JPH0361508A - Electrically conductive resin molding material - Google Patents
Electrically conductive resin molding materialInfo
- Publication number
- JPH0361508A JPH0361508A JP1197783A JP19778389A JPH0361508A JP H0361508 A JPH0361508 A JP H0361508A JP 1197783 A JP1197783 A JP 1197783A JP 19778389 A JP19778389 A JP 19778389A JP H0361508 A JPH0361508 A JP H0361508A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- specific gravity
- resin pellet
- fillers
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 58
- 239000011347 resin Substances 0.000 title claims abstract description 58
- 239000012778 molding material Substances 0.000 title claims abstract description 10
- 239000008188 pellet Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 230000005484 gravity Effects 0.000 claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 11
- 239000000835 fiber Substances 0.000 abstract description 11
- 238000000465 moulding Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
- B29B9/14—Making granules characterised by structure or composition fibre-reinforced
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、所望電気特性を有する導電性樹脂成形品、殊
に電磁波妨害（ＥＭＩ）対策用樹脂成形品を高い再現性
をもって達成するに適する導電性樹脂成形材料に関する
ものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention is suitable for achieving a conductive resin molded product having desired electrical characteristics, particularly a resin molded product for electromagnetic interference (EMI) countermeasures, with high reproducibility. This invention relates to conductive resin molding materials.
電子機器類の発生する電磁波が、周囲機器又は人体等に
影響を及ぼし、または反対に周囲からの電磁波が電子機
器類に妨害を与えることが問題視されている。このよう
な電磁波妨害（ＥＭＩ）対策としては、機器類のシャー
シ（ハウジング）に導電性材料を使用することにより、
シールドする方法が多く採用されている。電磁波を遮蔽
する目的で樹脂シャーシの内表面に導電性被膜や金属箔
を設けることもある。しかしこのような外部的改善策で
は、工程数が増加するため製造コストの上昇を招き、そ
の上導電性被膜にあっては特性の経時変化や外部損傷等
により導電特性の変動を招きやすく好ましくない。It is considered a problem that electromagnetic waves generated by electronic devices affect surrounding devices or the human body, or conversely, that electromagnetic waves from the surroundings interfere with electronic devices. As a countermeasure against such electromagnetic interference (EMI), by using conductive materials in the chassis (housing) of equipment,
Many shielding methods are used. A conductive coating or metal foil may be provided on the inner surface of the resin chassis for the purpose of shielding electromagnetic waves. However, such external improvement measures are undesirable because they increase the number of steps, which increases manufacturing costs, and in the case of conductive films, the conductive properties tend to change over time or due to external damage. .
そこで、樹脂中に導電性フィラーを充填し、内部的に導
電特性を改善する技術も多用されている。Therefore, a technique of filling the resin with a conductive filler to improve the conductive properties internally is also frequently used.
この場合には、フィラーが均一に分散し、かつ導電材同
士の接触が十分に保証されなければならない。かかる目
的のために、導電性繊維と低融点金属とを予め樹脂中に
充填する技術も知られている（例えば、特開昭６３−２
１８３０９号、同６３−２３８１６２、同６３−２３８
１６３ 、同６３−２５１４６８号等参照）。In this case, the filler must be uniformly dispersed and sufficient contact between the conductive materials must be ensured. For this purpose, a technique is also known in which conductive fibers and a low-melting point metal are filled in a resin in advance (for example, Japanese Patent Laid-Open No. 63-2
No. 18309, No. 63-238162, No. 63-238
163, No. 63-251468, etc.).
これら各先行技術においては、導電性繊維と低融点金属
とを樹脂中に充填したマスターペレットを作成しておき
、このマスターペレットと樹脂のみのペレット（ナチュ
ラルペレット）とを適宜量配合して所望の電磁波障害防
止効果を発揮する導電性樹脂成形材料を得ている。これ
は、導電性繊維にハンダ等の低融点金属を添加しておき
、これらの両成分の相乗作用により高い導電性を達成し
ようとするものである。しかし、導電性繊維ならびに低
融点金属の配合されたペレットとナチュラルペレットと
は一般に比重が異なるため比重の大きいペレットが沈降
して供給ムラが発生する、いわゆるセグリ現象が発生ず
る。したがって、フィラーの均一な分散により所望の導
電特性を得ようとする目的に対して十分な成果を上げる
に至っていない。In each of these prior art techniques, a master pellet is prepared by filling a resin with conductive fibers and a low-melting point metal, and an appropriate amount of this master pellet and a resin-only pellet (natural pellet) are blended to obtain the desired result. We have obtained a conductive resin molding material that exhibits the effect of preventing electromagnetic interference. This is an attempt to achieve high conductivity by adding a low melting point metal such as solder to the conductive fibers, and the synergistic effect of these two components. However, since pellets containing conductive fibers and low melting point metals and natural pellets generally have different specific gravity, the so-called segregation phenomenon occurs in which pellets with higher specific gravity settle and uneven supply occurs. Therefore, sufficient results have not been achieved for the purpose of obtaining desired conductive properties through uniform dispersion of filler.
本発明は、上述の従来技術の欠点を解消し、所望特性の
樹脂成形品を得ることができる導電性樹脂成形材料を提
供しようとするものである。The present invention aims to eliminate the drawbacks of the above-mentioned prior art and to provide a conductive resin molding material that can produce resin molded products with desired characteristics.
本発明は、特許請求の範囲に記載の構成、すなわち、（
ａ）繊維状金属を包囲し、必要に応じてその他のフィラ
ーが配合された第１の樹脂ペレット、及び（１））低融
点金属及び必要に応じてその他のフィラーが配合された
第２の樹脂ペレット、から成り、前記第１の樹脂ペレッ
トと、前記第２の樹脂ペレットとの比重差が所定範囲と
なるように調整される導電性樹脂成形材料を特徴とし、
さらに、この場合の第１の樹脂ペレットと第２の樹脂ペ
レットとの比重差が、０．６以内となるように前もって
調整されていることを特徴とするものである。The present invention has the configuration described in the claims, that is, (
a) a first resin pellet surrounding the fibrous metal and containing other fillers as necessary, and (1)) a second resin containing a low melting point metal and other fillers as necessary; pellets, and is characterized by a conductive resin molding material that is adjusted so that the difference in specific gravity between the first resin pellet and the second resin pellet is within a predetermined range,
Furthermore, the present invention is characterized in that the difference in specific gravity between the first resin pellet and the second resin pellet in this case is adjusted in advance to within 0.6.
本発明にかかる導電性樹脂成形材料によれば、それぞれ
異なるフィラーを包含する第１および第２の樹脂ペレッ
トは、その比重差が所定範囲となるように調整されてい
るから、成形機に供給するに際し定められた配合比率に
従って混合・供給される。したがって、各フィラーは所
望比率で均等に分散せしめられ、その結果所望導電特性
の樹脂成形品を容易に得ることができる。この場合の両
樹脂ペレット間の比重差が０．５程度以内であれば、前
述の効果はより有効に発揮される。According to the conductive resin molding material according to the present invention, the first and second resin pellets each containing a different filler are adjusted so that the difference in specific gravity thereof is within a predetermined range, and therefore, the first and second resin pellets are supplied to the molding machine. They are mixed and supplied according to the specified mixing ratio. Therefore, each filler is uniformly dispersed in a desired ratio, and as a result, a resin molded article having desired conductive properties can be easily obtained. In this case, if the difference in specific gravity between both resin pellets is within about 0.5, the above-mentioned effects will be more effectively exhibited.
以下、実施例を示す添付図を参照しつつ、本発明を開示
する。Hereinafter, the present invention will be disclosed with reference to the accompanying drawings, which illustrate embodiments.
第１図は、本発明にかかる導電性繊維１０及び必要に応
じてその他のフィラー１６を包含する第１の樹脂ペレッ
ト１２を、第２図は、低融点金属２０及び必要に応じて
その他のフィラー２６を包含する第２の樹脂ペレット２
２を示す説明図である０両図において、１４および２４
は熱可塑性樹脂であり、通常は直径約２〜４１ＩＩ１１
、長さ２〜５ｍｍ程度の寸法に仕上げられる。FIG. 1 shows a first resin pellet 12 containing a conductive fiber 10 according to the present invention and other fillers 16 as necessary, and FIG. 2 shows a first resin pellet 12 containing a low melting point metal 20 and other fillers as necessary. Second resin pellet 2 containing 26
2, 14 and 24
is a thermoplastic resin and typically has a diameter of about 2 to 41II11
, the length is about 2 to 5 mm.
導電性繊維を包囲する第１の樹脂ペレットを構成する樹
脂１４としては、ポリフェニレンエーテル（ＰＰＥ）、
ポリカーボネート（ＰＣ）、ポリアミド（ＰＡ）、ポリ
ブチレンチレフタレ−１−（ＰＢＴ） 、 ＡＢＳ樹脂
、ポリスチレンその他の各種の樹脂を単独または組合わ
せて使用することができる。また第２の樹脂ペレットを
構成する樹脂２４としては、第１の樹脂ペレットとの滌
合にあたって相溶性が良く、しかも樹脂の特性を損なわ
ないものが望ましい。The resin 14 constituting the first resin pellet surrounding the conductive fibers includes polyphenylene ether (PPE),
Polycarbonate (PC), polyamide (PA), polybutylene terephthalate (PBT), ABS resin, polystyrene, and other various resins can be used alone or in combination. The resin 24 constituting the second resin pellet is preferably one that has good compatibility with the first resin pellet and does not impair the properties of the resin.
導電性繊維１０としては、ＳＵＳ 、銅、黄銅、アルミ
ニウム、ニッケル、表面に金属被覆を有する各種繊維等
があげられる。その他繊維状に加工可能な金属であれば
、上述以外の多くの素材を利用することができる。Examples of the conductive fiber 10 include SUS, copper, brass, aluminum, nickel, and various types of fibers having metal coatings on their surfaces. Many other materials other than those mentioned above can be used as long as they are metals that can be processed into fibers.
低融点金属２０としては、第１および第２の両樹脂ペレ
ット混合後の加工条件では熔解するが第２の樹脂ペレッ
トの加工条件では溶解しないことが望ましい。具体的に
は、錫−鉛を主成分とするハンダ合金、錫−鉛一カドミ
ウムー銀−鉛を主成分とする高温ハンダ合金、錫−鉛−
カドごラムを主成分とする低温ハンダ等がある。なお、
これらハンダはフラックスを包含するものを使用するこ
とができる。It is desirable that the low melting point metal 20 melts under the processing conditions after mixing both the first and second resin pellets, but does not melt under the processing conditions for the second resin pellet. Specifically, solder alloys whose main components are tin-lead, high-temperature solder alloys whose main components are tin-lead-cadmium-silver-lead, and tin-lead-
There are low-temperature solders whose main ingredient is cadgolam. In addition,
These solders may contain flux.
第１および／または第２の両樹脂ペレットの樹脂１４．
２４には、必要に応して金属粉、炭素粉、ガラス繊維そ
の他の樹脂の改質に有用なフィラーＬ６２６を適宜量充
填することができる。Resin 14 of both the first and/or second resin pellets.
24 can be filled with an appropriate amount of filler L626, which is useful for modifying metal powder, carbon powder, glass fiber, and other resins, if necessary.
両樹脂ペレットは、その比重差が所定範囲、例えば０．
６程度以内となるように調整されていることが望ましい
。−例として、導電性繊維を包含する樹脂ペレットの比
重が、例えば１．６であったとすると、低融点金属を包
含するペレットは±０．３、すなわち１．３〜１．９と
なるように比重差を調整する。かかる比重調整は、相対
的に実施されれば足り、必ずしも一方のみで行う必要は
ない。したがって、導電性金属の種類、太さ、充填量等
を勘案し、低融点金属の種類、太さ、フラックスの量等
をはじめ、その他の充填フィラーの種類や量、ならびに
いずれのペレットに充填するか等を選択することにより
実施することができる。Both resin pellets have a specific gravity difference within a predetermined range, for example 0.
It is desirable that the value be adjusted to within about 6. - As an example, if the specific gravity of a resin pellet containing conductive fibers is, for example, 1.6, then the specific gravity of a pellet containing a low melting point metal is ±0.3, that is, 1.3 to 1.9. Adjust the specific gravity difference. It is sufficient that such specific gravity adjustment is performed relatively, and it is not necessarily necessary to perform it only on one side. Therefore, taking into consideration the type, thickness, filling amount, etc. of the conductive metal, the type, thickness, amount of flux, etc. of the low melting point metal, the type and amount of other fillers, and which pellets to fill. This can be implemented by selecting either of the following.
このように比重差が所定範囲内にあるように調整された
２種類のペレットを用いて成形を行えばセグリ現象を伴
うことなしに成形機への材料ペレットの供給が所望比率
で正確に行われる。したがって成形品中のフィラーの分
散不良の発生が回避される。なお、このような手法は、
成形機における成形工程のみならず押出機におけるマス
ターバッチ押出し法に適用することができる。If molding is performed using two types of pellets whose specific gravity difference is adjusted within a predetermined range in this way, the material pellets can be accurately supplied to the molding machine at the desired ratio without the sagging phenomenon. . Therefore, occurrence of poor dispersion of filler in the molded product is avoided. Note that such a method is
It can be applied not only to the molding process in a molding machine but also to the masterbatch extrusion method in an extruder.
第１図は、本発明にかかる第１の樹脂ペレットの構成を
、そして第２図は第２の樹脂ペレットの構造を示す実施
例の説明図である。
図中の参照符号の対応は以下の通り。FIG. 1 is an explanatory diagram of an example showing the structure of a first resin pellet according to the present invention, and FIG. 2 is an explanatory diagram showing the structure of a second resin pellet. The correspondence of reference symbols in the figure is as follows.
Claims (1)
フィラーが配合された第１の樹脂ペレット、及び（ｂ）
低融点金属及び必要に応じてその他のフィラーが配合さ
れた第２の樹脂ペレット、 から成り、前記第１の樹脂ペレットと、前記第２の樹脂
ペレットとの比重差が所定範囲となるように調整される
ことを特徴とする導電性樹脂成形材料。 ２）請求項１）記載の導電性樹脂成形材料において、前
記第１の樹脂ペレットと第２の樹脂ペレットとの比重差
が、０．６以下となるように調整されたもの。[Claims] 1) (a) a first resin pellet surrounding a fibrous metal and containing other fillers as necessary; and (b)
a second resin pellet blended with a low melting point metal and other fillers as necessary, and adjusted so that the difference in specific gravity between the first resin pellet and the second resin pellet is within a predetermined range. A conductive resin molding material characterized by: 2) The conductive resin molding material according to claim 1), wherein the difference in specific gravity between the first resin pellet and the second resin pellet is adjusted to be 0.6 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1197783A JPH0361508A (en) | 1989-07-31 | 1989-07-31 | Electrically conductive resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1197783A JPH0361508A (en) | 1989-07-31 | 1989-07-31 | Electrically conductive resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361508A true JPH0361508A (en) | 1991-03-18 |
Family
ID=16380279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1197783A Pending JPH0361508A (en) | 1989-07-31 | 1989-07-31 | Electrically conductive resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361508A (en) |
-
1989
- 1989-07-31 JP JP1197783A patent/JPH0361508A/en active Pending
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