JPH0365022B2 - - Google Patents
Info
- Publication number
- JPH0365022B2 JPH0365022B2 JP61208940A JP20894086A JPH0365022B2 JP H0365022 B2 JPH0365022 B2 JP H0365022B2 JP 61208940 A JP61208940 A JP 61208940A JP 20894086 A JP20894086 A JP 20894086A JP H0365022 B2 JPH0365022 B2 JP H0365022B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- insulated circuit
- hoop
- leads
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
＜産業上の利用分野＞
本発明は半導体装置の製造方法に係り、特に電
子回路部品を実装した絶縁回路基板の複数の電極
端子部にそれぞれリードを半田付する半導体装置
の製造方法に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method for manufacturing a semiconductor device, and particularly to a semiconductor device in which leads are soldered to each of a plurality of electrode terminals of an insulated circuit board on which electronic circuit components are mounted. Relating to a manufacturing method.
＜発明の概要＞
本発明は、電気回路部品を実装した絶縁回路基
板の複数の電極端子部にそれぞれリードを半田付
する半導体装置の製造方法において、前記絶縁回
路基板は個別基板が連結部を介して定ピツチに連
結されたシート状のものであつて、前記リードは
リードを定ピツチで形成したフープ状クリツプリ
ードフレームからなり、該フープ状クリツプリー
ドフレームの各リードを前記絶縁回路基板の電極
端子部に挟み込むとともに、前記絶縁回路基板の
連結部に対向するリードで前記連結部を支持し、
前記絶縁回路基板の電極端子部と前記フープ状ク
リツプリードフレームのリードを半田デイツプす
ることにより、リードと電極端子部及び連結部と
の位置合せが容易にでき、また絶縁回路基板を安
定に支持してそれぞれの個別基板のリードが一度
に半田付可能となる。<Summary of the Invention> The present invention provides a method for manufacturing a semiconductor device in which leads are soldered to each of a plurality of electrode terminal portions of an insulated circuit board on which electric circuit components are mounted, wherein the insulated circuit board is connected to an individual board through a connecting portion. The leads are formed of a hoop-shaped clip lead frame in which leads are formed at a constant pitch, and each lead of the hoop-shaped clip lead frame is connected to an electrode terminal of the insulated circuit board. and supporting the connecting portion with a lead facing the connecting portion of the insulated circuit board;
By solder-dipping the electrode terminals of the insulated circuit board and the leads of the hoop-shaped clip lead frame, the leads can be easily aligned with the electrode terminals and the connecting parts, and the insulated circuit board can be stably supported. This allows the leads of each individual board to be soldered at once.
また、半田付け後、前記連結部とともに、該連
結部を支持してなるリードを取り除き、前記絶縁
回路基板を個別基板ごとに単品カツトして前記フ
ープ状クリツプリードフレームによる連結状態で
前記単品回路基板を樹脂モールドすることによ
り、樹脂モールド時に絶縁回路基板の多連化が容
易に実施できるものである。 After soldering, the connecting portion and the leads supporting the connecting portion are removed, the insulated circuit board is cut into individual boards, and the individual circuit boards are connected by the hoop-shaped clip lead frame. By resin molding, it is possible to easily create multiple insulated circuit boards during resin molding.
＜従来の技術＞
第４図に示すように、従来の半導体装置は、電
子回路部品（図示しない）を実装した絶縁回路基
板１の複数の電極端子部２，…に、必要な長さに
切断した丸ピンリード線３，…を半田付け又はリ
フロー等にて取付けしており、さらにこのように
丸ピンリード線３，…を取付けた絶縁回路基板１
を、第５図に示す如く、各丸ピンリード線３，…
をリード押え４に狭んだ状態で、キヤステイング
法、デイツピング法、粉体塗装法等により樹脂５
にてモールドしていた。<Conventional Technology> As shown in FIG. 4, in a conventional semiconductor device, a plurality of electrode terminal portions 2, ... of an insulated circuit board 1 on which electronic circuit components (not shown) are mounted are cut into required lengths. The round pin lead wires 3, ... are attached by soldering or reflow, and the insulated circuit board 1 has the round pin lead wires 3, ... attached in this way.
As shown in FIG. 5, each round pin lead wire 3,...
With the lead presser 4 in place, apply resin 5 using a casting method, dipping method, powder coating method, etc.
It was molded at
＜発明が解決しようとする問題点＞
ところが、上記従来の製造方法では、丸ピンリ
ード線３，…の取付けに時間を要し、またリード
付された絶縁回路基板１を樹脂モールドする際、
個々の絶縁回路基板１の位置決めが困難で寸法の
バラツキが大きくなるという欠点があつた。特
に、キヤステイング法によれば、注型型枠内で
個々の絶縁回路基板１の位置決めを行なう構造を
設けていた為、注型型枠が複雑化して製品が高価
なものとなつていた。<Problems to be Solved by the Invention> However, in the conventional manufacturing method described above, it takes time to attach the round pin lead wires 3, etc., and when resin molding the insulated circuit board 1 with the leads attached,
There was a drawback that positioning of the individual insulated circuit boards 1 was difficult and dimensional variations increased. In particular, according to the casting method, a structure was provided for positioning each insulated circuit board 1 within the casting mold, which made the casting mold complicated and the product expensive.
本発明は上記の事情に鑑みなされたものであつ
て、その目的は、外部リードと絶縁回路基板との
位置合せを容易にするとともに、外部リードの半
田付け工程及び樹脂モールド工程の合理化を図
り、作業時間を短縮でき、さらにコストダウンが
行なえる半導体装置の製造方法を提供することに
ある。 The present invention has been made in view of the above circumstances, and its purpose is to facilitate the alignment of external leads and an insulated circuit board, and to streamline the soldering process and resin molding process of the external leads. It is an object of the present invention to provide a method for manufacturing a semiconductor device that can shorten working time and further reduce costs.
＜問題点を解決するための手段＞
本発明は、電子回路部品を実装した絶縁回路基
板の複数の電極端子部にそれぞれリードを半田付
する半導体装置の製造方法において、前記絶縁回
路基板は個別基板が連結部を介して定ピツチに連
結されたシート状のものであつて、前記リードは
リードを定ピツチで形成したフープ状クリツプリ
ードフレームからなり、該フープ状クリツプリー
ドフレームの各リードを前記絶縁回路基板の電極
端子部に挟み込むとともに、前記絶縁回路基板の
連結部に対向するリードで前記連結部を支持し、
前記絶縁回路基板の電極端子部と前記フープ状ク
リツプリードフレームのリードを半田デイツプに
より半田付けした後前記連結部とともに、該連結
部を支持してなるリードを取り除き、前記絶縁回
路基板を個別基板ごとに単品カツトして前記フー
プ状クリツプリードフレームによる連結状態で前
記単品回路基板を樹脂モールドすることを特徴と
する。<Means for Solving the Problems> The present invention provides a method for manufacturing a semiconductor device in which leads are soldered to each of a plurality of electrode terminal portions of an insulated circuit board on which electronic circuit components are mounted, wherein the insulated circuit board is an individual board. are sheet-like, which are connected at a constant pitch through connecting portions, and the leads are made of a hoop-shaped clip lead frame in which leads are formed at a constant pitch, and each lead of the hoop-shaped clip lead frame is connected to the insulator. sandwiched between the electrode terminal portions of the circuit board and supporting the connecting portion with leads facing the connecting portion of the insulated circuit board;
After soldering the electrode terminal portion of the insulated circuit board and the lead of the hoop-shaped clip lead frame with a solder dip, the connecting portion and the lead supporting the connecting portion are removed, and the insulated circuit board is separated into individual boards. The method is characterized in that the single circuit board is cut into pieces and then resin-molded while being connected by the hoop-shaped clip lead frame.
＜作用＞
本発明において、絶縁回路基板は個別基板が連
結部を介して定ピツチに連結されたシート状のも
のであつて、電極端子部に接続されるリードはリ
ードを定ピツチで形成したフープ状クリツプリー
ドフレームからなるので、リードと電極端子部と
の接続の際、ピツチ合せの手間が不要で、位置合
せが容易にできる。<Function> In the present invention, the insulated circuit board is a sheet-like one in which individual boards are connected at regular pitches through connecting parts, and the leads connected to the electrode terminal parts are hoops formed with leads at regular pitches. Since it is composed of a shaped clip lead frame, there is no need for pitch alignment when connecting the lead and the electrode terminal portion, and alignment can be easily performed.
また、フープ状クリツプリードフレームの各リ
ードを前記絶縁回路基板の電極端子部に挟むとと
もに、前記絶縁回路基板の連結部に対向するリー
ドで前記連結部を支持し、前記絶縁回路基板の電
極端子部と前記フープ状クリツプリードフレーム
のリードを半田デイツプにより半田付けするの
で、絶縁回路基板を安定に支持した状態でリード
の半田付けが一度に行なえる。又、モールド時に
おいても複数個の個別基板がフープ状クリツプリ
ードフレームで連結された状態で一度にモールド
できる。しかもフープ状クリツプリードフレーム
でそれぞれの個別基板が多連化されている為、位
置決めが容易でモールド後の寸法バラツキを小さ
くすることが可能である。 Further, each lead of the hoop-shaped clip lead frame is sandwiched between the electrode terminal portions of the insulated circuit board, and the connecting portion is supported by a lead facing the connecting portion of the insulated circuit board, and the electrode terminal portion of the insulated circuit board is Since the leads of the hoop-shaped clip lead frame are soldered using a solder dip, the leads can be soldered all at once while stably supporting the insulated circuit board. Also, during molding, a plurality of individual substrates can be molded at once while being connected by a hoop-shaped clip lead frame. Furthermore, since each individual board is connected in multiples using a hoop-shaped clip lead frame, positioning is easy and dimensional variations after molding can be reduced.
＜実施例＞
以下、図面に示す実施例に基づいて本発明に係
る半導体装置の製造方法を説明する。<Example> Hereinafter, a method for manufacturing a semiconductor device according to the present invention will be described based on an example shown in the drawings.
まず第１図のように、個別基板１１ａ，…が連
結部１１ｃ，…を介して定ピツチに連結されたシ
ート状の絶縁回路基板１１（本実施例において個
別基板１１ａ，…は８列３段にパターン化されて
いる）に、電子回路部品（図示しない）を実装
し、絶縁回路基板１１のＶ溝カツト部１１ｂにて
ブレイクを行ない、絶縁回路基板１１を８ケの個
別基板１１ａが連結部１１ｃを介し定ピツチに一
列に連結した状態とする。また絶縁回路基板１１
には後述するフープ状クリツプリードフレームと
同一ピツチに電極端子部１２のパターンが形成さ
れる。 First, as shown in FIG. 1, a sheet-shaped insulated circuit board 11 in which individual boards 11a, ... are connected at regular pitches via connecting parts 11c, ... (in this embodiment, individual boards 11a, ... are arranged in 8 rows and 3 stages) Electronic circuit components (not shown) are mounted on the insulated circuit board 11 (patterned), and a break is made at the V-groove cut portion 11b of the insulated circuit board 11, so that the eight individual boards 11a connect the insulated circuit board 11 to the connection part They are connected in a line at a fixed pitch via 11c. Also, the insulated circuit board 11
A pattern of electrode terminal portions 12 is formed at the same pitch as a hoop-shaped clip lead frame to be described later.
次に第２図において、連結部１１ｃを介して一
列に連結された８ケの個別基板１１ａ，…のそれ
ぞれの電極端子部１２にフープ状クリツプリード
フレーム１３の各リードを挟み込むとともに、連
結部１１ｃ対向するリードで連結部１１ｃを支持
する。 Next, in FIG. 2, each lead of the hoop-shaped clip lead frame 13 is sandwiched between the electrode terminal portions 12 of eight individual boards 11a, . . . connected in a row via the connecting portions 11c, and The connecting portion 11c is supported by opposing leads.
ここで、フープ状クリツプリードフレーム１３
の各リードはすべて定ピツチで形成されており、
このピツチ幅は、前述のように電極端子部１２の
パターンピツチと同一である。このため、ピツチ
合せの手間が不要で、位置合せが容易にできる。 Here, the hoop-shaped clip lead frame 13
All leads are formed with a fixed pitch,
This pitch width is the same as the pattern pitch of the electrode terminal portion 12, as described above. Therefore, the effort of pitch alignment is unnecessary, and alignment can be easily performed.
次に、個別基板１１ａを連結部１１ｃを介して
連結した絶縁回路基板１１の電極端子部１２とフ
ープ状クリツプリードフレーム１３のリード部を
半田デイツプすることにより、絶縁回路基板１１
を安定に支持した状態で、それぞれの個別基板１
１ａ，…にリード端子１３ａ，…を一度に半田付
けする。また半田付け後、不要なクリツプリード
１３ｂを取り除くとともに絶縁回路基板１１を個
別基板１１ａ，…ごとに単品カツトを行なう。 Next, the electrode terminal portion 12 of the insulated circuit board 11, which connects the individual substrates 11a via the connecting portion 11c, and the lead portion of the hoop-shaped clip lead frame 13 are soldered-dipped to connect the insulated circuit board 11.
While stably supporting each individual board 1
Solder the lead terminals 13a, . . . to 1a, . . . at once. After soldering, unnecessary clip leads 13b are removed and the insulated circuit board 11 is cut into individual boards 11a, . . . .
さらに第３図に示すように、キヤステイング法
等により、フープ状クリツプリードフレーム１３
で連結された状態で単品回路基板１１ａ，…をそ
れぞれ注型型枠１４内にはめ込み、樹脂１５にて
モールドする。 Furthermore, as shown in FIG. 3, the hoop-shaped clip lead frame 13 is
The single circuit boards 11a, .
この時、各単品回路基板１１ａの位置決めはク
リツプリードフレーム１３のタイバー部１３ｃで
容易に行なえ、また単品回路基板１１ａ，…がク
リツプリードフレーム１３で連結されているた
め、モールド後の寸法バラツキを小さくできる。 At this time, each single circuit board 11a can be easily positioned using the tie bar portion 13c of the clip lead frame 13, and since the single circuit boards 11a, ... are connected by the clip lead frame 13, dimensional variations after molding can be minimized. can.
上記のように、複数個の個別基板１１ａ，…が
連結部１１ｃを介して定ピツチに連結されたシー
ト状の絶縁回路基板１１による多連化及び前記絶
縁回路基板１１の電極端子部１２，…と同一ピツ
チのフープ状クリツプリードフレーム１３の使用
により、ピツチ合せの手間が不要で位置合せが容
易に行なえ、しかも絶縁回路基板１１を安定に支
持した状態でリード端子１３ａ，…の半田付け及
び複数個の単品回路基板１１ａ，…の樹脂モール
ドが一度に行なえるので、作業時間の短縮化が図
れる。さらにフープ状クリツプリードフレーム１
３は定ピツチのものであり作成が容易であるとと
もに、任意の箇所から使用が可能であり、非常に
無駄が無く、且つ半田デイツプ時は絶縁回路基板
の連結部を安定に支持して確実な半田付けができ
る。また樹脂モールド時の各単品回路基板１１
ａ，…の位置決めをリードフレーム１３で、多連
化された状態で行なえる為個々の完成品寸法の精
度が向上する。 As described above, a plurality of individual boards 11a, . . . are connected to each other at regular pitches via the connecting portions 11c to form a multi-connected sheet-shaped insulated circuit board 11, and the electrode terminal portions 12, . By using a hoop-shaped clip lead frame 13 with the same pitch as the lead terminals 13a, etc., alignment can be easily performed without the need for pitch alignment.Moreover, while the insulated circuit board 11 is stably supported, soldering and multiple lead terminals 13a,... Since the resin molding of the individual circuit boards 11a, . . . can be done at the same time, the working time can be shortened. Furthermore, the hoop-shaped clip lead frame 1
3 has a fixed pitch and is easy to make, can be used from any location, is extremely wasteful, and stably supports the connecting part of the insulated circuit board during solder dip, making it reliable. Can be soldered. In addition, each single circuit board 11 when resin molded
Since the positioning of a, .
＜発明の効果＞
以上述べてきたように本発明によれば、電気回
路部品を実装した絶縁回路基板の複数の電極端子
部にそれぞれリードを半田付する半導体装置の製
造方法において、前記絶縁回路基板を個別基板が
連結部を介して定ピツチに連結されたシート状に
構成するとともに、リードを定ピツチに形成した
フープ状クリツプリードフレームを使用して、外
部リードと絶縁回路基板との位置合せが容易で、
且つ絶縁回路基板の連結部を安定に支持して、外
部リードの半田付け工程及び樹脂モールド工程の
合理化を図り、作業時間が短縮できるとともに、
コストダウンが行なえるものである。<Effects of the Invention> As described above, according to the present invention, in the method for manufacturing a semiconductor device in which leads are soldered to each of a plurality of electrode terminal portions of an insulated circuit board on which electric circuit components are mounted, the insulated circuit board The circuit board is configured in a sheet shape in which individual boards are connected at regular pitches via connecting parts, and a hoop-shaped clip lead frame with leads formed at regular pitches is used to align the external leads and the insulated circuit board. easy,
In addition, it stably supports the connection part of the insulated circuit board, streamlines the external lead soldering process and resin molding process, and reduces work time.
This allows cost reduction.
第１図乃至第３図はそれぞれ本発明の方法によ
る一実施例の工程図、第４図は従来の方法による
半導体装置の上面図、第５図は従来の方法による
半田付け工程を示す図である。
１１：絶縁回路基板、１１ａ：個別基板（単品
回路基板）、１１ｃ：連結部、１２：電極端子部、
１３：フープ状クリツプリードフレーム、１３
ａ：リード端子、１３ｂ：不要なリード、１５：
樹脂。
1 to 3 are process diagrams of an embodiment according to the method of the present invention, FIG. 4 is a top view of a semiconductor device according to a conventional method, and FIG. 5 is a diagram showing a soldering process according to a conventional method. be. 11: Insulated circuit board, 11a: Individual board (single circuit board), 11c: Connecting part, 12: Electrode terminal part,
13: Hoop-shaped clip lead frame, 13
a: Lead terminal, 13b: Unnecessary lead, 15:
resin.
Claims (1)
の電極端子部にそれぞれリードを半田付する半導
体装置の製造方法において、前記絶縁回路基板は
個別基板が連結部を介して定ピツチに連結された
シート状のものであつて、前記リードはリードを
定ピツチ形成したフープ状クリツプリードフレー
ムからなり、該フープ状クリツプリードフレーム
の各リードを前記絶縁回路基板の電極端子部に挟
むとともに、前記絶縁回路基板の連結部に対向す
るリードで前記連結部を支持し、前記絶縁回路基
板の電極端子部と前記フープ状クリツプリードフ
レームのリードを半田デイツプにより半田付けし
た後前記連結部とともに、該連結部を支持してな
るリードを取り除き、前記絶縁回路基板を個別基
板ごとに単品カツトして前記フープ状クリツプリ
ードフレームによる連結状態で前記単品回路基板
を樹脂モールドすることを特徴とする半導体装置
の製造方法。1. In a method for manufacturing a semiconductor device in which leads are soldered to each of a plurality of electrode terminals of an insulated circuit board on which electric circuit components are mounted, the insulated circuit board is a sheet in which individual boards are connected at regular pitches via connecting parts. The leads are made of a hoop-shaped clip lead frame with leads formed at a constant pitch, and each lead of the hoop-shaped clip lead frame is sandwiched between the electrode terminal portions of the insulated circuit board, and The connecting portion is supported by a lead facing the connecting portion, and after the electrode terminal portion of the insulated circuit board and the lead of the hoop-shaped clip lead frame are soldered with a solder dip, the connecting portion is supported together with the connecting portion. 1. A method for manufacturing a semiconductor device, comprising: removing the leads formed by the insulating circuit board, cutting the insulated circuit board into individual boards, and molding the single circuit boards in a resin-molded state while connected by the hoop-shaped clip lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61208940A JPS6364349A (en) | 1986-09-04 | 1986-09-04 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61208940A JPS6364349A (en) | 1986-09-04 | 1986-09-04 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6364349A JPS6364349A (en) | 1988-03-22 |
| JPH0365022B2 true JPH0365022B2 (en) | 1991-10-09 |
Family
ID=16564650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61208940A Granted JPS6364349A (en) | 1986-09-04 | 1986-09-04 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364349A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5157357B2 (en) * | 2007-10-10 | 2013-03-06 | 日亜化学工業株式会社 | Aggregate structure of light emitting device package, manufacturing method thereof, and manufacturing method of light emitting device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5518034A (en) * | 1978-07-25 | 1980-02-07 | Sony Corp | Method of fabricating hybrid integrated circuit |
| JPS56129355A (en) * | 1980-03-13 | 1981-10-09 | Nec Corp | Preparation of electronic parts |
| JPS5984449A (en) * | 1982-11-05 | 1984-05-16 | Hitachi Ltd | Manufacture of thick film hybrid integrated circuit |
-
1986
- 1986-09-04 JP JP61208940A patent/JPS6364349A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6364349A (en) | 1988-03-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |