JPH0987528A - Resin composition containing metal fiber - Google Patents
Resin composition containing metal fiberInfo
- Publication number
- JPH0987528A JPH0987528A JP8182154A JP18215496A JPH0987528A JP H0987528 A JPH0987528 A JP H0987528A JP 8182154 A JP8182154 A JP 8182154A JP 18215496 A JP18215496 A JP 18215496A JP H0987528 A JPH0987528 A JP H0987528A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal fiber
- fiber
- coil material
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 102
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 98
- 239000002184 metal Substances 0.000 title claims abstract description 98
- 239000011342 resin composition Substances 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 31
- 238000005520 cutting process Methods 0.000 claims abstract description 29
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- 239000012756 surface treatment agent Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 27
- 239000007822 coupling agent Substances 0.000 abstract description 15
- -1 polypropylene Polymers 0.000 abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 238000002156 mixing Methods 0.000 abstract description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 6
- 239000011888 foil Substances 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 6
- 229910001369 Brass Inorganic materials 0.000 abstract description 5
- 239000010951 brass Substances 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000010935 stainless steel Substances 0.000 abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004743 Polypropylene Substances 0.000 abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 239000010931 gold Substances 0.000 abstract description 3
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 239000010936 titanium Substances 0.000 abstract description 3
- 229910052719 titanium Inorganic materials 0.000 abstract description 3
- 229920001903 high density polyethylene Polymers 0.000 abstract description 2
- 239000004700 high-density polyethylene Substances 0.000 abstract description 2
- 229920001684 low density polyethylene Polymers 0.000 abstract description 2
- 239000004702 low-density polyethylene Substances 0.000 abstract description 2
- 229920001179 medium density polyethylene Polymers 0.000 abstract description 2
- 239000004701 medium-density polyethylene Substances 0.000 abstract description 2
- 229920001155 polypropylene Polymers 0.000 abstract description 2
- 239000004800 polyvinyl chloride Substances 0.000 abstract description 2
- 229920000915 polyvinyl chloride Polymers 0.000 abstract description 2
- 238000007380 fibre production Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 229920005669 high impact polystyrene Polymers 0.000 description 15
- 239000004797 high-impact polystyrene Substances 0.000 description 15
- 239000004793 Polystyrene Substances 0.000 description 13
- 239000008188 pellet Substances 0.000 description 13
- 229920002223 polystyrene Polymers 0.000 description 13
- 238000000465 moulding Methods 0.000 description 8
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 7
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 7
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 229920001955 polyphenylene ether Polymers 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 235000012438 extruded product Nutrition 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229920000426 Microplastic Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- 150000004645 aluminates Chemical class 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- VTIXMGZYGRZMAW-UHFFFAOYSA-N ditridecyl hydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)OCCCCCCCCCCCCC VTIXMGZYGRZMAW-UHFFFAOYSA-N 0.000 description 2
- 239000004816 latex Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical group C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- SRORDPCXIPXEAX-UHFFFAOYSA-N CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC Chemical compound CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC SRORDPCXIPXEAX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- AVMVHINONUBVEA-UHFFFAOYSA-N [Na].S1SSC=C1.N1=NN=CC=C1 Chemical compound [Na].S1SSC=C1.N1=NN=CC=C1 AVMVHINONUBVEA-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- XHWQYYPUYFYELO-UHFFFAOYSA-N ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP([O-])OCCCCCCCCCCCCC XHWQYYPUYFYELO-UHFFFAOYSA-N 0.000 description 1
- NCXTWAVJIHJVRV-UHFFFAOYSA-N ethane-1,2-diol;16-methylheptadecanoic acid;titanium Chemical compound [Ti].OCCO.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O NCXTWAVJIHJVRV-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- ICRFXIKCXYDMJD-UHFFFAOYSA-N n'-benzyl-n'-ethenyl-n-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN(C=C)CC1=CC=CC=C1 ICRFXIKCXYDMJD-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- FKGFBYXUGQXYKX-UHFFFAOYSA-N phenyl ethaneperoxoate Chemical compound CC(=O)OOC1=CC=CC=C1 FKGFBYXUGQXYKX-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 102220198259 rs749415085 Human genes 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Hard Magnetic Materials (AREA)
- Soft Magnetic Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
- Reinforced Plastic Materials (AREA)
- Moulding By Coating Moulds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電磁波シールド
性、分散性、剛性及び表面外観の改良された導電性材
料、特に電磁波シールド部材に関するものである。TECHNICAL FIELD The present invention relates to a conductive material having improved electromagnetic wave shielding properties, dispersibility, rigidity and surface appearance, and more particularly to an electromagnetic wave shielding member.
【0002】[0002]
【従来の技術】電気回路及びICは各種の電気機器に用
いられているが、外部、内部から発生する電磁波により
誤動作することがある。これを防止するため、電磁波の
発生を回路設計の変更により低減することが行われてい
るが限界があり、電磁波シールド性のある材料により覆
うことがなされている。これらの材料は、樹脂成形品に
メッキ、塗装、溶射等により導電性の皮膜を形成する方
法が採られているが別工程が必要でありコストもかか
る。そこで、樹脂自体にシールド性を持たせることが行
われている。樹脂にシールド性を持たせる方法として
は、金属の繊維、箔、粒子又はカーボンブラック、カー
ボンファイバー、フェライト、チタン酸バリウム等を混
練りする方法が知られている。これらの中で、金属繊維
による方法が少ない量でより高いシールド特性を示す。
従来、細い金属繊維を作るのには、集束伸線引き抜き
法、溶融紡糸法等が知られている。いずれの方法でも、
細い金属繊維を得るためには工程が多くかかりコストが
かかる、長繊維を得られない等の欠点があり、樹脂に混
練りしても電磁波シールド性、剛性、表面外観等が満足
すべきレベルに到達していなかった。2. Description of the Related Art Electric circuits and ICs are used in various electric devices, but they sometimes malfunction due to electromagnetic waves generated from outside or inside. In order to prevent this, the generation of electromagnetic waves has been reduced by changing the circuit design, but there is a limit, and they are covered with a material having electromagnetic wave shielding properties. For these materials, a method of forming a conductive film on a resin molded product by plating, painting, thermal spraying or the like is adopted, but a separate step is required and cost is required. Therefore, the resin itself is given a shield property. As a method of imparting shielding properties to a resin, a method of kneading metal fibers, foils, particles, or carbon black, carbon fiber, ferrite, barium titanate, or the like is known. Among these, the method using metal fibers shows higher shielding properties in a small amount.
Conventionally, a focused wire drawing method, a melt spinning method, and the like are known for producing fine metal fibers. Either way,
There are drawbacks such as many steps and cost to obtain thin metal fibers, and it is not possible to obtain long fibers, and even if kneaded with resin, electromagnetic wave shielding property, rigidity, surface appearance, etc. should be at a satisfactory level. Had not arrived.
【0003】さらに、これらの金属繊維を樹脂中に充填
した場合、分散不良を起こし、充分な電磁波シールド効
果が得られなかったり、成形品の機械強度が低下すると
いう問題があった。金属繊維の分散性を向上させるため
に、金属繊維表面にカップリング剤の層を設ける方法
は、例えば特開昭60−18314、特開昭60−11
2854号公報に開示されているが、これらはコイル材
切削法の繊維を使用しておらず、また、繊維を作製した
後に表面処理を施している。Further, when these metal fibers are filled in a resin, there are problems that dispersion failure occurs, a sufficient electromagnetic wave shielding effect cannot be obtained, and the mechanical strength of a molded product is lowered. A method for providing a layer of a coupling agent on the surface of metal fibers in order to improve the dispersibility of the metal fibers is disclosed in, for example, JP-A-60-18314 and JP-A-60-11.
Although disclosed in Japanese Patent No. 2854, these do not use the fiber of the coil material cutting method, and the surface treatment is performed after the fiber is produced.
【0004】[0004]
【発明が解決しようとする課題】本発明は、こうした状
況の下に、金属繊維の分散性に優れ、電磁シールド性、
衝撃強度、剛性、表面外観、等にも優れた金属繊維充填
樹脂組成物、それによる電磁シールド部材を提供し、ま
た前記金属繊維充填樹脂組成物の製造に好適な金属繊維
およびその製法を提供することを目的とするものでる。Under the circumstances, the present invention has excellent dispersibility of metal fibers, electromagnetic shielding property, and
Provided are a metal fiber-filled resin composition excellent in impact strength, rigidity, surface appearance, and the like, an electromagnetic shield member using the same, and a metal fiber suitable for producing the metal fiber-filled resin composition and a method for producing the same. It is intended for that.
【0005】[0005]
【課題を解決するための手段】このような状況下にあっ
て、電磁波シールド材料について、鋭意検討の結果、本
発明に至ったものである。Under these circumstances, the present invention has been accomplished as a result of intensive studies on electromagnetic wave shielding materials.
【0006】即ち、本発明は、(I)熱可塑性樹脂99
〜30重量%及び、(II)コイル材切削法により作製
された金属繊維1〜70重量%よりなる樹脂組成物、及
び電磁波シールド部材に関する。さらには(II)の金
属繊維を表面処理剤で処理することを特徴とする。That is, the present invention provides (I) a thermoplastic resin 99.
To 30 wt% and (II) 1 to 70 wt% of metal fibers produced by the coil material cutting method, and an electromagnetic wave shield member. Furthermore, it is characterized in that the metal fiber of (II) is treated with a surface treatment agent.
【0007】以下詳細に本発明について説明する。The present invention will be described in detail below.
【0008】本発明において用いられる熱可塑性樹脂
は、とくに制限はないが、たとえば低、中、高密度ポリ
エチレン、ポリプロピレン、ポリ塩化ビニル、ポリスチ
レン、アクリロニトリル−スチレン共重合体、アクリロ
ニトリル−ブタジエン−スチレン共重合体(以下ABS
樹脂と略記する)、ポリアミド、ポリアセタール、ポリ
カーボネート、ポリエチレンテレフタレート、ポリブチ
レンテレフタレート、ポリフェニレンエーテル(以下P
PEと略記する)、ポリメチルメタアクリレート、ポリ
エーテルイミド、スチレン−ブタジエン共重合体及びそ
の水素添加組成物等及びこれら2種類以上の組み合わせ
のポリマーブレンド、例えば、ポリカーボネートとアク
リロニトリル−ブタジエン−スチレン共重合体、ポリフ
ェニレンエーテルとポリスチレン等を挙げることが出来
る。特に、ハイインパクトポリスチレン(以下HIPS
と略記する)、アクリロニトリル−スチレン共重合体、
アクリロニトリル−ブタジエン−スチレン共重合体、ポ
リフェニレンエーテル、ポリアミド及びポリカーボネー
ト、これらの樹脂の単独、そのアロイが好ましい。ガラ
スファイバー又はカーボンファイバー等により強化した
樹脂も用いることが出来る。The thermoplastic resin used in the present invention is not particularly limited, but examples thereof include low, medium and high density polyethylene, polypropylene, polyvinyl chloride, polystyrene, acrylonitrile-styrene copolymer, acrylonitrile-butadiene-styrene copolymer. Combined (hereinafter ABS
Abbreviated as resin), polyamide, polyacetal, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene ether (hereinafter P
Abbreviated as PE), polymethylmethacrylate, polyetherimide, styrene-butadiene copolymers and hydrogenated compositions thereof, and polymer blends of two or more thereof, such as polycarbonate and acrylonitrile-butadiene-styrene copolymer. Coalescence, polyphenylene ether, polystyrene, etc. can be mentioned. In particular, high impact polystyrene (hereinafter referred to as HIPS
Abbreviated), acrylonitrile-styrene copolymer,
Acrylonitrile-butadiene-styrene copolymer, polyphenylene ether, polyamide and polycarbonate, homopolymers of these resins, and alloys thereof are preferred. Resins reinforced with glass fibers or carbon fibers can also be used.
【0009】本発明において用いられる金属繊維の金属
種はステンレス、黄銅、銅、アルミニウム、鉄、金、
銀、ニッケル、チタン、錫、鉛、アンチモン、亜鉛、カ
ドミウム、マグネシウム、タングステン、白金、リチウ
ム、モリブデン、ベリリウム及びこれら2種類以上の組
み合わせの合金、もしくはこれらを主体とする合金、さ
らにはこれらとリンとの化合物等が挙げられる。これら
の中でもステンレス、黄銅、銅、アルミニウム、鉄、
金、銀、ニッケル、チタンが好ましい。The metal species of the metal fibers used in the present invention are stainless steel, brass, copper, aluminum, iron, gold,
Silver, nickel, titanium, tin, lead, antimony, zinc, cadmium, magnesium, tungsten, platinum, lithium, molybdenum, beryllium and alloys of two or more of these, or alloys containing these as the main constituents, and phosphorus with these. And the like. Among these, stainless steel, brass, copper, aluminum, iron,
Gold, silver, nickel and titanium are preferred.
【0010】コイル材切削法とは、ほぼ旋盤と同様の構
造、機能を持った金属繊維製造装置に、金属箔板をコイ
ル材状に装着し、その端面を切削して金属繊維を得る方
法である。例えば、EMC 1992.11.5. <
No.55> p78〜82に記載されている方法が挙
げられる。コイル材は市販の金属箔を連続して主軸ドラ
ムに巻き取る事により得られる。The coil material cutting method is a method for obtaining a metal fiber by mounting a metal foil plate in a coil material shape on a metal fiber manufacturing apparatus having a structure and a function substantially similar to a lathe and cutting the end face thereof. is there. For example, EMC 1992.11.5. <
No. 55> pages 78 to 82. The coil material is obtained by continuously winding a commercially available metal foil on a spindle drum.
【0011】巻き取る際に、金属板の少なくとも一表面
に表面処理剤に塗布もしくは浸すことにより表面処理す
ることが望ましい。また、このような表面処理の替わり
に、巻き取る際に、樹脂を溶かした溶液に浸し樹脂で金
属箔をコーティングしながら巻き取ることも有効であ
る。この場合、後で混合する樹脂と同じ樹脂か又は相溶
性の良い樹脂をコーティングすることがより好ましい。
更に、上記コーティング樹脂中に上記表面処理剤をあら
かじめ混練したものを用いることも更に好ましい。At the time of winding, it is desirable that at least one surface of the metal plate is surface-treated by applying or dipping it on a surface-treating agent. Further, instead of such a surface treatment, it is also effective to dip it in a solution in which the resin is dissolved and coat the metal foil with the resin to wind it up. In this case, it is more preferable to coat the same resin as the resin to be mixed later or a resin having good compatibility.
Further, it is more preferable to use a material obtained by previously kneading the surface treatment agent in the coating resin.
【0012】さらに、樹脂のフィルムを金属箔に挟みコ
イル材を作製することも有効である。その際、後で混合
する樹脂と同じか又は相溶性の良い樹脂を挟むとより良
好である。また、上記樹脂フィルムに上記表面処理剤が
混練されているものを使用することも更に好ましい。Further, it is also effective to produce a coil material by sandwiching a resin film between metal foils. At that time, it is more preferable to sandwich a resin having the same or good compatibility with the resin to be mixed later. Further, it is more preferable to use a resin film in which the surface treatment agent is kneaded.
【0013】これらの巻き取り時の処理においては、表
面処理剤を金属表面に塗布もしくは浸すことにより表面
処理する方法が最も好ましく、金属繊維の分散性を向上
させ、電磁波シールド性、機械特性を向上させることが
できる。In these winding treatments, the method of applying the surface treatment by coating or dipping the surface of the metal on the metal surface is most preferable, and the dispersibility of the metal fibers is improved, and the electromagnetic wave shielding property and the mechanical property are improved. Can be made.
【0014】本発明において用いられる表面処理剤とし
ては、チタネート系カップリング剤、シラン系カップリ
ング剤、アルミネート系カップリング剤、ジルコニアア
ルミネート系カップリング剤などのカップリング剤やト
リアジンチオール化合物などを用いることができる。こ
の中でもとくにチタネート系カップリング剤およびシラ
ン系カップリング剤が好ましい。The surface treatment agent used in the present invention includes coupling agents such as titanate coupling agents, silane coupling agents, aluminate coupling agents, zirconia aluminate coupling agents, triazine thiol compounds and the like. Can be used. Of these, titanate-based coupling agents and silane-based coupling agents are particularly preferred.
【0015】チタネート系カップリング剤の例として
は、イソプロピルトリイソステアロイルチタネート、イ
ソプロピルオクタノイルチタネート、イソプロピルジメ
タクリルイソステアロイルチタネート、イソプロピルト
リドデシルベンゼンスルホニルチタネート、イソプロピ
ルイソステアロイルジアクリルチタネート、イソプロピ
ルトリ(ジオクチルホスフェート)チタネート、イソプ
ロピルリクミルフェニルチタネート、イソプロピルトリ
ス(ジオクチルパイロホスフェート)チタネート、イソ
プロピルトリ(n−アミノエチル−アミノエチル)チタ
ネート、テトライソプロピルビス(ジオクチルフォスフ
ァイト)チタネート、テトラオクチルビス(ジトリデシ
ルホスファイト)チタネート、テトラ(2,2−ジアリ
ルオキシメチル−1−プチル)ビス(ジトリデシル)ホ
スファイトチタネート、ジクミルフェニルオキシアセテ
ートチタネート、ビス(ジオクチルパイロホスフェー
ト)オキシアセテートチタネート、ジイソステアロイル
エチレンチタネート、ピス(ジオクチルパイロホスフェ
ート)エチレンチタネートなどが挙げられる。なかでも
イソプロピルトリイソステアロイルチタネート、イソプ
ロピルトリドデシルベンゼンスルホニルチタネート、イ
ソプロピルトリス(ジオクチルパイロホスフェート)チ
タネート、イソプロピルトリ(n−アミノエチル−アミ
ノエチル)チタネート、テトライソプロピルビス(ジオ
クチルフォスファイト)チタネート、テトラオクチルビ
ス(ジトリデシルホスファイト)チタネート、テトラ
(2,2−ジアリルオキシメチル−1−プチル)ビス
(ジトリデシル)ホスファイトチタネート、ビス(ジオ
クチルパイロホスフェート)オキシアセテートチタネー
ト、ピス(ジオクチルパイロホスフェート)エチレンチ
タネートが好ましい。Examples of titanate coupling agents include isopropyl triisostearoyl titanate, isopropyl octanoyl titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearoyl diacrylic titanate, isopropyl tri (dioctyl phosphate). ) Titanate, isopropyl lycumyl phenyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (n-aminoethyl-aminoethyl) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis (ditridecyl phosphite) Titanate, tetra (2,2-diallyloxymethyl-1) Heptyl) bis (ditridecyl) phosphite titanate, dicumyl phenyloxy acetate titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, diisostearoyl ethylene titanate, piston (dioctyl pyrophosphate) ethylene titanate. Among them, isopropyl triisostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (n-aminoethyl-aminoethyl) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis Preferred are (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-putyl) bis (ditridecyl) phosphite titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, pis (dioctyl pyrophosphate) ethylene titanate. .
【0016】シラン系カップリング剤の例としては、ビ
ニル系のものとして、ビニルトリメトキシシラン、ビニ
ルトリエトキシシラン、ビニルトリクロルシラン、ビニ
ルトリス(βメトキシエトキシ)シラン、アミノ系のも
のとして、N−(2−アミノエチル)3−アミノプロピ
ルメチルジメトキシシラン、N−(2−アミノエチル)
3−アミノプロピルトリメトキシシラン、N−(2−ア
ミノエチル)3−アミノプロピルトリエトキシシラン、
3−アミノプロピルトリメトキシシラン、3−アミノプ
ロピルトリエトキシシラン、N−フェニル−3−アミノ
プロピルトリメトキシシラン、エポキシ系のものとし
て、3−グリシドキシプロピルトリメトキシシラン、3
−グリシドキシプロピルトリエトキシシラン、3−グリ
シドキシプロピルメチルジメトキシシラン、2−(3,
4−エポキシシクロヘキシル)エチルトリメトキシシラ
ン、クロル系のものとして、3−クロロプロピルメチル
ジメトキシシラン、3−クロロプロピルトリメトキシシ
ラン、メタクリロキシ系のものとして、3−メタクリロ
キシプロピルトリメトキシシラン、3−メタクリロキシ
プロピルトリエトキシシラン、3−メタクリロキシプロ
ピルメチルジメトキシシラン、3−メタクリロキシプロ
ピルメチルジエトキシシラン、メルカプト系のものとし
て、3−メルカプトプロピルトリメトキシシラン、カチ
オン系のものとして、N−(2−(ビニルベンジルアミ
ノ)エチル)−3−アミノプロピルトリメトキシシラン
・塩酸塩などが挙げられる。Examples of the silane-based coupling agent include vinyl-based ones such as vinyltrimethoxysilane, vinyltriethoxysilane, vinyltrichlorosilane, vinyltris (βmethoxyethoxy) silane, and amino-based N- ( 2-Aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl)
3-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropyltriethoxysilane,
3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, epoxy-based compounds such as 3-glycidoxypropyltrimethoxysilane,
-Glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,
4-epoxycyclohexyl) ethyltrimethoxysilane, chloro-based ones such as 3-chloropropylmethyldimethoxysilane and 3-chloropropyltrimethoxysilane, and methacryloxy-based ones such as 3-methacryloxypropyltrimethoxysilane and 3-methacryl Roxypropyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-mercaptopropyltrimethoxysilane as a mercapto type, N- (2- (Vinylbenzylamino) ethyl) -3-aminopropyltrimethoxysilane / hydrochloride and the like.
【0017】アルミネート系カップリング剤の例として
は、アセトアルコキシアルミニウムジイソプロピレート
などが挙げられる。Examples of the aluminate-based coupling agent include acetoalkoxyaluminum diisopropylate.
【0018】ジルコニアアルミネート系カップリング剤
の例としては、アルコール系、およびグリコール系のも
のが挙げられる。Examples of the zirconia aluminate-based coupling agent include alcohol-based and glycol-based coupling agents.
【0019】[0019]
【化1】 Embedded image
【0020】トリアジンチオール化合物の例としては、
トリアジントリチオールモノナトリウム(TTN)など
が挙げられる。Examples of triazine thiol compounds include:
Triazine trithiol monosodium (TTN) etc. are mentioned.
【0021】これらの表面処理剤は単独で用いても良い
し、2種類以上を併用しても良い。また、これらの表面
処理剤は直接薄めることなく用いても良いし、水、有機
溶剤、熱可塑性樹脂、などで希釈して用いても良い。ま
た、これらを金属表面に塗布する方法としては、あらか
じめ金属板に塗布後切削する方法でも良いし、繊維を切
削後もしくは切削の工程と連続して表面処理剤に浸漬又
はスプレーなどで吹き付けるなどの方法を用いても良
い。These surface treatment agents may be used alone or in combination of two or more. Further, these surface treatment agents may be used without being directly diluted, or may be diluted with water, an organic solvent, a thermoplastic resin, or the like. Further, as a method of applying these to the metal surface, a method of previously applying to a metal plate and then cutting may be used, or fibers may be sprayed by dipping or spraying on the surface treatment agent after cutting or continuously with the step of cutting. A method may be used.
【0022】コイル材切削法により得られた繊維の断面
形状はほぼ長方形になり、従来からの方法である集束伸
線引き抜き法により作製された繊維の断面形状が扇型又
は多角形状であることと区別される。コイル材の金属板
面を表面処理剤で処理した場合には、コイル材の板厚と
同一幅となる少なくとも1つの面には表面処理剤が存在
したまま残るが、切削後に新らたに生ずる残りの面には
表面処理剤は存在しないこととなる。The cross-sectional shape of the fiber obtained by the coil material cutting method becomes substantially rectangular, and the cross-sectional shape of the fiber produced by the conventional focused wire drawing method is fan-shaped or polygonal. To be distinguished. When the metal plate surface of the coil material is treated with the surface treatment agent, the surface treatment agent remains on at least one surface having the same width as the plate thickness of the coil material, but is newly generated after cutting. The surface treatment agent is not present on the remaining surface.
【0023】繊維径は1μ〜500μ、好ましくは3〜
100μ、さらに好ましくは10〜60μである。繊維
長は分散した樹脂中で0.1mm以上、好ましくは0.
5mm以上である。本発明のコイル材切削法により得ら
れた繊維は連続した長繊維として作製される。この繊維
を樹脂に導入する方法は特に限定される物ではないが、
例えば、集束剤を付け一定繊維長に切った後樹脂とブレ
ンドし混練り押出する方法、高速回転翼を有するミキサ
ーに樹脂小片と混合しながら繊維を短く切りながら混合
する方法、押出機の途中又は元から連続的に繊維をフィ
ードしながら樹脂を押出す方法、金属繊維に集束剤を付
け又はそのまま樹脂で被覆し一定繊維長に切った後繊維
の入っていない樹脂とブレンドし成形する方法、及び本
発明の金属繊維を平板状にした後シートに挟みシート成
形又は圧縮成形する方法等を挙げることが出来る。本発
明において金属繊維は、1〜70重量%、好ましくは3
〜50重量%、さらに好ましくは5〜35重量%用いら
れる。The fiber diameter is 1 μ to 500 μ, preferably 3 to
It is 100μ, and more preferably 10 to 60μ. The fiber length is 0.1 mm or more in the dispersed resin, preferably 0.
5 mm or more. The fibers obtained by the coil material cutting method of the present invention are produced as continuous long fibers. The method of introducing this fiber into the resin is not particularly limited,
For example, a method of adding a sizing agent and cutting it into a constant fiber length, then blending it with a resin and kneading and extruding it, a method of mixing the resin pieces with a mixer having a high-speed rotating blade while cutting the fiber into short pieces, in the middle of an extruder or A method of extruding a resin while continuously feeding fibers from the original, a method of attaching a sizing agent to a metal fiber or coating the resin as it is, cutting it to a constant fiber length, and then blending with a resin containing no fiber, and molding. Examples include a method of forming the metal fiber of the present invention into a flat plate shape, and then sandwiching the sheet between sheets to perform sheet molding or compression molding. In the present invention, the metal fiber is 1 to 70% by weight, preferably 3
.About.50% by weight, more preferably 5 to 35% by weight.
【0024】本発明の樹脂組成物には、その特徴を損な
わない範囲で、各種の安定剤、可塑剤、難燃剤、顔料、
無機充填剤等を公知の方法に従い適宜添加して用いる事
ができる。特に電磁波シールド部材として使用する際は
難燃剤を併用することがより好ましい。The resin composition of the present invention contains various stabilizers, plasticizers, flame retardants, pigments, as long as the characteristics thereof are not impaired.
An inorganic filler or the like can be appropriately added and used according to a known method. In particular, when used as an electromagnetic wave shielding member, it is more preferable to use a flame retardant in combination.
【0025】本発明における電磁波シールド材料とは、
電磁波遮蔽効果が10dB以上あることが必要であり、
好ましくは20dB以上、さらに好ましくは30dB以
上ある必要がある。具体的な材料の使用例としては、テ
レビ、携帯電話、パソコン、ファミコン、ゲーム機、エ
アコン、複写機、電子レンジ等のハウジング、内部部
品、回路を覆う部材等又は医療機器、自動車の電子機器
を覆う材料等に用いられる。The electromagnetic wave shield material in the present invention is
It is necessary that the electromagnetic wave shielding effect is 10 dB or more,
It is preferably 20 dB or more, and more preferably 30 dB or more. Specific examples of the use of the material include housings of televisions, mobile phones, personal computers, NES, game machines, air conditioners, copying machines, microwave ovens, internal parts, members that cover circuits, medical equipment, and electronic equipment of automobiles. Used as a covering material.
【0026】本発明の樹脂組成物から、電磁波シールド
部材を成形する方法に関しては、特に限定の必要はなく
通常行われている射出成形機による成形、または溶融プ
レスによる方法、真空成形、多層成形を含むシート成形
等が用いられる。No particular limitation is imposed on the method for molding the electromagnetic wave shielding member from the resin composition of the present invention, and molding by an injection molding machine which is usually performed, a method by a melt press, a vacuum molding, or a multilayer molding is performed. Sheet molding including is used.
【0027】[0027]
【発明の実施の形態】以下、実施例によって本発明を具
体的に説明するが、本発明はこれらの実施例によって限
定されるものではない。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples.
【0028】なお、各測定は以下の条件により行う。Each measurement is performed under the following conditions.
【0029】電磁波シールド効果;アンリツ株式会社製
スペクトラムアナライザーMS623A測定機及びトラ
ッキングジェネレータMH628Aを用いて電波暗箱
で、100×100×2mmの厚さの試験片を、周波数
100から1000MHzの範囲で測定し、500MH
zの減衰値で表す。Electromagnetic wave shield effect: A spectrum analyzer MS623A measuring instrument manufactured by Anritsu Corporation and a tracking generator MH628A were used to measure a test piece having a thickness of 100 × 100 × 2 mm in a frequency range of 100 to 1000 MHz in an anechoic box. 500 MH
It is represented by the attenuation value of z.
【0030】アイゾット衝撃強さ; ASTM D25
6に準拠して測定する。Izod impact strength; ASTM D25
Measure in accordance with 6.
【0031】曲げ弾性率;ASTM D790に準拠し
て測定する。Flexural modulus; measured according to ASTM D790.
【0032】分散性;軟X線検査装置(ソフテックス社
製 SV−100A)で射出成形品中の金属繊維の分散
状態を観察し良好な物は○、さらに良好な物は◎、不良
な物は×で表す。Dispersibility: The dispersion state of the metal fibers in the injection-molded product was observed with a soft X-ray inspection device (SV-100A manufactured by Softex Co.), and a good product was ◯, a better product was ◎, and a poor product. Is represented by x.
【0033】表面外観;目視で射出成形品表面の状態を
観察し良好な物は○、さらに良好な物は◎、不良な物は
×で表す。Surface appearance: The surface condition of the injection-molded article is visually observed, and a good product is represented by ◯, a better product is represented by ⊚, and a defective product is represented by x.
【0034】参考例1 コイル材切削法による金属繊維
の作製 EMC 1992.11.5. <No.55> p7
8〜82に記載されている方法に基づいてステンレス、
黄銅、アルミニウムの金属繊維を作製した。Reference Example 1 Production of Metal Fiber by Coil Cutting Method EMC 1992.11.5. <No. 55> p7
Stainless steel based on the method described in 8 to 82,
Brass and aluminum metal fibers were produced.
【0035】すなわち、図1に示す装置を用い、厚さ3
0μmの金属薄板の両面に、ポリビニルアルコールの5
%水溶液をコーティングロールにより連続的に塗布し、
コーティング乾燥ヒーターで約20μmの被覆厚さに乾
燥した後(黄銅についてはこのコーティング操作を省い
た)、図2に示す、旋盤と同様の構造、機能を持った金
属繊維製造装置の旋削主軸ドラムに金属薄板を300回
巻き付け、その端面を工具送り量10μm/revの速
度で切刃を用いて切削することにより金属繊維を得る。
得られた繊維断面は、一辺がコイル材の板厚に一致し、
他の一辺は工具の送り量で決まる長方形の形状を示す。
繊維の断面写真により繊維断面積を測定し、円形断面の
直径に換算した換算直径は平均30μである。That is, using the apparatus shown in FIG.
On both sides of 0 μm thin metal plate,
% Aqueous solution is continuously applied by a coating roll,
After drying with a coating drying heater to a coating thickness of about 20 μm (this coating operation was omitted for brass), the turning spindle drum of a metal fiber manufacturing device with the same structure and function as the lathe shown in FIG. 2 was used. A metal thin plate is wound 300 times, and its end face is cut with a cutting blade at a tool feed rate of 10 μm / rev to obtain a metal fiber.
The obtained fiber cross section has one side corresponding to the plate thickness of the coil material,
The other side shows a rectangular shape determined by the feed amount of the tool.
The cross-sectional area of the fiber was measured by a cross-sectional photograph of the fiber, and the converted diameter converted into the diameter of the circular cross section was 30 μm on average.
【0036】参考例2 参考例1においてポリビニルアルコールの替わりにポリ
スチレンラテックスを用いた他は同様に実施する。Reference Example 2 The procedure of Reference Example 1 was repeated except that polystyrene latex was used instead of polyvinyl alcohol.
【0037】参考例3 びびり振動法によりステンレスの金属繊維を作製した。
長さ2mm、平均直径30μである。Reference Example 3 Stainless metal fibers were produced by the chatter vibration method.
The length is 2 mm and the average diameter is 30 μ.
【0038】参考例4 参考例1においてポリビニルアルコールの替わりにチタ
ネートカップリング剤(味の素社製 プレンアクト K
R38S)の3%ヘキサン溶液を用いた他は同様に実施
する。Reference Example 4 In Reference Example 1, instead of polyvinyl alcohol, a titanate coupling agent (Planeact K manufactured by Ajinomoto Co., Inc.) was used.
R38S) is used in the same manner except that a 3% hexane solution is used.
【0039】参考例5 参考例1においてポリビニルアルコールの替わりにシラ
ンカップリング剤(信越シリコーン社製 KBM50
3)の3%水溶液を用いた他は同様に実施する。Reference Example 5 Instead of polyvinyl alcohol in Reference Example 1, a silane coupling agent (KBM50 manufactured by Shin-Etsu Silicone Co., Ltd.) was used.
The same operation is performed except that the 3% aqueous solution of 3) is used.
【0040】参考例6 参考例1においてポリビニルアルコールの替わりに3%
のチタネートカップリング剤(味の素社製 プレンアク
ト KR38S)を含有するポリスチレンラテックスを
用いた他は同様に実施する。Reference Example 6 In Reference Example 1, 3% was used instead of polyvinyl alcohol.
The same procedure is performed except that the polystyrene latex containing the titanate coupling agent (Planeact KR38S manufactured by Ajinomoto Co., Inc.) is used.
【0041】参考例7 図3に示す、異種材料積層巻き取り装置を用い、図2に
示す旋盤と同様の構造、機能を持った金属繊維製造装置
の旋削主軸ドラムに金属薄板と3%チタネートカップリ
ング剤(味の素社製 プレンアクト KR38S)を含
有するHIPS(旭化成工業株式会社製ポリスチレン4
33)フィルム(20μm厚)を300回巻き付け積層
コイル材とし、その端面を工具送り量10μm/rev
の速度で切刃を用いて切削することによりプラスチック
と金属との混合繊維を得る。繊維の断面写真により金属
繊維部分の断面積を測定し、円形断面の直径に換算した
換算直径は平均30μである。Reference Example 7 Using the different material laminating and winding device shown in FIG. 3, a metal thin plate and a 3% titanate cup were used for a turning spindle drum of a metal fiber manufacturing device having the same structure and function as the lathe shown in FIG. HIPS containing a ring agent (Planeact KR38S manufactured by Ajinomoto Co., Inc., polystyrene 4 manufactured by Asahi Kasei Corporation)
33) A film (20 μm thick) is wound 300 times to make a laminated coil material, and the end face is a tool feed rate of 10 μm / rev
A mixed fiber of plastic and metal is obtained by cutting with a cutting blade at a speed of. The cross-sectional area of the metal fiber portion was measured from a cross-sectional photograph of the fiber, and the converted diameter converted into the diameter of the circular cross section was 30 μm on average.
【0042】実施例1〜3 参考例1の方法により金属繊維を作製する。次いで、H
IPS(旭化成工業株式会社製ポリスチレン433)を
通常のフィード口からフィードし、表中に示す種類の金
属繊維を押出機(池貝鉄工株式会社製PCM30mm二
軸押出機)のベント口から連続的に繊維をフィードしな
がら樹脂を押出す方法により樹脂と混練りしペレットを
得る。このペレット中に含まれる金属量を測定し表に示
す量比になるように射出成形の際HIPSを追加し射出
成形機(FUNAC AUTOSHOT Tserie
s MODEL 50D)で試験片を作製した。Examples 1 to 3 Metal fibers are produced by the method of Reference Example 1. Then H
IPS (Asahi Kasei Kogyo Co., Ltd. polystyrene 433) is fed from a normal feed port, and metal fibers of the types shown in the table are continuously fed from the vent port of an extruder (Ikegai Tekko Co., Ltd. PCM 30 mm twin screw extruder). Is extruded while kneading with the resin to obtain pellets. The amount of metal contained in the pellets was measured, and HIPS was added at the time of injection molding so that the amount ratio shown in the table was obtained, and an injection molding machine (FUNAC AUTOSHOT Tseries) was used.
s MODEL 50D) to prepare a test piece.
【0043】実施例4 HIPSの替わりに、ポリカーボネートとABS樹脂と
のブレンド物(以下PC/ABS樹脂と略記する)(宇
部サイコン株式会社製 サイコロイ C2800)を用
いた他は実施例1と同様に実施した。Example 4 The same procedure as in Example 1 was carried out except that a blended product of polycarbonate and ABS resin (hereinafter abbreviated as PC / ABS resin) (Cycoloy C2800 manufactured by Ube Saikon Corporation) was used instead of HIPS. did.
【0044】実施例5 HIPSの替わりに、ABS樹脂(旭化成工業株式会社
製VA51(難燃グレード))を用いた他は実施例1と
同様に実施した。Example 5 The same procedure as in Example 1 was carried out except that an ABS resin (VA51 (flame retardant grade) manufactured by Asahi Kasei Corporation) was used instead of HIPS.
【0045】実施例6 HIPSの替わりに、ポリフェニレンエーテル(PP
E;GPCより求めた数平均分子量14、000、重量
平均分子量24,500)30重量%、HIPS(旭化
成工業株式会社製H8117)67重量%、スチレン−
ブタジエンブロック共重合体の水添物(旭化成工業株式
会社製タフテックH1061)3重量%を用いた他は実
施例1と同様に実施した。Example 6 Instead of HIPS, polyphenylene ether (PP
E: number average molecular weight 14,000 determined by GPC, weight average molecular weight 24,500) 30% by weight, HIPS (H8117 manufactured by Asahi Chemical Industry Co., Ltd.) 67% by weight, styrene-
The same procedure as in Example 1 was performed except that 3% by weight of a hydrogenated butadiene block copolymer (Tuftec H1061 manufactured by Asahi Kasei Kogyo Co., Ltd.) was used.
【0046】実施例7 実施例1において参考例1の金属繊維を用いる替わりに
参考例2の金属繊維を同量用いた他は実施例1と同様に
実施した。Example 7 The procedure of Example 1 was repeated, except that the same amount of the metal fiber of Reference Example 2 was used instead of using the metal fiber of Reference Example 1.
【0047】実施例8 参考例4の方法で切削を行った金属繊維表面にHIPS
(旭化成工業株式会社製ポリスチレンH8117)を押
出し被覆し、金属繊維を内蔵した押出し物を5mmの長
さに切断しペレット化し、マスターペレットとした。こ
のマスターペレットをブレンド後の金属繊維の量が20
wt%となるようにHIPS(旭化成工業株式会社製ポ
リスチレンH8117)のナチュラルペレットとドライ
ブレンドし、射出成形を行う。Example 8 HIPS was applied to the surface of metal fibers cut by the method of Reference Example 4.
(Polystyrene H8117 manufactured by Asahi Kasei Co., Ltd.) was extrusion-coated, and the extruded product containing metal fibers was cut into a length of 5 mm and pelletized to obtain a master pellet. The amount of metal fiber after blending this master pellet is 20
It is dry-blended with natural pellets of HIPS (polystyrene H8117 manufactured by Asahi Kasei Co., Ltd.) so as to be wt%, and injection-molded.
【0048】実施例9 参考例4の方法で切削を行った金属繊維の替わりに、参
考例5の方法で切削を行った金属繊維を用いた他は実施
例8と同様に実施する。Example 9 The procedure of Example 8 was repeated, except that the metal fibers cut by the method of Reference Example 4 were replaced by the metal fibers cut by the method of Reference Example 5.
【0049】実施例10 参考例4の方法で切削を行った金属繊維の替わりに、参
考例6の方法で切削を行った金属繊維を用いた他は実施
例8と同様に実施する。Example 10 The procedure of Example 8 was repeated, except that the metal fibers cut by the method of Reference Example 4 were replaced by the metal fibers cut by the method of Reference Example 6.
【0050】実施例11 参考例7の方法で切削を行った混合繊維を図4に示す装
置により加熱し、プラスチックを溶融させることにより
金属繊維を集束し、5mmの長さに切断し金属繊維混入
プラスチックペレットを得る。このペレットをブレンド
後の金属繊維の量が20wt%となるようにHIPS
(旭化成工業株式会社製ポリスチレンH8117)のペ
レット(金属繊維を含まない)とドライブレンドし、射
出成形を行う。Example 11 The mixed fiber cut by the method of Reference Example 7 was heated by the apparatus shown in FIG. 4 to melt the plastic, thereby concentrating the metal fiber and cutting it to a length of 5 mm and mixing the metal fiber. Get plastic pellets. HIPS so that the amount of metal fibers after blending these pellets becomes 20 wt%
Dry blend with a pellet (polystyrene H8117 manufactured by Asahi Kasei Co., Ltd.) (without metal fiber) and injection molding.
【0051】実施例12 参考例1の方法で切削を行った金属繊維をシランカップ
リング剤(信越シリコーン社製 KBM503)の3%
水溶液に浸漬後乾燥し、金属繊維表面にHIPS(旭化
成工業株式会社製ポリスチレンH8117)を押出し被
覆し、金属繊維を内蔵した押出し物を5mmの長さに切
断しペレット化し、マスターペレットとした。このマス
ターペレットをブレンド後の金属繊維の量が20wt%
となるように、HIPS(旭化成工業株式会社製ポリス
チレンH8117)のナチュラルペレットとドライブレ
ンドし、射出成形を行う。Example 12 3% of the silane coupling agent (KBM503 manufactured by Shin-Etsu Silicone Co., Ltd.) was used for the metal fiber cut by the method of Reference Example 1.
After dipping in an aqueous solution and drying, HIPS (polystyrene H8117 manufactured by Asahi Chemical Industry Co., Ltd.) was extrusion-coated on the surface of the metal fiber, and the extruded product containing the metal fiber was cut into a length of 5 mm and pelletized to obtain a master pellet. The amount of metal fiber after blending this master pellet is 20 wt%
So as to obtain a dry blend with natural pellets of HIPS (polystyrene H8117 manufactured by Asahi Kasei Corporation), and injection molding is performed.
【0052】実施例13 コイル材切削時シランカップリング剤(信越シリコーン
社製 KBM503)の3%水溶液をスプレーにより噴
霧しながら切削する以外は参考例1の方法で切削を行
い、乾燥後、金属繊維表面にHIPS(旭化成工業株式
会社製ポリスチレンH8117)を押出し被覆し、金属
繊維を内蔵した押出し物を5mmの長さに切断しペレッ
ト化し、マスターペレットとした。このマスターペレッ
トをブレンド後の金属繊維の量が20wt%となるよう
に、HIPS(旭化成工業株式会社製ポリスチレンH8
117)のナチュラルペレットとドライブレンドし、成
形を行う。Example 13 When cutting a coil material, cutting was carried out by the method of Reference Example 1 except that the silane coupling agent (KBM503 manufactured by Shin-Etsu Silicone Co., Ltd.) was sprayed while spraying a 3% aqueous solution. The surface was extrusion-coated with HIPS (polystyrene H8117 manufactured by Asahi Kasei Corporation), and the extruded product containing metal fibers was cut into a length of 5 mm and pelletized to obtain a master pellet. HIPS (polystyrene H8 manufactured by Asahi Kasei Kogyo Co., Ltd.) was used so that the amount of the metal fibers after blending the master pellet was 20 wt%.
Dry blend with the natural pellet of 117) and perform molding.
【0053】比較例1 実施例1において参考例1の金属繊維を用いる替わりに
参考例3の金属繊維を同量用いた他は実施例1と同様に
実施した。Comparative Example 1 The same procedure as in Example 1 was carried out except that the same amount of the metal fiber of Reference Example 3 was used in place of the metal fiber of Reference Example 1 in Example 1.
【0054】比較例2 実施例4において参考例1の金属繊維を用いる替わりに
参考例3の金属繊維を同量用いた他は実施例1と同様に
実施した。Comparative Example 2 The same procedure as in Example 1 was carried out except that the same amount of the metal fiber of Reference Example 3 was used in place of the metal fiber of Reference Example 1 in Example 4.
【0055】比較例3 実施例5において参考例1の金属繊維を用いる替わりに
参考例3の金属繊維を同量用いた他は実施例1と同様に
実施した。Comparative Example 3 The procedure of Example 1 was repeated except that the same amount of the metal fiber of Reference Example 3 was used in place of the metal fiber of Reference Example 1 in Example 5.
【0056】比較例4 実施例6において参考例1の金属繊維を用いる替わりに
参考例3の金属繊維を同量用いた他は実施例1と同様に
実施した。Comparative Example 4 The procedure of Example 1 was repeated except that the same amount of the metal fiber of Reference Example 3 was used in place of the metal fiber of Reference Example 1 used in Example 6.
【0057】[0057]
【表1】 [Table 1]
【0058】表1を見て判るように、実施例1は比較例
1と比較して曲げ弾性率、表面外観が優れており、同じ
量の金属繊維を入れたのにも関わらず電磁波シールド性
にも優れる。また、さらに実施例8〜11は繊維の分散
状態も良好でかつ電磁波シールド効果も高い。As can be seen from Table 1, Example 1 is superior in flexural modulus and surface appearance as compared with Comparative Example 1, and the electromagnetic wave shielding property is obtained even though the same amount of metal fiber is added. Is also excellent. Further, in Examples 8 to 11, the dispersed state of the fibers is good and the electromagnetic wave shielding effect is high.
【0059】[0059]
【発明の効果】以上説明したように、本発明の金属繊維
は樹脂に対する分散性に優れており、これを充填した本
発明の樹脂組成物は電磁波シールド特性に優れ、分散
性、剛性、表面外観が良好である。As described above, the metal fiber of the present invention has excellent dispersibility in resin, and the resin composition of the present invention filled with the metal fiber has excellent electromagnetic wave shielding properties, dispersibility, rigidity and surface appearance. Is good.
【図1】コイル材コーティング装置の概略説明図。FIG. 1 is a schematic explanatory view of a coil material coating device.
【図2】コイル切削法による金属繊維の製造装置の概略
説明図。FIG. 2 is a schematic explanatory view of an apparatus for producing metal fibers by a coil cutting method.
【図3】異種材料積層巻き取り装置の概略説明図。FIG. 3 is a schematic explanatory view of a dissimilar material laminated winding device.
【図4】金属繊維混合プラスチックペレットの製造装置
の概略説明図。FIG. 4 is a schematic explanatory view of an apparatus for producing metal fiber-mixed plastic pellets.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01B 1/22 H05K 9/00 X H05K 9/00 7310−4F B29C 67/14 X // H01F 1/00 H01F 1/00 C B29L 31:34 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI Technical display location H01B 1/22 H05K 9/00 X H05K 9/00 7310-4F B29C 67/14 X // H01F 1 / 00 H01F 1/00 C B29L 31:34
Claims (10)
び、(II)コイル材切削法により作製された金属繊維
1〜70重量%よりなる樹脂組成物。1. A resin composition comprising (I) 99 to 30% by weight of a thermoplastic resin and (II) 1 to 70% by weight of metal fibers produced by a coil material cutting method.
維が表面処理剤で処理されていることを特徴とする請求
項1記載の樹脂組成物。2. The resin composition according to claim 1, wherein the metal fiber produced by the coil material cutting method is treated with a surface treatment agent.
造工程において、金属板を主軸ドラムに巻き付ける際に
表面処理剤を介在させたものをコイル材として用い、そ
の端面を切削することを特徴とする金属繊維の製造方
法。3. A method of manufacturing a fiber produced by a coil material cutting method, wherein a metal plate having a surface treatment agent intervened when it is wound around a spindle drum is used as a coil material, and an end face thereof is cut. A method for producing a metal fiber.
を特徴とする請求項3記載の金属繊維の製造方法。4. The method for producing a metal fiber according to claim 3, wherein the surface treatment agent is applied to the surface of the metal plate.
に塗布することを特徴とする請求項3記載の金属繊維の
製造方法。5. The method for producing metal fibers according to claim 3, wherein a resin solution containing a surface treatment agent is applied to the surface of the metal plate.
属板間に介在させて積層巻き取りすることを特徴とする
請求項3記載の金属繊維の製造方法。6. The method for producing a metal fiber according to claim 3, wherein a resin film in which a surface treatment agent is kneaded is interposed between metal plates and is wound up in layers.
とも1つの面が表面処理剤で処理された金属繊維。7. A metal fiber produced by a coil material cutting method and having at least one surface treated with a surface treatment agent.
とも1つの面が表面処理剤で処理されていない金属繊
維。8. A metal fiber produced by a coil material cutting method, at least one surface of which is not treated with a surface treatment agent.
作製された金属繊維、または請求項7、8記載の金属繊
維よりなる請求項1、2記載の樹脂組成物。9. The resin composition according to claim 1, comprising the metal fiber produced by the method according to claim 3, 4, 5 or 6, or the metal fiber according to claim 7 or 8.
ら成形された電磁波シールド部材。10. An electromagnetic wave shielding member molded from the resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8182154A JPH0987528A (en) | 1995-07-14 | 1996-07-11 | Resin composition containing metal fiber |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-178723 | 1995-07-14 | ||
| JP17872395 | 1995-07-14 | ||
| JP8182154A JPH0987528A (en) | 1995-07-14 | 1996-07-11 | Resin composition containing metal fiber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0987528A true JPH0987528A (en) | 1997-03-31 |
Family
ID=26498815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8182154A Withdrawn JPH0987528A (en) | 1995-07-14 | 1996-07-11 | Resin composition containing metal fiber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0987528A (en) |
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| WO2002002686A3 (en) * | 2000-06-30 | 2002-03-21 | Owens Corning Fiberglass Corp | Composites comprising fibers dispersed in a polymer matrix having improved shielding |
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| JP2007527809A (en) * | 2004-03-09 | 2007-10-04 | ナムローゼ・フェンノートシャップ・ベーカート・ソシエテ・アノニム | Composite products containing metal reinforcement embedded in thermoplastic polymer material |
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1996
- 1996-07-11 JP JP8182154A patent/JPH0987528A/en not_active Withdrawn
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| WO2002002686A3 (en) * | 2000-06-30 | 2002-03-21 | Owens Corning Fiberglass Corp | Composites comprising fibers dispersed in a polymer matrix having improved shielding |
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| US10710338B2 (en) | 2010-02-15 | 2020-07-14 | Productive Research Llc | Delamination resistant, weldable and formable light weight composites |
| US11084253B2 (en) | 2010-02-15 | 2021-08-10 | Productive Research Llc | Light weight composite material systems, polymeric materials, and methods |
| US11331880B2 (en) | 2010-02-15 | 2022-05-17 | Productive Research Llc | Delamination resistant, weldable and formable light weight composites |
| JP2013540833A (en) * | 2010-08-06 | 2013-11-07 | プロダクティブ リサーチ エルエルシー. | Lightweight, weldable and formable composite material with peel resistance |
| JP2017171928A (en) * | 2010-08-06 | 2017-09-28 | プロダクティブ リサーチ エルエルシー. | Light weight composite having detachment resistance, weldability and moldability |
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| Date | Code | Title | Description |
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| A300 | Withdrawal of application because of no request for examination |
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