JPH0363946U - - Google Patents
Info
- Publication number
- JPH0363946U JPH0363946U JP1989124531U JP12453189U JPH0363946U JP H0363946 U JPH0363946 U JP H0363946U JP 1989124531 U JP1989124531 U JP 1989124531U JP 12453189 U JP12453189 U JP 12453189U JP H0363946 U JPH0363946 U JP H0363946U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- semiconductor chips
- upper lid
- electronic components
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989124531U JPH0530363Y2 ( ) | 1989-10-26 | 1989-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989124531U JPH0530363Y2 ( ) | 1989-10-26 | 1989-10-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0363946U true JPH0363946U ( ) | 1991-06-21 |
| JPH0530363Y2 JPH0530363Y2 ( ) | 1993-08-03 |
Family
ID=31672442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989124531U Expired - Lifetime JPH0530363Y2 ( ) | 1989-10-26 | 1989-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530363Y2 ( ) |
-
1989
- 1989-10-26 JP JP1989124531U patent/JPH0530363Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0530363Y2 ( ) | 1993-08-03 |