JPH0360052A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPH0360052A
JPH0360052A JP19552489A JP19552489A JPH0360052A JP H0360052 A JPH0360052 A JP H0360052A JP 19552489 A JP19552489 A JP 19552489A JP 19552489 A JP19552489 A JP 19552489A JP H0360052 A JPH0360052 A JP H0360052A
Authority
JP
Japan
Prior art keywords
circuit
external
integrated circuit
input
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19552489A
Other languages
Japanese (ja)
Inventor
Naoki Kudo
工藤 直己
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC IC Microcomputer Systems Co Ltd
Original Assignee
NEC IC Microcomputer Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC IC Microcomputer Systems Co Ltd filed Critical NEC IC Microcomputer Systems Co Ltd
Priority to JP19552489A priority Critical patent/JPH0360052A/en
Publication of JPH0360052A publication Critical patent/JPH0360052A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Element Separation (AREA)

Abstract

PURPOSE:To enable the measurement of a latch-up resisting amount to be carried out at all potential states of all external output terminals by controlling a switching circuit with a signal from a second external input circuit and interrupting an output signal from an internal integrated circuit to be input to an externally outputting buffer circuit and inputting a signal from a first input circuit to the externally outputting buffer circuit. CONSTITUTION:An input terminal 2 of an externally outputting buffer circuit 1, an output terminal 4 of an external input circuit 3 and an output terminal 6 of an internal integrated circuit 5 are connected via switching circuits 9, 8 respectively, and control terminals 10, 11, 12, 13 of the switching circuits 8, 9 are connected to output terminals 15, 16 of an external input circuit 14. Output signals of the internal integrated circuit 5 and the external input circuit 3 to be input to the externally outputting buffer circuit 1 can be switched to either one of them by a signal from the external input circuit 14. Thus, the measurement of a latch-up resisting amount can be carried out at both of H and L potential states of all external output terminals.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体集積回路装置に係り、特にラッチアップ
耐量測定の容易な半導体集積回路装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and more particularly to a semiconductor integrated circuit device whose latch-up tolerance can be easily measured.

〔従来の技術〕[Conventional technology]

従来の半導体集積回路装置は、第2図にその一部を示す
ように、外部出力用バッファ回路200入力端子21.
及び外部入力用バッファ回路22の出力端子23は、内
部集積回路24の出力端子25、及び入力端子26とそ
れぞれ接続されており、外部出力用バ、ファ回路20へ
の入力信号は内部集積回路24からの信号のみであった
As part of the conventional semiconductor integrated circuit device is shown in FIG. 2, an external output buffer circuit 200 input terminal 21.
The output terminal 23 of the external input buffer circuit 22 is connected to the output terminal 25 and the input terminal 26 of the internal integrated circuit 24, respectively, and the input signal to the external output buffer circuit 20 is connected to the internal integrated circuit 24. There was only a signal from

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

前述した従来の半導体集積回路装置は、外部出力用バッ
ファ回路20への入力信号が、内部集積回路24からの
信号のみであるため、ラッチアップ耐量測定を行なう際
の外部出力端子25の電位はその時点での内部集積回路
25の状態によって決まる。このため、任意にHレベル
またはLレベルとなっており、測定対象端子の電位をH
レベルまたはLレベルに設定するためには、電源の投入
、切断をくり返し、内部集積回路24の状態変化を待っ
て測定を行なったり、測定時に任意に決定している外部
出力端子の電位状態のまま測定を行なう等、全外部出力
端子の全電位状態についてのラッチアップ耐量測定が行
なえないという欠点がある。
In the conventional semiconductor integrated circuit device described above, the input signal to the external output buffer circuit 20 is only the signal from the internal integrated circuit 24, so the potential of the external output terminal 25 when performing latch-up tolerance measurement is It depends on the state of the internal integrated circuit 25 at the time. Therefore, it is arbitrarily set to H level or L level, and the potential of the terminal to be measured is set to H level.
In order to set the level or L level, the power can be turned on and off repeatedly, waiting for the state of the internal integrated circuit 24 to change before taking the measurement, or the potential state of the external output terminal arbitrarily determined at the time of measurement may be maintained. There is a drawback that latch-up tolerance cannot be measured for all potential states of all external output terminals.

本発明の目的は、前記欠点が解決され、ラッチアップ耐
量の測定が、全外部出力端子の全電位状態において、行
えるようにした半導体集積回路装置を提供することにあ
る。
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor integrated circuit device in which the above drawbacks are solved and latch-up resistance can be measured in all potential states of all external output terminals.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の構成は、半導体基板上に形成された内部集積回
路と、外部接続出力端子を有する外部出力バッファ回路
と、外部接続入力端子を有する第1の外部入力回路とを
備えた半導体集積回路装置において、前記外部入力回路
と前記内部集積回路、前記外部出力バッファ回路との間
に、それぞれ第1.第2のスイッチ回路を設け、前記第
1゜第2のスイッチ回路を交互に導通又はしゃ断する制
御信号を与える第2の外部入力回路とを備えたことを特
徴とする。
The configuration of the present invention is a semiconductor integrated circuit device including an internal integrated circuit formed on a semiconductor substrate, an external output buffer circuit having an external connection output terminal, and a first external input circuit having an external connection input terminal. A first . The present invention is characterized in that a second switch circuit is provided, and a second external input circuit provides a control signal that alternately turns on and off the first and second switch circuits.

〔実施例〕 次に本発明について図面を参照して説明する。〔Example〕 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の半導体集積回路装置の回路
図である。第1図において、本実施例の半導体集積回路
装置は、第1の外部出力用バッファ回路10入力端子2
と、第1の外部入力回路3の出力端子4.及び内部集積
回路5の出力端子6が、それぞれスイッチ回路9,8を
介して接続されており、スイッチ回路8,9の制御端子
10゜11.12.13は、それぞれ第2の外部入力回
路14の出力端子15.16に接続されている。
FIG. 1 is a circuit diagram of a semiconductor integrated circuit device according to an embodiment of the present invention. In FIG. 1, the semiconductor integrated circuit device of this embodiment has a first external output buffer circuit 10 input terminal 2
and the output terminal 4 of the first external input circuit 3. and the output terminals 6 of the internal integrated circuit 5 are connected via switch circuits 9, 8, respectively, and the control terminals 10, 11, 12, 13 of the switch circuits 8, 9 are connected to the second external input circuit 14, respectively. is connected to output terminals 15 and 16 of.

第1の外部出力用バッファ回路1に入力される内部集積
回路5.及び第1の外部入力回路3の出力信号は、第2
の外部入力回路14からの信号によって、どちらか一方
に切り換えることができる。
Internal integrated circuit 5 which is input to the first external output buffer circuit 1. and the output signal of the first external input circuit 3 is
It is possible to switch to either one by a signal from the external input circuit 14.

尚、第2の外部出力用バッファ回路31の接続関係も、
前述した第1の外部出力用バッファ回路1と同様な回路
構成となっているので省略する。
The connection relationship of the second external output buffer circuit 31 is also as follows.
The circuit configuration is similar to that of the first external output buffer circuit 1 described above, so a description thereof will be omitted.

また、スイッチ回路介さず、バッファ回路17の出力端
子18から、直接内部集積回路50入力端子7に入力さ
れるものもある。
In addition, there is also a signal that is directly inputted from the output terminal 18 of the buffer circuit 17 to the input terminal 7 of the internal integrated circuit 50 without going through the switch circuit.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明の半導体集積回路装置は、
第2の外部入力回路からの信号でスイ。
As explained above, the semiconductor integrated circuit device of the present invention includes
It is switched by the signal from the second external input circuit.

子回路を制御し、外部出力用バッファ回路に入力される
内部集積回路からの出力信号を遮断し、第1の外部入力
回路からの信号を外部出力用バッファ回路に入力するこ
とによって、外部出力用バッファ回路の出力端子の電位
を、内部集積回路の状態にかかわらずHまたはLレベル
に設定することができ、もってラッチアップ耐量測定を
全外部出力端子のH及びLの同電位状態において、行な
うことができるという効果がある。
By controlling the child circuit, blocking the output signal from the internal integrated circuit input to the external output buffer circuit, and inputting the signal from the first external input circuit to the external output buffer circuit, The potential of the output terminal of the buffer circuit can be set to H or L level regardless of the state of the internal integrated circuit, and the latch-up tolerance measurement can be performed with the H and L potentials of all external output terminals at the same potential. It has the effect of being able to

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の半導体集積回路装置を示す
回路図、第2図は従来の半導体集積回路装置の回路図で
ある。 1.20・・・・・・外部出力用バッファ回路、2,2
1・・・・・・外部出力用バッファ回路の入力端子、3
・・・・・・第1の外部入力回路、4・・・・・・第1
の外部入力回路の出力端子、5,24・・・・・・内部
集積回路、6,25・・・・・・内部集積回路の出力端
子、7,26・・・・・・内部集積回路の入力端子、8
,9・・・・・・スイッチ回路、10.11,12.1
3・・・・・・スイッチ回路の制御端子、14・・・・
・・第2の外部入力回路、15,16・・・・・・第2
の外部入力回路の出力端子、17,22・・・・・・外
部入力用バッファ回路、18,23・・・・・・外部入
力用バッファ回路の出力端子、19,27・・・・・・
外部接続用端子。
FIG. 1 is a circuit diagram showing a semiconductor integrated circuit device according to an embodiment of the present invention, and FIG. 2 is a circuit diagram of a conventional semiconductor integrated circuit device. 1.20...Buffer circuit for external output, 2,2
1...Input terminal of external output buffer circuit, 3
・・・・・・First external input circuit, 4・・・・・・First
Output terminal of external input circuit, 5, 24... Internal integrated circuit, 6, 25... Output terminal of internal integrated circuit, 7, 26... Output terminal of internal integrated circuit Input terminal, 8
, 9... Switch circuit, 10.11, 12.1
3... Control terminal of switch circuit, 14...
...Second external input circuit, 15, 16...Second
Output terminals of external input circuits, 17, 22... buffer circuits for external inputs, 18, 23... output terminals of buffer circuits for external inputs, 19, 27...
Terminal for external connection.

Claims (1)

【特許請求の範囲】[Claims] 半導体基板上に形成された内部集積回路と、外部接続出
力端子を有する外部出力バッファ回路と、外部接続入力
端子を有する第1の外部入力回路とを備えた半導体集積
回路装置において、前記外部入力回路と前記内部集積回
路、前記外部出力バッファ回路との間に、それぞれ第1
、第2のスイッチ回路を設け、前記第1、第2のスイッ
チ回路を交互に導通又はしゃ断する制御信号を与える第
2の外部入力回路とを備えたことを特徴とする半導体集
積回路装置。
In a semiconductor integrated circuit device comprising an internal integrated circuit formed on a semiconductor substrate, an external output buffer circuit having an external connection output terminal, and a first external input circuit having an external connection input terminal, the external input circuit and the internal integrated circuit and the external output buffer circuit, respectively.
A semiconductor integrated circuit device comprising: a second switch circuit; and a second external input circuit that provides a control signal that alternately turns on or off the first and second switch circuits.
JP19552489A 1989-07-27 1989-07-27 Semiconductor integrated circuit device Pending JPH0360052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19552489A JPH0360052A (en) 1989-07-27 1989-07-27 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19552489A JPH0360052A (en) 1989-07-27 1989-07-27 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPH0360052A true JPH0360052A (en) 1991-03-15

Family

ID=16342527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19552489A Pending JPH0360052A (en) 1989-07-27 1989-07-27 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPH0360052A (en)

Similar Documents

Publication Publication Date Title
US5006732A (en) Semiconductor circuit having buffer function
JPH0360052A (en) Semiconductor integrated circuit device
JPH04123217A (en) Switching circuit for state of external terminal
JP2782946B2 (en) Semiconductor integrated circuit
JPS61274511A (en) Cmos type semiconductor integrated circuit
JPS635278A (en) Testing circuit of semiconductive integrated circuit
JPH06138189A (en) Semiconductor device
JPH0559971U (en) Switch circuit
JP2557866Y2 (en) Signal switching circuit
JPH0533831B2 (en)
JPH04155280A (en) Semiconductor integrated circuit
JPS62131628A (en) Interface circuit
JPH0511896A (en) Semiconductor circuit
JPH04175675A (en) Signal processing unit
JPH0377406A (en) Oscillation control circuit
JPH03142385A (en) Semiconductor integrated circuit
JPH02188961A (en) Integrated circuit device
JPH0315776A (en) Mode setting circuit
JPH0643222A (en) Semiconductor device
JPH01186017A (en) Input control circuit
JPH02299318A (en) Input circuit for ecl circuit
JPH03148913A (en) Low power consumption type input circuit
JPS61165900A (en) Flip-flop circuit
JPH0480676A (en) Semiconductor integrated circuit
JPS63296519A (en) Electronic switch