JPS6119084A - Method of producing slip ring assembly - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a slip ring assembly for use in various devices using a rotating gyro.

As shown in Fig. 1, a slip ring assembly used in a device using a rotating gyro includes a plurality of slip rings 2, each having a lead wire 1 welded to its inner circumferential surface, which are integrally mounted on the outer periphery of an epoxy resin support shaft 3 at regular intervals. The lead wire 1 of each slip ring 2 is led out to the end of the support shaft.

(Prior Art and Problems) Conventionally, in order to manufacture the slip ring assembly 4 having such a structure, first, a plate made of a conductive material is pressed to form the slip rings 2, and then the inner periphery of each slip ring 2 is Lead wires 1 are welded to the surface, and then a plurality of slip rings 2 are arranged at regular intervals in a mold, and the lead wires 1 of each slip ring 2 are led out of the mold, and then inserted into the mold. The support shaft 3 was filled with epoxy resin and molded, and the slip rings 2 were integrally formed on the outer periphery at regular intervals.After that, the outer periphery was cut and polished for finishing shaping.

However, in this manufacturing method, it is difficult to align the lead wires 1, and the lead wires 1 often get entangled with each other, resulting in a loss of insulation, and the epoxy resin is deposited in the gap between the slip rings 2. It is difficult to flow in, resulting in pinholes, and when the outer periphery is cut in the final process, there are problems such as breakage.

In particular, slip ring assemblies are required to be even smaller due to the miniaturization of the devices they are incorporated into, but as mentioned above, due to the entanglement of each lead wire, it is necessary to have more than 10 lead wires for an outer diameter of 31111 or less. There was a problem in that it was impossible to actually make a small slip ring 2 that could be passed through.

(Object of the Invention) The present invention was made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a slip ring assembly that is small in size, has high insulation properties, and has high strength.

(Structure of the Invention) A method of manufacturing a slip ring assembly according to the present invention will be explained below with reference to the drawings. As shown in Figure 2 (Be-Cu, SU
A reinforcing rod 7 is made by applying an insulating coating 6 to a rod 5 such as S, etc. with resin such as epoxy, and then scraping off one end of the lead wire or insulating coating with the insulating coating applied to that part as shown in Fig. 3. The lead wires 8, which have been re-insulated with resin such as epoxy, are lined up and attached to the adhesive tape 9 at regular intervals, and then wrapped around the reinforcing rod 7 as shown in Fig. 4 and fixed with instant adhesive. Then remove the adhesive tape 9. Next, this is put into a mold, one end of the lead wire 8 is guided out of the mold, and the mold is filled with resin such as epoxy to form a cylindrical support shaft 10 as shown in FIG. Form. Next, on the outer circumferential surface of this cylindrical support shaft 10, sixth notch grooves 11 are formed at regular intervals in the longitudinal direction, the same number as the lead wires 8, as shown in FIG. 6a.
As shown in the figure, the insulation coating of the lead wire 8 is broken to expose a part of the conductive portion of the lead wire 8. This cutting process is carried out one by one for each lead wire in order to expose a part of the lead wire 8. Next, electrolytic plating, sputtering, or conductive paint is applied on the support shaft 10, and as shown in FIG. Electrodes 13 are formed.

Next, individual annular electroplating 14 is applied through each lead wire 8 as shown in FIG. This plating is Cu
After plating is applied to a thickness of several microns to several tens of microns, plating with a noble metal such as Au or an Au alloy is applied, or plating with a noble metal such as Au or an Au alloy is directly applied. In this way, the plating thickness is applied to be thicker than the depth of the notch 11 as shown in the figure, and the support shaft 10 is
so that it protrudes from the outer peripheral surface of the

After that, as shown in FIG. 9, the outer periphery and side surface of the annular electroplating 14 are cut, and then the grooves 15 between the annular electroplating 14 are filled with resin 16 as shown in FIG.
As shown in the figure, the outer peripheral surface is cut, and the outer periphery of the annular electroplating 14 is cut into grooves to form shallow square grooves 17, and finally polished and finished to produce a slip ring assembly 18.

(Function) As described above, in the method for manufacturing a slip ring assembly of the present invention, since the eight reinforcing rods 7 made of Be-Cu, SUS, etc. are arranged at the center, when the notch 11 is grooved on the support shaft 10, The support shaft 10 is reinforced by the reinforcement 8 and the keyaki 7 so that it will not break. Furthermore, since centering can be performed using the reinforcing core rod 7 during cutting, highly accurate cutting can be performed.

Furthermore, since the lead wires 8 are arranged in advance on the adhesive tape 9 and wound around the outer periphery of the reinforcement 8 keyaki 7, the lead wires 8 are not entangled with each other inside the support shaft 10, and the insulating A highly reliable slip ring assembly is obtained. In addition, the mold resin molding of the support shaft 10 is
Since the support shaft 10 is formed in a substantially cylindrical shape with no obstacles, a pinhole-free support shaft 10 is formed. Furthermore, as mentioned above, since there is no intertwining of the lead wires 8, the thickness of the reinforcement 8 rod 7 is increased.

By changing the thickness of the lead wires 8 and the thickness of their insulating coatings, even small products can be manufactured.

(Example) As shown in FIG. 2, a Be-Cu rod 5 with a diameter of 0.9 mm is coated with an insulating coating 6 with epoxy resin to form a reinforcing rod 8, and then as shown in FIG. .211 Cu wire with Sn
The tip 20 of a Teflon insulated wire that has been plated with 5μ is scraped off and the lead wire 8 that has been coated with 15 to 20μ of epoxy resin is 1.
The three lead wires 8 are arranged and attached at regular intervals on the adhesive tape 9, and then the lead wires 8, which are arranged and attached on the adhesive tape 9, are wound around the reinforcement 8 rod 7 as shown in FIG. The lead wire 8 was fixed to the reinforcing rod 7, and the adhesive tape 9 was removed. Next, this is put into a mold, one end of the lead wire 8 is guided out of the mold, and the reinforcement 8 is locked with the rod 7 as the center, and the mold is filled with epoxy resin and solidified, as shown in Fig. 5. As shown, a cylindrical support shaft 10 was formed. Next, the insulation coating of the lead wire 8 was broken by cutting 13 grooves 11 with a width of 0.6 at intervals of 111 as shown in FIGS. 6a and 6b in the longitudinal direction of the outer peripheral surface of the cylindrical support shaft 10. , lead wire 8
The conductive portion 12 was partially exposed and formed into an arc shape. Next, electroless plating of Cu is performed on the support shaft 10 to give a coating of 0.5~
1 μm Cu plating was applied, further 20 μm Cu electroplating was applied, and a resist was applied in an annular shape at the cut groove 11.
After etching, the resist was removed to form an annular plating electrode 13 as shown in FIG. Next, through each lead wire 8, as shown in FIG.
, 5 mm electroplating 14 was applied to protrude from the outer peripheral surface of the support shaft 10. Thereafter, as shown in FIG. 9, the outer periphery and side surface of the annular electroplating plate 14 are cut to form a diameter of 2.3fi, and then the grooves 1 between the electroplating plates 14 are cut as shown in FIG.
5 is filled with resin 16, and further, as shown in FIG. 11, its outer peripheral surface is cut, and the outer periphery of the annular electroplating 14 is grooved to form a shallow V-shaped groove 17 with a depth of 80 μm.
Finally, it was polished to produce a sling ring assembly as shown in Figure 11.

When 100 slip ring assemblies thus manufactured were tested, none caused insulation deterioration. In addition, there was no breakage during production. (Conventional example) A slip ring with an inner diameter of 1.8 tm and an outer diameter of 3 mm was made by pressing a plate made of 1% Au-Ag with a thickness of 0.6 mm. Next, a lead wire made of Cu with a diameter of 0.2n is welded to the inner peripheral surface of each slip ring, and then the slip rings are arranged in a mold at intervals of 13 (lIO, 4n), and each slip ring is The lead wire is led out of the mold, and then the mold is filled with epoxy resin to form a support shaft and a slip ring is integrally formed on the outer periphery.The outer periphery is then cut to have a diameter of 2. 311 support shaft was formed, the surface was polished and finished, and a slip ring assembly was manufactured.

The 100 slip ring assemblies manufactured in this way were evaluated in the same way as in the example, during manufacturing (cutting).
There were 6 pieces that were broken, 63 pieces failed the insulation test, and pinholes were found on 3 (l!) when the passed items were visually inspected, and 28 pieces passed the final test. The defect rate was 72%.

In the embodiments of the present invention, the annular plating electrode 13 is formed by etching, but the present invention is not limited to this, and the annular plating electrode 13 may be formed by cutting.

(Effects of the Invention) As is clear from the above, according to the manufacturing method of the present invention, it is possible to obtain a slip ring assembly with high insulation properties, high strength, and good quality, and which is also small and lightweight. It has excellent effects such as being able to easily obtain.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view showing a conventional slip ring assembly, and FIGS. 2 to 11 are views showing steps of a method for manufacturing a slip ring assembly according to the present invention.

Claims (1)

[Claims] A plurality of lead wires are fixed on the outer circumferential surface of an insulated reinforcing core rod, then set in a mold, one end of each lead wire is led out of the mold, and then the resin is placed inside the mold. to form a cylindrical support shaft, then provide the same number of cut grooves as the lead wires at regular intervals to expose the conductive part of each lead wire, and then apply electroless plating, sputtering, or A conductive paint is applied to create independent annular plating electrodes that are in contact with the conductive part and have the same number of lead wires, and then annular electroplating is applied using the plating electrodes to form a plating electrode from the outer peripheral surface of the support shaft. A method for manufacturing a slip ring assembly, which comprises making the slip ring protrude, then cutting the outer periphery and side surface of the electroplated plate, filling the grooves between the plated parts with resin, and cutting and polishing the outer circumferential surface for finishing shaping.