JPH0360158B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a slip ring assembly used in various devices using a rotary gyroscope.

As shown in Fig. 1, a slit-pring assembly used in equipment using a rotary gyroscope has a plurality of slip-rings 2, each having a lead wire 1 welded to its inner circumferential surface, mounted at regular intervals on the outer periphery of an epoxy resin support shaft 3. The slip rings 2 are integrally provided, and the lead wires 1 of each slip ring 2 are led out to the end of the support shaft.

(Prior Art and Problems) Conventionally, in order to manufacture the slip ring assembly 4 having such a structure, first the slip rings 2 are made by pressing a plate made of a conductive material, and then the inner periphery of each slip ring 2 is Lead wires 1 are welded to the surface, and then a plurality of slip rings 2 are arranged and set at regular intervals in a mold, and the lead wires 1 of each slip ring 2 are led out of the mold, and then into the mold. The supporting shaft 3 was formed by filling with epoxy resin, and the slip rings 2 were integrally formed on the outer periphery at regular intervals.After that, the outer periphery was cut and polished for finishing shaping.

However, in this manufacturing method, it is difficult to align the lead wires 1, and the lead wires 1 often get entangled with each other, resulting in a loss of insulation, and epoxy resin is deposited in the gap between the slip rings 2. It was difficult for the material to flow in, resulting in pinholes and breakage when cutting the outer periphery in the final process.

In particular, slip ring assemblies are required to be even smaller due to the recent miniaturization of the equipment they are incorporated into, but as mentioned above, due to the entanglement of each lead wire, it is necessary to have more than 10 lead wires for an outer diameter of 3 mm or less. There was a problem in that it was impossible to actually make a small slip ring 2 that could be passed through.

(Object of the Invention) The present invention was made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a slip ring assembly that is small in size, has high insulation properties, and has high strength.

(Structure of the Invention) A method of manufacturing a slip ring assembly according to the present invention will be explained below with reference to the drawings. As shown in Figure 2, Be
- A reinforcing core rod 7 is a rod 5 made of Cu, SUS, etc. with an insulation coating 6 made of epoxy resin, and then one end of the lead wire or insulation coating with insulation coating is scraped off as shown in Fig. 3. Then, the lead wires 8, which have been re-insulated with a resin such as epoxy, are aligned and attached to the adhesive tape 9 at regular intervals, and then they are wrapped around the reinforcing core rod 7 as shown in FIG. 4 and fixed with instant adhesive. Then remove the adhesive tape 9. Next, this is put into a mold, one end of the lead wire 8 is guided out of the mold, and the mold is filled with resin such as epoxy to form a cylindrical support shaft 10 as shown in FIG. Form.
Next, cut grooves 11 of the same number as the lead wires 8 are formed at regular intervals in the longitudinal direction on the outer peripheral surface of the cylindrical support shaft 10, as shown in FIG. 6a, to insulate the lead wires 8 as shown in FIG. 6b. The sheath is broken and the conductive portion of the lead wire 8 is partially exposed. This cutting process is carried out one by one for each lead wire, thereby exposing a part of the lead wire 8. Next, electrolytic plating or sputtering or application of conductive paint is performed on the support shaft 10 to form the conductive portion 1 of the cut groove 11 as shown in FIG.
2 and the same number of independent annular plating electrodes 13 as the lead wires are formed. Next, an independent annular electroplating 14 is applied through each lead wire 8 as shown in FIG. As for this matsuri,
After applying Cu plating of several microns to several tens of microns, plating with a precious metal such as Au or Au alloy, or directly applying Au or Au
Plating with precious metals such as alloys is applied. In this way, the plating thickness is applied to be thicker than the depth of the notch 11 as shown in the figure, so that it protrudes from the outer circumferential surface of the support shaft 10. Thereafter, as shown in FIG. 9, the outer periphery and side surfaces of the annular electroplating plates 14 are cut, and then the grooves 15 between the annular electroplating plates 14 are filled with resin 16 as shown in FIG. As shown in FIG. 11, the outer circumferential surface is cut, and the outer circumference of the annular electroplating 14 is cut to form a shallow V-shaped groove 17.
Finally, the slip ring assembly 18 is manufactured by polishing and finishing.

(Function) As described above, in the method for manufacturing a slip ring assembly of the present invention, the reinforcing core rod 7 made of Be-Cu, SUS, etc.
Since the support shaft 10 is arranged at the center, when the notch 11 is formed on the support shaft 10, the support shaft 10 is reinforced by the reinforcing core rod 7 and does not break. Furthermore, since centering can be performed using the reinforcing core rod 7 during cutting, highly accurate cutting can be performed. Furthermore, since the lead wires 8 are arranged in advance on the adhesive tape 9 and wound around the outer circumference of the reinforcing core rod 7, the lead wires 8 are not entangled with each other inside the support shaft 10, and the insulating A highly reliable slip ring assembly is obtained. Further, since the support shaft 10 is molded with resin into a substantially cylindrical shape without any obstructions, the support shaft 10 without pinholes is formed. Furthermore, as mentioned above, since there is no entanglement between the lead wires 8, it is possible to manufacture even small products by changing the thickness of the reinforcing core rod 7, the thickness of the lead wires 8, and the thickness of their insulation coatings. can.

(Example) As shown in Fig. 2, a reinforcing core rod 7 is a rod 5 with a diameter of 0.9 mm and an insulating coating 6 made of epoxy resin, and then a Cu wire with a diameter of 0.2 mm is used as shown in Fig. 3. Tip of Teflon insulated wire with 5μ Sn plating applied 20
13 lead wires 8 with 15 to 20 μm of epoxy resin removed and attached to the adhesive tape 9 at regular intervals are then attached to the adhesive tape 9, and then the reinforcing core rod of the lead wires 8 is aligned and attached to the adhesive tape 9. 7 as shown in FIG. 4, the lead wire 8 was fixed to the reinforcing core rod 7 with instant adhesive, and the adhesive tape 9 was removed. Next, this is put into a mold, one end of the lead wire 8 is guided out of the mold, and the reinforcing core rod 7 is locked as the center, and the mold is filled with epoxy resin and solidified.
As shown in the figure, a cylindrical support shaft 10 was formed. Next, on the outer peripheral surface of this cylindrical support shaft 10, 13 grooves 11 with a width of 0.6 mm are cut at 1 mm intervals in the longitudinal direction as shown in FIGS. 6a and 6b to break the insulation coating of the lead wire 8, and The conductive portion 12 of the wire 8 was partially exposed and formed into an arc shape. Then on the support shaft 10
Electroless plating of Cu is performed, Cu plating of 0.5 to 1 μm is applied, and Cu is further electroplated with 20 μm of Cu, resist is applied in a ring shape with the width of the cut groove 11, and after etching treatment, the resist is removed. This was removed to form an annular plating electrode 13 as shown in FIG. Next, each lead wire 8 is passed through the Au-Ag1 wire as shown in FIG.
% was electroplated 14 by 0.5 mm to protrude from the outer peripheral surface of the support shaft 10. Thereafter, as shown in FIG. 9, the outer periphery and side surface of the annular electroplating plate 14 are cut to form a diameter of 2.3 mm, and then resin 16 is placed in the groove 15 between the electroplating plates 14 as shown in FIG. Fill it with
Further, as shown in FIG. 11, the outer peripheral surface is cut, and the outer periphery of the annular electroplating plate 14 is cut into grooves to form a shallow V-shaped groove 17 with a depth of 80μ, and finally polished. A slip ring assembly 18 was manufactured as shown in FIG.

The slip spring assembly produced in this way
When 100 pieces were tested, none caused insulation deterioration. Also, none of them were broken during production.

(Conventional example) Slip rings with an inner diameter of 1.8 mm and an outer diameter of 3 mm are made by pressing a plate made of 1% Au-Ag with a thickness of 0.6 mm, and then Cu with a diameter of 0.2 mm is placed on the inner circumferential surface of each slip ring. Then, 13 slip rings were arranged and set at 0.4 mm intervals in the mold, and the lead wires of each slip ring were led out of the mold. Next, epoxy resin was poured into the mold. A support shaft is formed by filling, and a slip ring is integrally formed on the outer periphery.The outer periphery is then cut to form a support shaft with a diameter of 2.3 mm, and the surface is polished and finished to form a slip ring assembly. was produced.

The slip spring assembly produced in this way
When 100 pieces were evaluated as examples, 6 pieces were broken during manufacturing (cutting process), 63 pieces failed the insulation test, and 3 pieces had pinholes when the appearance of the passed pieces was inspected. This occurred, and 28 products passed the test, with a defective rate of 72%.

Note that in the embodiments of the present invention, the annular plating electrode 13 is formed by etching, but the present invention is not limited to this, and the annular plating electrode 13 may be formed by cutting. be.

(Effects of the Invention) As is clear from the above, according to the manufacturing method of the present invention, it is possible to obtain a slip ring assembly with high insulation properties, high strength, and good quality.
Furthermore, there are excellent effects such as the ability to easily obtain a small and lightweight slip ring assembly.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view showing a conventional slip ring assembly, and FIGS. 2 to 11 are diagrams showing steps of a method for manufacturing a slip ring assembly according to the present invention.

Claims (1)

[Claims] 1 A plurality of lead wires are fixed on the outer circumferential surface of an insulated reinforcing core rod, then set in a mold, one end of each lead wire is led out of the mold, and then resin is poured into the mold. to form a cylindrical support shaft, then cut grooves of the same number as the lead wires are provided at regular intervals to expose the conductive part of each lead wire, and then electroless plating is performed on the support shaft. Create independent annular plating electrodes in contact with the conductive portion and the same number as the lead wires by sputtering or applying conductive paint, and then apply annular electroplating using the plating electrodes to support. A slip ring that is made to protrude from the outer circumferential surface of a shaft, and then the outer circumference and side surfaces of electroplated plates are cut, the grooves between the plated plates are filled with resin, and the outer circumferential surface is cut and polished for finishing shaping. How the assembly is manufactured.