JPH0361552A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPH0361552A
JPH0361552A JP1198956A JP19895689A JPH0361552A JP H0361552 A JPH0361552 A JP H0361552A JP 1198956 A JP1198956 A JP 1198956A JP 19895689 A JP19895689 A JP 19895689A JP H0361552 A JPH0361552 A JP H0361552A
Authority
JP
Japan
Prior art keywords
thermal head
heating element
electrodes
element electrodes
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1198956A
Other languages
Japanese (ja)
Inventor
Kengo Matsuda
健吾 松田
Masatoshi Tachikake
太刀掛　政俊
Seiji Nakagawa
誠治 中川
Kozo Tajo
田場　耕造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1198956A priority Critical patent/JPH0361552A/en
Publication of JPH0361552A publication Critical patent/JPH0361552A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To obtain a small-sized thermal head having high reliability and yield by simple constitution by installing zigzag arrayed solder-plated electrodes and covering sections except the electrodes with a protective film, etc. CONSTITUTION:The heating element electrodes 2 of a thermal head are arranged zigzag, the heating element electrodes 2 and a common electrode 3 are plated with solder, and other heating elements 4, wiring patterns 5, etc., are covered with protective film layers, etc. The heating element electrodes 2 are disposed zigzag, and the common electrode 3 is arranged in parallel and used for positioning at the time of soldering work, but the adjacent heating element electrodes 2 are arrayed so as not to be superposed in the lateral direction. Accordingly, solder bridges at the time of soldering work are removed, reliability and yield can be improved while soldering work at narrow pitches is enabled, and head chip width and FPC width can be reduced, thus acquiring the small- sized thermal head having excellent yield.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、サーマルプリンタ等に搭載するサーマルヘッ
ドに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thermal head installed in a thermal printer or the like.

従来の技術 従来のサーマルプリンタに搭載されているサーマルヘッ
ドは、第２図に示すような構造であった。2. Description of the Related Art A thermal head mounted on a conventional thermal printer has a structure as shown in FIG.

第２図において、サーマルヘッドチップ１０発熱体電極
２は並列に配置されて構成されていた。In FIG. 2, the thermal head chip 10 and the heating element electrodes 2 are arranged in parallel.

発明が解決しようとする課題 しかしながら、従来の構成によれば、サーマルヘッドと
これにハンダ付けされるフレキンプルプリント基板（以
下ＦＰＣと略す）等とのハンダ付は作業時に、ハンダブ
リ・ソジ等が発生し、信頼性及び歩留りが悪くなると共
に、また第２図に示されるように、サーマルヘッドの発
熱体電極ピッチＡが制限されるため、サーマルヘッドの
チップ幅及びｒｐｃ等の幅が大きくなるという問題を有
していた。Problems to be Solved by the Invention However, according to the conventional configuration, during soldering work between a thermal head and a flexible printed circuit board (hereinafter abbreviated as FPC), etc., there is a problem with soldering, soldering, etc. In addition, as shown in Fig. 2, the heating element electrode pitch A of the thermal head is limited, which increases the chip width and the width of the RPC, etc. of the thermal head. I had a problem.

本発明はこのような従来の問題点を解消するものであシ
、簡単な構成で信頼性２歩留シの高い小型のサーマルヘ
ッドを提供することを目的とするものである。The present invention is intended to solve these conventional problems, and it is an object of the present invention to provide a compact thermal head with a simple configuration and high reliability.

課題を解決するための手段 この目的を達成するために、本発明のサーマルヘッドは
、千鳥配列されたハンダメツキ電極を有し、該電極以外
は保護膜等により覆われた構成を有している。Means for Solving the Problems In order to achieve this object, the thermal head of the present invention has a structure in which solder-plated electrodes are arranged in a staggered manner, and the parts other than the electrodes are covered with a protective film or the like.

作　　　用 との構成によりミ極が千鳥配列されるため、狭ピッチで
のハンダ付けが可能となシ、信頼性２歩留シが良くなシ
、ヘッドチップ幅及びＦＰＣ幅を小さくできる。Since the poles are arranged in a staggered manner, it is possible to perform soldering at narrow pitches, improve reliability and yield, and reduce the head chip width and FPC width.

実施例 以下、本発明の一実施例にかけるサーマルヘッドについ
て、図面を参照しながら説明する。第１図に示すように
、サーマルヘッドの発熱体電極２は千鳥配列されてカシ
、発熱体電極２及び共通電極３はハンダメツキされてい
る。その他の発熱体４及び配線パターン５等は保護膜層
等により覆われている。この実施例に釦けるサーマルヘ
ッドは発熱体電極２を千鳥配列とし、共通電極３は並列
に配置し、ハンダ付は作業時の位置決めとする。EXAMPLE Hereinafter, a thermal head according to an example of the present invention will be described with reference to the drawings. As shown in FIG. 1, the heating element electrodes 2 of the thermal head are arranged in a staggered manner, and the heating element electrodes 2 and common electrode 3 are solder-plated. Other heating elements 4, wiring patterns 5, etc. are covered with a protective film layer or the like. In the thermal head for buttoning in this embodiment, the heating element electrodes 2 are arranged in a staggered manner, the common electrodes 3 are arranged in parallel, and the positioning is done during soldering work.

この実施例のように隣接する発熱体電極２が横方向に重
ならな−ように配置することにようハンダ付は作業時の
隣接する発熱体電極２へのハンダブリッジ等の発生がな
くなシ、狭ピッチでのハンダ付けが可能とな９ヘッドチ
ップ幅を小さくでき、同様にＦＰＣ幅をも小さくするこ
とが可能である６なか、本実施例に釦ける第１図の電極
間ギャップＢは０．２Ｍ以上とすることが望渣しい。By arranging adjacent heating element electrodes 2 so that they do not overlap in the lateral direction as in this embodiment, soldering is possible without the occurrence of solder bridges between adjacent heating element electrodes 2 during work. It is possible to reduce the width of the 9-head chip and the width of the FPC as well, which enables soldering at a narrow pitch. It is desirable to set it to 0.2M or more.

発明の効果 以上のように本発明のサーマルヘッドは発熱体電極を千
鳥配列することによりハンダ付は作業時のハンダブリッ
ジをなくし、信頼性２歩留シを上げることが可能であシ
、かつ、狭ピッチでのハンダ付は作業が可能となシ、ヘ
ッドチップ幅及びＦＰＣ幅を小さくでき、コヌトダウン
の効果も有し、実用上きわめて有利なものである。Effects of the Invention As described above, the thermal head of the present invention eliminates solder bridges during soldering work by arranging the heating element electrodes in a staggered manner, making it possible to increase reliability and yield. Soldering at narrow pitches is extremely advantageous in practice, as it enables work, reduces the head chip width and the FPC width, and also has the effect of soldering.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例にかけるサーマルヘッドの平
面図、第２図は従来のサーマルヘッドの平面図である。 １・・・・・・サーマルへラドチップ、２・・・・・・
発熱体電極、３・・・・・・共通電極、４・・・・・・
発熱体、６・・・・・・配線パターン。FIG. 1 is a plan view of a thermal head according to an embodiment of the present invention, and FIG. 2 is a plan view of a conventional thermal head. 1... Rad tip to thermal, 2...
Heating element electrode, 3... Common electrode, 4...
Heating element, 6... Wiring pattern.

Claims (1)

【特許請求の範囲】[Claims] 千鳥配列された電極を備え、該電極以外の部分は保護膜
等により覆われてなるサーマルヘッド。A thermal head that is equipped with electrodes arranged in a staggered manner, and the parts other than the electrodes are covered with a protective film or the like.
JP1198956A 1989-07-31 1989-07-31 Thermal head Pending JPH0361552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1198956A JPH0361552A (en) 1989-07-31 1989-07-31 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1198956A JPH0361552A (en) 1989-07-31 1989-07-31 Thermal head

Publications (1)

Publication Number Publication Date
JPH0361552A true JPH0361552A (en) 1991-03-18

Family

ID=16399737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1198956A Pending JPH0361552A (en) 1989-07-31 1989-07-31 Thermal head

Country Status (1)

Country Link
JP (1) JPH0361552A (en)

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