * 1983-06-06 1984-12-18 Mitsubishi Electric Corp 半導体発光装置
JPS6222491A (ja) * 1985-07-23 1987-01-30 Toshiba Corp 半導体発光装置
JPS6482681A (en) * 1987-09-25 1989-03-28 Stanley Electric Co Ltd Compound lens type photodetector/light emitting element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225583A (ja) * 1983-06-06 1984-12-18 Mitsubishi Electric Corp 半導体発光装置
JPS6222491A (ja) * 1985-07-23 1987-01-30 Toshiba Corp 半導体発光装置
JPS6482681A (en) * 1987-09-25 1989-03-28 Stanley Electric Co Ltd Compound lens type photodetector/light emitting element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116194A (ja) * 1995-10-17 1997-05-02 Alps Electric Co Ltd 発光ダイオード装置
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード

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