JPH073144U - Semiconductor device molding machine - Google Patents

Abstract

(57) [Abstract] [Purpose] In the manufacturing of semiconductor devices, when molding the outer leads, the molding process can be performed without causing damage such as cracks or peeling in the sealing part of resin or low melting point glass. Aiming for a uniform processing device. In an outer lead molding processing device that projects from a sealed semiconductor device, a protruding portion is provided on the outer periphery of a pedestal surface on which the sealed semiconductor device is mounted, with a space being provided between the outer lead and the processed outer lead. A processing apparatus for a semiconductor device is characterized in that a cradle for supporting each is provided facing the molding processing apparatus. [Effects] The processing receiving device of the present invention can independently support the outer leads of the encapsulation type semiconductor device when the outer leads of the encapsulation type semiconductor device are formed, so that an unbalanced load is applied to the encapsulation portion such as resin or low melting point glass. There is no cracking, peeling, or other damage, and the shape is good.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor device processing apparatus.

[0002]

[Prior art]

 A resin-sealed semiconductor device has a semiconductor chip mounted on a die pad of a lead frame having a large number of leads formed by pressing or etching, and bonding wires of the semiconductor chip bonding pads and the lead frame inner leads. After connecting the wires, seal the inside of the inner leads with a sealing material such as resin, and cover the exposed parts of the lead frame, such as the outer leads, with a low melting point metal such as solder. Is cut into a predetermined length, and the outer lead is formed into a desired shape.

Further, in a semiconductor device using a ceramic substrate, low melting glass is coated on a ceramic substrate which is a base, and a lead frame is attached on the low melting glass. Next, the outer peripheral portion of the outer lead is cut and formed into a desired shape, die bonding and wire bonding are performed, and then the outer lead is sealed with a ceramic cover.

The semiconductor device is mounted by contacting one surface of the outer lead with the mounting surface and reflowing the low-melting-point metal deposition film. In such mounting, it is necessary to mount the semiconductor device on a predetermined mounting surface in a normal posture at a predetermined position. is important.

By the way, in recent years, there has been a strong demand for higher density integration and smaller size and higher functionality of semiconductor devices, and correspondingly, the number of pins is increased and the lead frame is thin. In the manufacturing process of such a semiconductor device, since the lead frame is thinned and its strength is reduced, even if the outer lead is connected with a connecting piece, the lead frame is bent or shaken and sealed with the resin or the like. In some cases, such as when mounting on a low melting point glass, the free end side of the outer lead cannot be fixed to the same horizontal height surface.

In the semiconductor device, the outer leads are cut into a predetermined length and formed into a J-shape or a desired shape such as a gull wing shape as described in Japanese Patent Laid-Open No. 2-90659. Since the height of the sealing position on the free end side of the outer lead is not the same horizontal height as described above, non-uniform force is applied to the sealing base of the free end during molding of the outer lead, and minute cracks occur in the sealing part. And peeling may occur. In addition, the shape after molding may be uneven.

[0007]

[Problems to be solved by the device]

 According to the present invention, even if the lead frame has a large number of pins and the thickness is thin, the outer lead molding process described above can be performed without causing damage such as cracks or peeling in the sealing portion made of resin or low melting point glass. Moreover, it aims at the processing device which can perform a uniform molding process.

[0008]

[Means for Solving the Problems]

 The gist of the present invention is, in a processing device for molding an outer lead protruding from a sealed semiconductor device, provided with a protruding portion at an outer periphery of a pedestal surface on which the sealed semiconductor device is mounted, and the protruding portion. In the processing apparatus for a semiconductor device, a pedestal for supporting each of the outer leads to be processed is provided so as to face the molding processing apparatus.

[0009]

[Action]

 In the present invention, protrusions are provided at intervals on the outer periphery of the mounting cradle surface of the encapsulation type semiconductor device, and the cradle for supporting each of the outer leads by the protrusions is arranged facing the molding apparatus. Therefore, even if the sealing position on the free end side of the outer lead of the semiconductor device is not on the same plane, each outer lead is independently supported by the overhanging portion and excessive force is applied when it is processed by the molding device. No Therefore, no defects such as cracks or peeling occur in the sealing portion.

Further, since each outer lead is supported by the projecting portion and is molded, the processing is performed uniformly for each lead, and a product having excellent shape is obtained.

[0011]

【Example】

 Hereinafter, the present invention will be described in detail based on an embodiment with reference to the drawings. In the drawings, reference numeral 1 denotes a resin-sealed semiconductor device, and in this embodiment, an outer lead 2 projects in two directions. The tip of the outer lead 2 is connected by a connecting piece 3. After that, in the semiconductor device 1, the connecting piece is removed and the outer lead 2 is formed into a desired shape for convenience of mounting.

In the semiconductor device 1, the connecting piece 3 is removed and the outer lead 2 is molded in the molding line. In this embodiment, the case of applying to the J-shaped molding process is described with reference to FIGS. 1 to 3. And state.

Reference numeral 4 denotes a pedestal on which the semiconductor device 1 is mounted, and protruding portions 5 are provided at intervals on the outer periphery of the pedestal so as to independently support the outer leads 2. In this embodiment, the surface height of the overhanging portion 5 is the same as that of the pedestal surface except that the tip portion 5-1 is raised, and the installation interval is set to correspond to the outer lead 2 interval. The projecting portion 5 is not limited to this example, and the tip portion 5-1 may be flat without being raised or may be recessed. Further, the projecting portion 5 is not limited to being provided only on the upper portion of the pedestal 4 as in this embodiment, but it may be continuous from the upper portion to the lower portion of the pedestal, and a notch is formed in the continuous intermediate portion. It may be provided.

Reference numeral 6 denotes a stripper, which is movable back and forth with respect to the pedestal 4 side and cooperates with the pedestal 4 to sandwich the sealing portion 1-1 of the semiconductor device 1. Reference numeral 7 denotes a bending punch, which is formed so as to bend the outer lead 2 into a J-shape, and is provided so as to face the pedestal 4 provided with the projecting portion 5. This bending punch 7 is connected to a driving device (not shown) and can move back and forth to bend the outer lead 2 into a J-shape.

Next, the J-shaped bending process of the outer lead 2 of the semiconductor device 1 using the device of the present invention will be described. The semiconductor device 1 is placed on the pedestal 4, the stripper 6 is lowered, and the semiconductor device 1 is clamped in cooperation with the pedestal 4. At this time, the outer lead 2 projecting from the side end of the semiconductor device 1 has a small resin-sealing height even if the resin-sealed position varies, due to the increase in the number of pins of the lead frame and the reduction in strength due to the thin thickness. Since the pedestal 4 of the present invention is provided with the protruding portions 5 at intervals, each outer lead 2 is individually supported by the protruding portions 5.

However, when the bending punch 7 is advanced to give a bending force to the outer leads 2 to bend them into a J shape, the outer leads 2 are independently supported at their lower portions, and force is applied to the resin sealing base end. No damage and no cracking or peeling.

Further, since the outer leads 2 are supported as described above, the bending force uniformly acts on the outer leads 2 and is uniformly shaped.

In the embodiment, the case where the outer leads protruding in two directions are formed in a J shape has been described, but the present invention is not limited to this, and can be applied when forming into a desired shape such as a gull wing shape. Is obtained. Furthermore, by providing the projecting portion of the pedestal in conformity with the shape of the outer leads of the semiconductor device, it can be applied to semiconductor devices of various shapes.

[0019]

[Effect of device]

 Since the device of the present invention can independently support each of the outer leads 2 of the semiconductor device 1 when the outer lead 2 of the semiconductor device 1 is molded, as described above, cracking or peeling of the resin or low melting point glass or the like can be prevented. There is no damage, and the shape is good.

[Brief description of drawings]

FIG. 1 is a view showing a pedestal of a processing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a processing apparatus according to an embodiment of the present invention.

FIG. 3 is a diagram showing a semiconductor device according to an embodiment of the present invention.

[Explanation of symbols]

 1 semiconductor device 2 outer lead 3 connecting piece 4 pedestal 5 overhanging portion 6 stripper 7 bending punch

Claims (1)

[Scope of utility model registration request] 1. A molding processing apparatus for an outer lead protruding from an encapsulation type semiconductor device, wherein an outer peripheral portion of a pedestal surface on which the encapsulation type semiconductor device is mounted is provided with an overhanging portion at a distance, and the overhanging outer portion is processed by the overhanging portion. A molding machine for a semiconductor device, characterized in that a cradle for supporting each lead is provided facing the molding machine.