JPH0363290U - - Google Patents

Info

Publication number
JPH0363290U
JPH0363290U JP12228089U JP12228089U JPH0363290U JP H0363290 U JPH0363290 U JP H0363290U JP 12228089 U JP12228089 U JP 12228089U JP 12228089 U JP12228089 U JP 12228089U JP H0363290 U JPH0363290 U JP H0363290U
Authority
JP
Japan
Prior art keywords
semiconductor
heat sensor
circuit
heat
configuration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12228089U
Other languages
English (en)
Other versions
JP2526373Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989122280U priority Critical patent/JP2526373Y2/ja
Publication of JPH0363290U publication Critical patent/JPH0363290U/ja
Application granted granted Critical
Publication of JP2526373Y2 publication Critical patent/JP2526373Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Fire-Detection Mechanisms (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例の構成説明図、第２図は
熱感知器の本体の構成説明図で、Ａは下面図、Ｂ
は側面図、Ｃは上面図、第３図は回路部の構成を
示すブロツク図、第４図Ａ，Ｂは従来の熱感知器
の構成説明図である。 第１，２図において、１はボデイ、２は取付台
、３はプリント基板、４はサーミスタ（半導体）
、５はリード部、６は挿通孔、７はプロテクタ、
８は係止片、９は係止孔、１０はフツク、１１は
環状壁、１２は外周壁、１３は充填剤、１４は段
部、１５は突出部、１６は係合部、１７は溝部、
１８は取付ネジ、１９はナツト、３０は回路部、
３１は熱検出回路、３２は制御回路、３３はスイ
ツチング回路、３４は定電圧回路、３５は無極性
化回路、７０は小ネジ、７１は外周部、７２は集
熱部、７３は脚部、７４は爪部、ａは円形空間、
Ａは半球状の空間である。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体の温度特性を利用して熱を感知して火災
    の発生を検出する半導体式熱感知器において、 前記半導体を突出して取り付けた取付台と、該
    取付台に被着されて前記半導体を包囲して保護す
    るプロテクタとを備えてなり、前記半導体の回り
    にほぼ半球状の空間を設けたことを特徴とする半
    導体式熱感知器。
JP1989122280U 1989-10-20 1989-10-20 半導体式熱感知器 Expired - Fee Related JP2526373Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989122280U JP2526373Y2 (ja) 1989-10-20 1989-10-20 半導体式熱感知器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989122280U JP2526373Y2 (ja) 1989-10-20 1989-10-20 半導体式熱感知器

Publications (2)

Publication Number Publication Date
JPH0363290U true JPH0363290U (ja) 1991-06-20
JP2526373Y2 JP2526373Y2 (ja) 1997-02-19

Family

ID=31670286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989122280U Expired - Fee Related JP2526373Y2 (ja) 1989-10-20 1989-10-20 半導体式熱感知器

Country Status (1)

Country Link
JP (1) JP2526373Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007155639A (ja) * 2005-12-08 2007-06-21 Riken Keiki Co Ltd 防爆型ガスセンサー装置
JP2012014330A (ja) * 2010-06-30 2012-01-19 Lixil Nittan Co Ltd 熱煙複合式感知器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63133292A (ja) * 1986-11-26 1988-06-06 松下電工株式会社 定温式スポツト型感知器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63133292A (ja) * 1986-11-26 1988-06-06 松下電工株式会社 定温式スポツト型感知器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007155639A (ja) * 2005-12-08 2007-06-21 Riken Keiki Co Ltd 防爆型ガスセンサー装置
JP2012014330A (ja) * 2010-06-30 2012-01-19 Lixil Nittan Co Ltd 熱煙複合式感知器

Also Published As

Publication number Publication date
JP2526373Y2 (ja) 1997-02-19

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Legal Events

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