JPH0360187A - Method for removing water from mounted printed circuit board - Google Patents
Method for removing water from mounted printed circuit boardInfo
- Publication number
- JPH0360187A JPH0360187A JP19640089A JP19640089A JPH0360187A JP H0360187 A JPH0360187 A JP H0360187A JP 19640089 A JP19640089 A JP 19640089A JP 19640089 A JP19640089 A JP 19640089A JP H0360187 A JPH0360187 A JP H0360187A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- air
- mounted printed
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract description 18
- 230000005484 gravity Effects 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims description 17
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000005553 drilling Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 abstract description 3
- 230000002542 deteriorative effect Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 10
- 238000007664 blowing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cleaning In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は実装プリント回路基板の水分除去方法に係わり
、より詳しくは、実装プリント回路基板を各種加工の後
、表面の汚れを洗浄する段階で水を含む洗浄媒体を使用
している為、実装プリント回路基板に水が付着してしま
い、錆等の原因となり、実装プリント回路基板の品質が
劣化してしまうのを防止する水分除去方法に個する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a method for removing moisture from a mounted printed circuit board, and more specifically, the present invention relates to a method for removing moisture from a mounted printed circuit board, and more specifically, it is used at the stage of cleaning dirt on the surface of a mounted printed circuit board after various processing. Since a cleaning medium containing water is used, water may adhere to the mounted printed circuit board, causing rust, etc., and preventing the quality of the mounted printed circuit board from deteriorating. do.
（従来の技術）
周知の通り、実装プリント回路基板は種々の加工の後、
洗浄の為に洗浄液に投入される。従来、この洗浄液はフ
ロン１１３等のフロン系液体であったが、″環境汚染に
よるフロン規制の為、洗剤水系の洗浄液が増加している
。この洗剤水を用いた場合、洗浄後の実装プリント回路
基板には水分が付着してしまい、乾燥がしにくくなり、
また錆等の原因となってしまうものであった。(Prior Art) As is well known, mounted printed circuit boards are processed after various processing.
It is put into a cleaning solution for cleaning. Conventionally, this cleaning liquid was a fluorocarbon-based liquid such as Freon 113, but due to the regulation of fluorocarbons due to environmental pollution, detergent water-based cleaning liquids are increasing. Moisture adheres to the substrate, making it difficult to dry.
It also caused rust and the like.
その為、実装プリント回路基板の水分除去方法が考えら
れた。Therefore, a method for removing moisture from mounted printed circuit boards was devised.
その第１従来例として、実装プリント回路基板に対して
圧縮空気を吐出し、実装プリント回路基板に付着した水
分を空中にはじき飛ばすという方法があった。As a first conventional example, there is a method in which compressed air is discharged to the mounted printed circuit board to flick off moisture adhering to the mounted printed circuit board into the air.
また第２従来例として、実装プリント回路基板に対して
熱風を吹き掛け、実装プリント回路基板に付着した水分
を乾燥させるという方法があった。Furthermore, as a second conventional example, there is a method of blowing hot air onto a mounted printed circuit board to dry moisture adhering to the mounted printed circuit board.
そして、第３従来例として、実装プリント回路基板に対
して吸気を行い、実装プリント回路基板に付着した水分
を吸引するという方法があった。As a third conventional example, there is a method in which air is sucked into the mounted printed circuit board and moisture adhering to the mounted printed circuit board is sucked out.
（発明の解決しようとする課題）
上記従来技術によれば、第１従来例の方法は実装プリン
ト回路基板に対して圧縮空気を吐出することによって、
実装プリント回路基板に付着した水分を空中にはじき飛
ばし水分を除去することが出来るものの、はじき飛ばさ
れた水分が空中を舞い、再び実装プリント回路基板に付
着してしまうという問題点を有していた。(Problem to be Solved by the Invention) According to the above-mentioned prior art, the method of the first conventional example is to discharge compressed air to the mounted printed circuit board.
Although it is possible to remove moisture adhering to the mounted printed circuit board by flicking it off into the air, there is a problem in that the flicked off moisture flies into the air and adheres to the mounted printed circuit board again.
また第２従来例の方法は実装プリント回路基板に対して
熱風を吹き掛けることによって、実装プリント回路基板
に付着した水分を乾燥し水分を除去することが出来るも
のの、その熱風によりプリント基板、及び実装されたＩ
Ｃ等の温度を上昇させ、変形させたり、しみを発生させ
たりする原因となった。更に、水分を蒸発させる方法を
取る為、時間が多く費やされてしまうという問題点を有
していた。Furthermore, in the method of the second conventional example, by blowing hot air onto the mounted printed circuit board, it is possible to dry and remove moisture adhering to the mounted printed circuit board. I was
This caused the temperature of C etc. to rise, causing deformation and staining. Furthermore, since a method of evaporating water is used, there is a problem in that a lot of time is consumed.
また、第３従来例の方法は実装プリント回路基板に対し
て吸気を行うことにより実装プリント回路基板に付着し
た水分を吸引し水分を除去することが出来るものの、実
装プリント回路基板は、ＩＣ等が実装されている為、表
面の形状が複雑であったり、′プリント基板とＩＣ等の
間に隙間が出来たりしてしまい、水分の吸引が出来ない
箇所が多くなり水分除去の有効性が半減してしまうとい
う問題を有していた。In addition, although the method of the third conventional example can suck and remove moisture attached to the mounted printed circuit board by sucking air into the mounted printed circuit board, the mounted printed circuit board does not contain ICs, etc. Since the IC is mounted, the surface shape is complicated, and there are gaps between the printed circuit board and the IC, etc., and there are many places where moisture cannot be sucked, reducing the effectiveness of moisture removal by half. The problem was that the
（目的）
従って本発明の目的とする所は、実装プリント回路基板
の品質を劣化させることなく、実装プリント回路基板に
付着した水分を除去し易い水分除去方法を提供するにあ
る。(Objective) Therefore, it is an object of the present invention to provide a moisture removal method that can easily remove moisture attached to a mounted printed circuit board without deteriorating the quality of the mounted printed circuit board.
（課題を解決する為の手段）
上記目的を遠戚する為に本発明は次の技術的手段を有す
る。即ち、実施例に対応する添付図面中の符号を用いて
これを説明すると、本発明はプリント基板上にＩＣ等を
実装した実装プリント回路基板を超音波洗浄等によって
洗浄した後、上記実装プリント回路基板に付着した水分
を除去する方法に於いて、上記実装プリント回路基板ｌ
の回路パターン以外の部分に表面から裏面へ貫通する六
１ｂをあけると共に、上記実装プリント回路基板１を一
方から他方へ移す過程で、上記実装プリント回路基板１
の上方から圧縮空気を吐出することにより、上記実装プ
リント回路基板ｌに付着した水分を上記穴１ｂに送り込
み、その圧縮空気による空気圧と重力によって水分を落
下せしめつつ、同時に上記実装プリント回路基板１の下
方から吸気を行うことにより、落下してくる水分を吸引
せしめ、水分を除去することを特徴とした実装プリント
回路基板の水分除去方法である。(Means for Solving the Problems) In order to achieve the above object, the present invention has the following technical means. That is, to explain this using the reference numerals in the attached drawings that correspond to the embodiments, the present invention cleans a mounted printed circuit board on which an IC or the like is mounted on a printed circuit board by ultrasonic cleaning or the like, and then cleans the mounted printed circuit board by ultrasonic cleaning or the like. In the method for removing moisture attached to a board, the above-mentioned mounted printed circuit board l
In the process of moving the mounted printed circuit board 1 from one side to the other, the mounted printed circuit board 1 is moved from one side to the other.
By discharging compressed air from above, the moisture adhering to the mounted printed circuit board 1 is sent into the hole 1b, and the moisture is dropped by the air pressure and gravity of the compressed air, and at the same time, the moisture attached to the mounted printed circuit board 1 is removed. This method of removing moisture from a mounted printed circuit board is characterized by sucking in air from below and removing the moisture.
（作用）
上記構成に基づくと、実装プリント回路基板１に六１ｂ
を形威し、実装プリント回路基板ｌの上方から圧縮空気
を吐出する為により、実装プリント回路基板ｌに付着し
た水分は、はじき飛ばされ、プリント基板１ａ表面を流
れ、形成された穴１ｂに送り込まれる。そして、圧縮空
気による空気圧と重力により実装プリント回路基板１の
下方へ落下する。そして、上方から圧縮空気を吐出する
のと同時に、下方より吸気を行っているので落下した水
分は吸引され、より除去され易くなるものである。(Function) Based on the above configuration, the mounted printed circuit board 1 has six 1b
Since compressed air is discharged from above the mounted printed circuit board l, moisture adhering to the mounted printed circuit board l is repelled, flows over the surface of the printed circuit board 1a, and is sent into the formed hole 1b. . Then, it falls below the mounted printed circuit board 1 due to the air pressure caused by the compressed air and gravity. Since compressed air is discharged from above and at the same time air is taken in from below, any moisture that has fallen is sucked in and removed more easily.
（実施例） 次の添付図面に従い本発明の好適な実施例を詳述する。(Example) Preferred embodiments of the invention will now be described in detail with reference to the accompanying drawings.
第１図に示すように、実装プリント回路基板ｌは、プリ
ント基板１ａの上にＩＣ１ｃ、コンデンサー１ｄ等が実
装されており、所定の間隔で水抜き穴１ｂが形成されて
いる。As shown in FIG. 1, the mounted printed circuit board 1 has an IC 1c, a capacitor 1d, etc. mounted on a printed circuit board 1a, and drain holes 1b are formed at predetermined intervals.
尚、この図では水抜き六１ｂを示す為、プリント基板１
ａを断面で図示したものである。In addition, in this figure, since the water drain 61b is shown, the printed circuit board 1
A is shown in cross section.
第２図に示すように、実装プリント回路基板ｌはテフロ
ンコーティングを施したポリアミド強化繊維で形成され
たメツシュベルト２により、左から右へと運搬される。As shown in FIG. 2, the mounted printed circuit board 1 is conveyed from left to right by a mesh belt 2 made of Teflon-coated polyamide reinforcing fiber.
この運搬される過程で、メツシュベルト２の上方にエア
ー吐出管３を実装プリント回路基板ｌに向けて圧縮空気
を吐出できるように設置する。またメツシュベルト２の
下方に吸引ダクト４と、その吸引ダクト４に連結された
吸引ノズル５を設置する。この時、吸引ノズル５の先端
にはローラー５ａが取り付けられており。During this transportation process, an air discharge pipe 3 is installed above the mesh belt 2 so that compressed air can be discharged toward the mounted printed circuit board l. Further, a suction duct 4 and a suction nozzle 5 connected to the suction duct 4 are installed below the mesh belt 2. At this time, a roller 5a is attached to the tip of the suction nozzle 5.
そのローラー５ａがメツシュベルト２に接するように配
置する。The roller 5a is arranged so as to be in contact with the mesh belt 2.
そして、メツシュベルト２により、実装プリント回路基
板１は矢示Ｐのように左から右へと運搬される。それと
同時にエアー吐出管３より２〜４．５Ｋｇ／Ｃｍ’のク
リーンエアーを吐出しているので、プリント基板１ａや
ＩＣ１ｃ、コンデンサー１ｄの表面に付いた水分や、プ
リント基板１ａとＩＣ１ｃ等の隙間に入った水分が吹き
飛ばされる。その吹き飛ばされた水分はプリント基板ｌ
ａ上を流れて行き、水抜き六１ｂに流し込まれる。Then, the mounted printed circuit board 1 is transported from left to right as indicated by arrow P by the mesh belt 2. At the same time, clean air of 2 to 4.5 Kg/Cm' is discharged from the air discharge pipe 3, so that it can remove moisture on the surfaces of the printed circuit board 1a, IC 1c, and capacitor 1d, and the gap between the printed circuit board 1a and IC 1c. The moisture that entered is blown away. The blown moisture is removed from the printed circuit board.
The water flows over the drain a and is poured into the drain 61b.
そして、エアー吐出管３から吐出される圧縮空気による
空気圧と重力によって水分はプリント基板ｌａの下方へ
落下する。また、エアー吐出管３による吐出と同時に、
吸引ダクト４によって５０１Ｉ／ｓｅｃ以上の吸気が行
われているので、水抜き穴１ｂから落下してくる水分は
吸引ノズル５に吸引されていく。Then, due to the air pressure caused by the compressed air discharged from the air discharge pipe 3 and gravity, the moisture falls below the printed circuit board la. Also, at the same time as the air is discharged from the air discharge pipe 3,
Since the suction duct 4 is sucking in air at a rate of 501 I/sec or more, the moisture falling from the drain hole 1b is sucked into the suction nozzle 5.
この上記した実装プリント回路基板１の水分除去方法を
用いた洗浄・水切り装置６を第３図に示す。FIG. 3 shows a cleaning/draining device 6 using the method for removing moisture from the mounted printed circuit board 1 described above.
この洗浄・水切り装Ｍ６は超音波洗浄を行う第１槽６ａ
、第２槽６ｂと、水切りを行う第３槽６ｃより成ってい
る。This cleaning/draining device M6 is a first tank 6a that performs ultrasonic cleaning.
, a second tank 6b, and a third tank 6c for draining water.
第１槽６ａ、第２槽６ｂには各々洗浄液７が満されてお
り、超音波発振器８が設置されている。The first tank 6a and the second tank 6b are each filled with a cleaning liquid 7, and an ultrasonic oscillator 8 is installed therein.
そして、超音波発振器８を作動することによって超音波
洗浄するものである。Then, ultrasonic cleaning is performed by operating the ultrasonic oscillator 8.
第３槽６ｃには第２図に示したエアー吐出管３や吸引ダ
クト４、吸引ノズル５を配置し、その後方に温風を吹き
掛ける温風吐出管９を上下に配置する。The air discharge pipe 3, suction duct 4, and suction nozzle 5 shown in FIG. 2 are arranged in the third tank 6c, and hot air discharge pipes 9 for blowing hot air behind them are arranged above and below.
そして、実装プリント回路基板ｌは第１槽６ａ、第２槽
６ｂ、第３槽６ｃを通るメツシュベルト２によって運搬
されていく。Then, the mounted printed circuit boards 1 are transported by the mesh belt 2 passing through the first tank 6a, the second tank 6b, and the third tank 6c.
まず、第１槽６ａで実装プリント回路基板１は洗浄液７
の液面より上の位置で運搬される。そして、洗浄液７中
に投入され、超音波発振器８を作動することによって超
音波洗浄を行う、そして、再び洗浄液７の液面より上に
運搬され、第２槽６ｂへ運搬される。First, in the first tank 6a, the mounted printed circuit board 1 is washed with cleaning liquid 7.
The liquid is transported at a position above the liquid level. Then, it is put into the cleaning liquid 7 and ultrasonic cleaning is performed by activating the ultrasonic oscillator 8, and then it is conveyed again above the level of the cleaning liquid 7 and conveyed to the second tank 6b.
そして、第２槽６ｂでも同様に運搬され、洗浄され、第
３槽６ｃへ運搬される。Then, it is similarly transported in the second tank 6b, cleaned, and transported to the third tank 6c.
そして、第３槽６ｃで′運搬される過程で、エアー吐出
管３と吸引ダクト４により水分が除去され、その後、温
風吐出管９により乾燥される。Then, in the process of being transported in the third tank 6c, moisture is removed by the air discharge pipe 3 and suction duct 4, and then dried by the hot air discharge pipe 9.
尚、図中の超音波発振器８の電源、メツシュベルト２の
駆動源、温風の熱源は省略している。Note that the power source for the ultrasonic oscillator 8, the drive source for the mesh belt 2, and the heat source for hot air are omitted in the figure.
また、この洗浄・水切り装置以外にも、実装プリント回
路基板ｌの形状１種類等によって槽、メツシュベルト、
エアー吐出管、吸引ダクト、吸引ノズル、温風吐出管の
形状１位置、数、材質等の異なったものが種々考えられ
る。In addition to this cleaning/draining device, there are also tanks, mesh belts, etc. depending on the shape of the mounted printed circuit board l.
Various types of air discharge pipes, suction ducts, suction nozzles, and warm air discharge pipes having different shapes, positions, numbers, materials, etc. can be considered.
以上のように、この洗浄・水切り装置６は実装プリント
回路基板１の表面の汚れを洗浄するのは勿論、その洗浄
後、付着した水分を除去できるものである。As described above, this cleaning/draining device 6 can not only clean dirt on the surface of the mounted printed circuit board 1 but also remove attached moisture after cleaning.
その水分除去方法について言えば、エアー吐出管３から
圧縮空気を吐出することによって実装プリント回路基板
ｌの水分を吹き飛ばすのに加えて、プリント基板１ａに
水抜き穴１ｂを形成することによイて吹き飛ばされた水
分がプリント基板１ａ表面を伝わって水抜き六１ｂに流
れ込む、そして、圧縮空気による空気圧と重力によって
水分はプリント基板１ａの下方へ落下する。そして、更
に吸引ダクト４によって吸気を行うので、水抜き六１ｂ
から落下してくる水分をより除去し易くすることができ
る。その後、温風吐出管９から温風を吐出することによ
って、更に水分を除去し易くするものである。Regarding the moisture removal method, in addition to blowing off the moisture on the mounted printed circuit board l by discharging compressed air from the air discharge pipe 3, it is also done by forming a drain hole 1b in the printed circuit board 1a. The blown moisture travels along the surface of the printed circuit board 1a and flows into the drain 61b, and then falls below the printed circuit board 1a due to the air pressure of the compressed air and gravity. Then, since air is further taken in through the suction duct 4, the water drain 61b
This makes it easier to remove moisture that falls from the surface. Thereafter, hot air is discharged from the hot air discharge pipe 9 to further facilitate the removal of moisture.
（効果）
以上詳述した如く本発明によると、圧縮空気を実装プリ
ント回路基板の上方から吐出することによって実装プリ
ント回路基板に付着した水分を吹き飛ばすのに加えて、
実装プリント回路基板に表面から裏面に貫通する穴を形
成することによって吹き飛ばされた水分がプリント基板
表面を伝わって穴に流れ込み、圧縮空気による空気圧と
重力によって落下し、更に実装プリント回路基板の下方
から吸気を行うことによって落下してきた水分を吸引し
、水分を除去し易くすることができる。(Effects) As detailed above, according to the present invention, in addition to blowing away moisture attached to the mounted printed circuit board by discharging compressed air from above the mounted printed circuit board,
By forming a hole penetrating the mounted printed circuit board from the front side to the back side, the blown moisture travels along the printed circuit board surface, flows into the hole, falls due to the air pressure of compressed air and gravity, and then flows from the bottom of the mounted printed circuit board. By inhaling air, it is possible to suck the moisture that has fallen down and make it easier to remove the moisture.
添付図面は本発明の実施例を示し、第１図は実装プリン
ト回路基板の側面図（プリント基板のみ断面図）、第２
図は水分除去方法の構成図、第３図は洗浄・水切り装置
の構成図である。
図中１は実装プリント回路基板、２はメツシュベルト、
３はエアー吐出管、４は吸引ダクト、５は吸引ノズル、
６は洗浄・水切り装置、
７は洗浄
液、
８は超音波発振器、
９は温風吐出管である。The attached drawings show embodiments of the present invention, and FIG. 1 is a side view of a mounted printed circuit board (only the printed circuit board is a sectional view),
The figure is a block diagram of the water removal method, and FIG. 3 is a block diagram of the washing/draining device. In the figure, 1 is a mounted printed circuit board, 2 is a mesh belt,
3 is an air discharge pipe, 4 is a suction duct, 5 is a suction nozzle, 6 is a washing/draining device, 7 is a cleaning liquid, 8 is an ultrasonic oscillator, and 9 is a hot air discharge pipe.
Claims (1)
基板を超音波洗浄等によって洗浄した後、上記実装プリ
ント回路基板に付着した水分を除去する方法に於いて； 上記実装プリント回路基板１の回路パターン以外の部分
に表面から裏面へ貫通する穴１ｂをあけると共に、上記
実装プリント回路基板１を一方から他方へ移す過程で、
上記実装プリント回路基板１の上方から圧縮空気を吐出
することにより、上記実装プリント回路基板１に付着し
た水分を上記穴１ｂに送り込み、その圧縮空気による空
気圧と重力によって水分を落下せしめつつ、同時に上記
実装プリント回路基板１の下方から吸気を行うことによ
り、落下してくる水分を吸引せしめ、水分を除去するこ
とを特徴とした実装プリント回路基板の水分除去方法。[Scope of Claims] In a method for removing moisture attached to the mounted printed circuit board after cleaning the mounted printed circuit board on which an IC or the like is mounted by ultrasonic cleaning or the like; In the process of drilling a hole 1b penetrating from the front surface to the back surface in a part other than the circuit pattern of the board 1, and transferring the mounted printed circuit board 1 from one side to the other,
By discharging compressed air from above the mounted printed circuit board 1, the moisture adhering to the mounted printed circuit board 1 is sent into the hole 1b, and the moisture is caused to fall by the air pressure and gravity of the compressed air, while at the same time A method for removing moisture from a mounted printed circuit board, characterized in that air is sucked from below the mounted printed circuit board 1 to suck up falling moisture and remove the moisture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19640089A JPH0360187A (en) | 1989-07-28 | 1989-07-28 | Method for removing water from mounted printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19640089A JPH0360187A (en) | 1989-07-28 | 1989-07-28 | Method for removing water from mounted printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0360187A true JPH0360187A (en) | 1991-03-15 |
Family
ID=16357240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19640089A Pending JPH0360187A (en) | 1989-07-28 | 1989-07-28 | Method for removing water from mounted printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0360187A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0537186A (en) * | 1991-07-25 | 1993-02-12 | Nippon Chemicon Corp | Foreign substance removing device |
| KR100888106B1 (en) * | 2001-02-20 | 2009-03-11 | 다이오 페이퍼 코퍼레이션 | Interfolder |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926224U (en) * | 1982-08-06 | 1984-02-18 | 三菱電機株式会社 | Cooling device for current limiting resistor for switching switch |
-
1989
- 1989-07-28 JP JP19640089A patent/JPH0360187A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926224U (en) * | 1982-08-06 | 1984-02-18 | 三菱電機株式会社 | Cooling device for current limiting resistor for switching switch |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0537186A (en) * | 1991-07-25 | 1993-02-12 | Nippon Chemicon Corp | Foreign substance removing device |
| KR100888106B1 (en) * | 2001-02-20 | 2009-03-11 | 다이오 페이퍼 코퍼레이션 | Interfolder |
| US7775958B2 (en) | 2001-02-20 | 2010-08-17 | Daio Paper Corporation | Sanitary tissue paper, method of producing the same, carton box for sanitary tissue paper, sanitary tissue paper package, interfolder, and apparatus and method of conveying sanitary tissue paper package |
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