JPH0361352U - - Google Patents
Info
- Publication number
- JPH0361352U JPH0361352U JP12090589U JP12090589U JPH0361352U JP H0361352 U JPH0361352 U JP H0361352U JP 12090589 U JP12090589 U JP 12090589U JP 12090589 U JP12090589 U JP 12090589U JP H0361352 U JPH0361352 U JP H0361352U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- module
- board
- cooling structure
- immersion cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 2
- 239000002826 coolant Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は、本考案の実施例を示す図であり、第
２図は、本考案のＬＳＩ外観図、第３図は、従来
の構造を示す図であり、第４図は、従来のＬＳＩ
外観図である。
図において、１……モジユール、２……基板、
３……ＬＳＩ、４……ヒートシンク、５……フイ
ン、６……ノズル、７……スペーサ、９……給水
路、１０……排水路をそれぞれ示す。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is an external view of the LSI of the present invention, FIG. 3 is a diagram showing the conventional structure, and FIG. 4 is a diagram showing the conventional LSI.
It is an external view. In the figure, 1... module, 2... board,
3...LSI, 4...heat sink, 5...fin, 6...nozzle, 7...spacer, 9...supply channel, 10...drain channel.
Claims (1)
するノズル６を有するモジユール１と、 該基板２と該モジユール１とを密閉状態に保つ
スペーサ７とにより構成され、 該ＬＳＩ３を個別に冷却してなる浸漬冷却構造
に於いて、 前記モジユール１における前記基板側面１ａを
平面とし、 前記ＬＳＩ３の上面に、該モジユール１に向か
つて突出延長された受け皿状のフイン５を有する
ヒートシンク４を形成したことを特徴とする浸漬
冷却構造。[Claims for Utility Model Registration] A board 2, an LSI 3 mounted on the board 2, a module 1 having a nozzle 6 that sprays a coolant corresponding to the mounting position of the LSI 3, the board 2 and the module In the immersion cooling structure in which the LSI 3 is individually cooled, the substrate side surface 1a of the module 1 is a flat surface, and the module 1 is placed on the top surface of the LSI 3. 1. An immersion cooling structure characterized in that a heat sink 4 is formed with saucer-shaped fins 5 extending protrudingly toward 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12090589U JPH0361352U (en) | 1989-10-18 | 1989-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12090589U JPH0361352U (en) | 1989-10-18 | 1989-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361352U true JPH0361352U (en) | 1991-06-17 |
Family
ID=31668955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12090589U Pending JPH0361352U (en) | 1989-10-18 | 1989-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361352U (en) |
-
1989
- 1989-10-18 JP JP12090589U patent/JPH0361352U/ja active Pending