JPH0360060A - Lead repossessing mold for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent adhesion of solder plating on the lead surface to the mold surface during the lead molding by forming the mold of a ceramic material. CONSTITUTION:A semiconductor device 1 is transferred between a ceramic bending mold 3 in the open state and a stripper 8 and positioned, then the stripper 8 is lowered to clamp a lead 2 part of the semiconductor device 1 and contacts the ceramic bending mold 3. Thus, the lead 2 is pressed to the ceramic bending mold 3 and is bent in J-shape in a predetermined curvature from the central part to the extremity of the lead 2 along a J-shaped surface 6 formed on the support part 5 of the mold. Herein, the ceramic bending mold 3 has excellent surface lubricity and non-adhesive property so that the friction between the lead 2 and the surface of the ceramic bending mold 3 is very small even if the lead 2 is formed as it is being rubbed by the surface of the ceramic bending mold 3. Thus, the solder plating covering the lead surface is never peeled and the adhesion of solder plating covering the lead surface to the mold surface can be prevented and the lead can be formed in the normal form.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead processing mold for a semiconductor device, particularly to an improvement of a lead processing mold for a semiconductor device for forming a J-shaped lead.

[Conventional technology]

Figure 2 a % C is a diagram showing a state in which a conventional semiconductor device is processed into leads. 4 is a carbide bending mold made of a carbide material, and 5 is the upper surface of the carbide bending mold 4 on the fire-directing side. A support recess 6 is provided on the outer surface of the support recess 5 to enclose the semiconductor device 1, and is mirror-finished, and a J-shaped curved surface 7 for bending the lead 2 into a J-shape. This is a pressure receiving part around the periphery of the carbide bending die 4. Reference numeral 8 denotes a stripper for clamping the lead 2, and a concave portion having a shape corresponding to the top surface side of the semiconductor device 1 is formed in the inner center portion of the lower surface side of the stripper, and a pressure receiving portion of the carbide bending mold 4 in the peripheral portion thereof. A lead 2 of a semiconductor device 1 is processed into a J shape using a stripper 8 and a carbide bending die 4 such as 9 or above, which has a pressing part 9 at a position opposite to 7 and is movable in the vertical direction. A lead processing mold (hereinafter referred to as a mold) is constructed.

Next, the molding process will be explained. As shown in FIG. 2a, the semiconductor device 1, on which the leads 2 have been previously formed into a predetermined shape, is set on a carbide bending mold 4. As shown in FIG. At this time, the semiconductor device 1 is positioned approximately at the center of the cemented carbide bending mold 4, and the leads 2 are positioned so as to face the J-shaped curved surface 6. Next, the stripper 8 is lowered, and the upper surface of the semiconductor device 1 is By bringing the side into contact with the concave portion of the stripper 8 and further lowering the stripper 8, as shown in FIG. and are in contact with each other. As a result, the lead 2 is clamped by a part of the recess of the stripper 8 and the J-shaped curved surface 6, and by being further pressed, the lead 2 is pressed onto the carbide bending die 4.
It is molded while being rubbed against the surface of the carbide bending mold 4. After lead forming, the stripper 8 is raised and separated from the carbide bending die 4, as shown in FIG. 2C. After that, the semiconductor device 1 after forming the leads 2 from the carbide bending mold 4 is completed.
The molding process is completed by taking out.

[Problem to be solved by the invention]

The conventional mold is constructed as described above, and when forming a J-shaped lead, since the carbide bending mold 4 is made of carbide, the surface of the J-shaped curved surface 6 and the surface of the lead 2 are A large amount of friction occurs due to the contact between the two. As a result, the solder plating covering the surface of the lead 2 is peeled off and the lead 2 is exposed to the surface of the J-shaped opening 5.
The problem is that the solder plating that covers the surface of the semiconductor device 1 is deposited, and the deposits damage the surface of the leads 2 or deform the leads 2, impairing the reliability of the semiconductor device 1. there were.

This invention was made in order to solve the above-mentioned problems, and it is possible to prevent the adhesion of solder plating on the lead surface to the mold surface during lead molding, and to form a molded lead in a normal state. The purpose is to obtain a type.

[Means to solve the problem]

A mold for a semiconductor device according to the present invention includes a semiconductor device with leads extending outside and is provided with a recess for bending the lead into a J shape, and the mold is made of a ceramic material. It was formed.

[Effect]

The ceramic material used in this invention has excellent surface lubricity and non-adhesiveness, which reduces friction between the mold surface and the lead surface, and prevents the adhesion of solder plating covering the lead surface to the mold surface. It has the effect of preventing

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a diagram (corresponding to FIG. 2) showing a state in which a semiconductor device is subjected to lead processing, and in the diagram, the same or corresponding parts as in FIG. 2 are given the same reference numerals. Reference numeral 3 denotes a ceramic bending die, which differs from the one shown in FIG. 2 in that the ceramic bending die 3 is made of a ceramic material.

Next, this molding process will be explained. The molding process itself is the same as that shown in FIG. First, although not shown, a ceramic bending die 3. The semiconductor device 1 is transferred between the strippers 8 and positioned.

Next, as shown in FIG. 1, the stripper 8 descends to clamp the lead 2 portion of the semiconductor device 1 and is brought into contact with the ceramic bending mold 3. As a result, the lead 2 is pressed against the ceramic bending mold 3 and bent into a J-shape having a predetermined curvature from the center to the tip of the lead 2 along the J-shaped curved surface 6 formed on the support part 5. be done.

Here, since the ceramic bending die 3 has extremely superior surface lubricity and non-adhesiveness compared to the carbide bending die 4, the lead 2 is molded while being rubbed against the surface of the ceramic bending die 3. Even if the lead 2 is bent, the friction between the lead 2 and the surface of the ceramic bending mold 3 becomes extremely small. As a result, the solder plating covering the surface of the lead 2 does not peel off, and adhesion of the solder plating covering the surface of the lead 2 to the surface of the ceramic bending mold 3 can be prevented.

Furthermore, although not shown, the stripper 8 is raised and separated from the ceramic bending die 3 in the same way as shown in FIG. 2C. Thereafter, the semiconductor device 1 with the leads 2 formed is taken out from the ceramic bending mold 3, thereby completing the molding process.

Since the molding is performed in this manner, the leads 2 can be formed into a normal shape, and a highly reliable semiconductor device 1 can be obtained.

〔Effect of the invention〕

As described above, according to the present invention, since the mold is made of a ceramic material, the leads can be molded in a normal state, and a highly reliable semiconductor device can be obtained.

[Brief explanation of drawings]

FIG. 1 is a diagram showing how leads of a semiconductor device are processed using a lead processing mold according to an embodiment of the present invention, and FIG. FIG. In the figure, 1 is a semiconductor device, 2 is a lead, 3 is a ceramic bending mold, 6 is a J-shaped curved surface, and 8 is a stripper. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] A lead processing mold which houses a semiconductor device with leads extending outside and is provided with a recess for bending the leads into a J-shape, characterized in that the lead processing mold is made of a ceramic material. Lead processing mold for semiconductor devices.