JPH0365539B2 - - Google Patents
Info
- Publication number
- JPH0365539B2 JPH0365539B2 JP15816982A JP15816982A JPH0365539B2 JP H0365539 B2 JPH0365539 B2 JP H0365539B2 JP 15816982 A JP15816982 A JP 15816982A JP 15816982 A JP15816982 A JP 15816982A JP H0365539 B2 JPH0365539 B2 JP H0365539B2
- Authority
- JP
- Japan
- Prior art keywords
- silicone rubber
- layer
- photosensitive layer
- rubber layer
- printing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 80
- 229920002379 silicone rubber Polymers 0.000 claims description 48
- 239000004945 silicone rubber Substances 0.000 claims description 45
- 238000007639 printing Methods 0.000 claims description 32
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 125000003342 alkenyl group Chemical group 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 4
- 239000003446 ligand Substances 0.000 claims description 4
- 239000013522 chelant Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 2
- 239000010936 titanium Substances 0.000 description 13
- -1 amine compound Chemical class 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 229910052719 titanium Inorganic materials 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- JJLKTTCRRLHVGL-UHFFFAOYSA-L [acetyloxy(dibutyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[Sn+2]CCCC JJLKTTCRRLHVGL-UHFFFAOYSA-L 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 125000005595 acetylacetonate group Chemical group 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000002940 repellent Effects 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- WXWYJCSIHQKADM-ZNAKCYKMSA-N (e)-n-[bis[[(e)-butan-2-ylideneamino]oxy]-ethenylsilyl]oxybutan-2-imine Chemical compound CC\C(C)=N\O[Si](O\N=C(/C)CC)(O\N=C(/C)CC)C=C WXWYJCSIHQKADM-ZNAKCYKMSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- JTINZFQXZLCHNS-UHFFFAOYSA-N 2,2-bis(oxiran-2-ylmethoxymethyl)butan-1-ol Chemical compound C1OC1COCC(CO)(CC)COCC1CO1 JTINZFQXZLCHNS-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- KLQSRTKDOLFPQJ-UHFFFAOYSA-M CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O Chemical compound CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O KLQSRTKDOLFPQJ-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920003261 Durez Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- KXJLGCBCRCSXQF-UHFFFAOYSA-N [diacetyloxy(ethyl)silyl] acetate Chemical compound CC(=O)O[Si](CC)(OC(C)=O)OC(C)=O KXJLGCBCRCSXQF-UHFFFAOYSA-N 0.000 description 1
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 1
- BTHCBXJLLCHNMS-UHFFFAOYSA-N acetyloxysilicon Chemical compound CC(=O)O[Si] BTHCBXJLLCHNMS-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- HRBFQSUTUDRTSV-UHFFFAOYSA-N benzene-1,2,3-triol;propan-2-one Chemical compound CC(C)=O.OC1=CC=CC(O)=C1O HRBFQSUTUDRTSV-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- GNWCSWUWMHQEMD-UHFFFAOYSA-N naphthalene-1,2-dione diazide Chemical group [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C(=O)C=CC2=C1 GNWCSWUWMHQEMD-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- WYKQDEPZMVTTSJ-UHFFFAOYSA-J titanium(4+);tetrabenzoate Chemical compound [Ti+4].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 WYKQDEPZMVTTSJ-UHFFFAOYSA-J 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical compound OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
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ãåèšå¹³çå°å·çã«é¢ãããã®ã§ãããDETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lithographic printing plate that does not require dampening water and has a silicone rubber layer as an ink repellent layer, and particularly the lithographic printing plate that has improved adhesion between the silicone rubber layer and the photosensitive layer. It is related to.
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ãªãå°å·çãææ¡ãããŠããã Printing plates having various configurations have been proposed in order to perform planographic printing without using dampening water using silicone rubber as an ink repellent layer.
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ãã Among these, for example, Japanese Patent Application Laid-Open No. 56-80046 discloses a photosensitive layer lined with a support and a lithographic printing plate that does not require dampening water and is used for negative working. A presensitized lithographic printing plate has been proposed in which a silicone rubber layer is provided on a peelable photosensitive layer. Further, JP-A-55-110249 proposes a lithographic printing plate in which a silicone rubber layer containing aminosilane is provided on a photo-soluble photosensitive layer backed by a support.
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èŠã§ããã In such printing plates, for example, the silicone rubber layer in unexposed areas may peel off during development, or the silicone rubber layer may be difficult to connect to the photosensitive layer due to its scratch resistance and printing durability during operations such as development and printing. Strong adhesion with the silicone rubber layer is most important.
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ããã Unexamined Japanese Patent Publication No. 49-57903, 49-73202, 49-77702, 49
No.-86103 and No. 49-126407 both describe a plate structure for improving the adhesion between a silicone rubber layer and a photosensitive material layer, and do not particularly distinguish between negative working and positive working. Furthermore, for negative working, there is Japanese Patent Application Laid-Open No. 55-59466. However, as described in these documents, a silane coupling agent or a silicone primer may be mixed into the silicone layer, or the silicone layer may be a mixture of a one-component room-temperature curing silicone rubber and a two-component addition-type silicone rubber. This means that the silicone rubber layer lacks homogeneity and the cohesive force of the silicone rubber is reduced, resulting in a silicone layer that has poor scratch resistance, and the plate surface is easily scratched during development printing, resulting in scumming. In addition, the technique of mixing a silane coupling agent or an amine compound into the photosensitive material layer generally tends to cause side reactions with highly reactive photosensitive materials, and there are also problems in terms of storage stability.
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ããã®ãå°é£ã§ããã In order to eliminate these drawbacks and strengthen the adhesion between the photosensitive layer and the silicone rubber layer, an adhesive layer is provided between the photosensitive layer and the silicone rubber layer thereon to bond and bond both layers. It has been proposed (Japanese Unexamined Patent Publication No. 55-59466). The adhesive layer proposed here uses aminosilane. However, when applying aminosilane,
The disadvantage is that the stability of the coating liquid is poor. Furthermore, when considering the adhesion balance between the silicone rubber layer and the photosensitive layer (for example, the adhesion between the silicone rubber layer and the photosensitive layer is strong, but the silicone rubber layer needs to be removed very easily during development), the coating conditions must be adjusted. It is difficult to select the optimum coating amount according to various conditions.
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ãã The present inventors have conducted intensive studies to solve these problems, and as a result, have arrived at the present invention described below.
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ããã®ã§ããã That is, the present invention provides a lithographic printing plate that does not require dampening water and comprises a support, a photosensitive layer containing an orthoquinone diazide compound, an adhesive layer, and a silicone rubber layer in this order, characterized in that the adhesive layer contains an organic titanate. This invention relates to a lithographic printing plate that does not require dampening water.
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ã¯ã次åŒã§ç€ºããããããªååç©ã§ããã The organic titanate used in the adhesive layer of the present invention is a compound represented by the following formula.
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äœåã§ããã Ti(OR 1 ) 4 , Ti(OR 2 ) o (OCOR 3 ) 4-o , Ti
(OR 2 ) o L 4-o [Here, R 1 and R 3 are alkyl having 1 to 20 carbon atoms,
Aryl, cycloalkyl or alkenyl group R 2 is hydrogen, alkyl having 1 to 20 carbon atoms, aryl, cycloalkyl or alkenyl group L is a chelate ligand n is 0 to 3. ] The ligand referred to herein is β-diketone, glycol, hydroxycarboxylic acid, ketoester, ketoalcohol, or nitrogen ligand.
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ã³ãªã©ã®ããã©ã¢ã«ãã«ãã¿ããŒãã Typical examples of the above general formula include:
For example, tetraalkyl titanates such as tetra-iso-propoxy titanium, tetra-n-butoxy titanium, tetrastearoxy titanium.
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äœããã³éåäœãå«ãŸããã Di-iso-propoxy bis(acetylacetonato) titanium, di-n-butoxy bis(acetylacetonato) titanium, di-n-butoxy bis(triethanolaminato) titanium, dihydroxy bis(lactato) titanium , tetrakis (2-
Also included are titanium chelates such as titanium (ethylhexanediolite), titanium acylates such as tri-n-butoxytitanium monostearate and titanium tetrabenzoate, or aggregates and polymers thereof.
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å«ããã¿ããŒãã䜿çšããããã Others: isopropyl tri(dioctyl phosphate) titanate, isopropyl tris(dioctyl pyrophosphate) titanate, bis(dioctyl pyrophosphate) oxyacetate titanate, bis(dioctyl pyrophosphate) ethylene titanate, bis(dioctyl pyrophosphate) ethylene titanate Phosphorus-containing titanates such as phosphorus-containing titanates may also be used.
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皮以äžäœµçšããããšãå¯èœã§ããã These organic titanates include not only one type but also two types.
It is also possible to use more than one species in combination.
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å±€ãäžè¬çã§ããã The photosensitive layer containing the orthoquinone diazide compound used in the present invention is
A photo-solubilizable photosensitive layer and a photo-peelable photosensitive layer such as those proposed in No. 54-156871 are common.
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ã€ã圢ã§çšããããã Therefore, the photo-solubilizable photosensitive layer includes a photosensitive layer in which the ethanol-soluble component containing the orthoquinone diazide compound is 20% by weight or less, preferably 15% by weight or less. An orthoquinonediazide compound has a 1,2-quinonediazide or 1,2-naphthoquinonediazide structure in its molecule, and is usually a compound containing a sulfonic acid derivative, such as orthoquinonediazide sulfonic acid and its derivatives, and a hydroxyl group or an amino group (especially polymer compounds)
It is used in the form of an ester or amide obtained by reaction with
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žéšåãšã¹ãã«åç©ã§ããã A preferred photosensitive layer for carrying out the present invention is a partial ester of naphthoquinone-1,2-diazido-5-sulfonic acid of a novolac resin having a degree of esterification of 35 to 65%.
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ãã The novolak resin referred to herein is a novolak type phenolic resin obtained by condensing phenol or m-cresol with formaldehyde.
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ã®ã·ãªã³ãŒã³ãŽã å±€ãé€å»ããããã®ã§ããã Further, the photoreleasable photosensitive layer is one in which the silicone rubber layer thereon is removed by development without substantially removing the exposed portion of the photosensitive layer.
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ã©ããããããã Examples of non-diazides constituting such a photosensitive layer include esters of benzoquinone-1,2-diazide sulfonic acid and polyhydroxyphenyl;
Examples include esters of naphthoquinone-1,2-diazide sulfonic acid and pyrogallol acetone resin, and esters of naphthoquinone-1,2-diazide sulfonic acid and phenol formaldehyde novolak resin.
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å±€ãšããã Such known quinone diazides are crosslinked with a polyfunctional compound or modified by bonding with a monofunctional compound to make them poorly soluble or insoluble in a developer, thereby forming a photoreleasable photosensitive layer.
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ã«ãªã©ãããã For example, as a crosslinking agent used to introduce a crosslinked structure, polyfunctional isocyanates such as paraphenylene diisocyanate,
2,4- or 2,6-toluene diisocyanate, 4,4-diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, or adducts thereof, or polyfunctional epoxy compounds, such as Examples include polyethylene glycol diglycidyl ethers, polypropylene glycol diglycidyl ethers, bisphenol A diglycidyl ether, and trimethylolpropane diglycidyl ether.
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ãã®ããã«è§Šåªçã䜵çšãããã These thermal curing processes must be carried out within a temperature range that does not cause loss of photosensitivity of the photosensitive material, usually below 150°C.
For this purpose, a catalyst or the like is used in combination.
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åç©ã«ã¢ãããã°ã©ããéåãããŠãè¯ãã In addition, as a method for introducing a component that is poorly soluble or insoluble in the developer, similarly, the active group of the photosensitive compound may be esterified, amidated, or urethanized. The compound to be reacted with the active group of the photosensitive compound may be a low-molecular compound or a relatively high-molecular compound, or a monomer may be graft-polymerized to the photosensitive compound.
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倿§ããŠåŸãããã The photoremovable photosensitive layer used in the present invention includes:
A particularly preferred one is obtained by crosslinking or modifying a partially esterified product of naphthoquinone-1,2-diazide-5-sulfonic acid and phenol formaldehyde novolak resin with a polyfunctional or monofunctional isocyanate.
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ããšçµæžçèŠå°ããäžå©ã§ããã The appropriate thickness of the photosensitive layer of the present invention is approximately 0.1 to 100ÎŒ, preferably approximately 0.5 to 10ÎŒ; if it is too thin, defects such as pinholes are likely to occur during coating, while if it is too thick, it is disadvantageous from an economic standpoint. It is.
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ããããããšã¯å¯èœã§ããã In addition, other components may be added to the photosensitive layer for the purpose of improving coating film formation properties and adhesion to the support within a range that does not impair the effects of the present invention, and images may be visualized during development or exposure. It is possible to add dyes etc.
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ã®ç·ç¶ææ©ããªã·ãããµã³ãäž»æåãšããã The silicone rubber layer used in the present invention is mainly composed of a linear organic polysiloxane having a molecular weight of several thousand to several hundred thousand and having the following repeating units.
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ãã (Here, n is an integer of 1 or more, R is an alkyl group, alkenyl group, or phenyl group having 1 to 10 carbon atoms, and preferably 60% or more of R is a methyl group.) Such linear organic Polysiloxane can also be sparsely crosslinked to form silicone rubber by adding an organic peroxide and subjecting it to heat treatment.
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æ©é«ååç©çãæ·»å ãããã®ãäžè¬çã§ããã A crosslinking agent is also added to the linear organopolysiloxane. Crosslinking agents used in so-called room temperature (low temperature) curing silicone rubber include acetoxysilane, ketoxime silane, alkoxysilane, aminosilane, amidosilane, etc., and are usually linear organic polysiloxanes with hydroxyl groups at the ends. When combined with certain substances, silicone rubbers become deaceticated, oxime-free, alcoholized, deamined, and deamidated silicone rubbers. Generally, a small amount of an organic tin compound or the like is further added as a catalyst to these silicone rubbers.
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ãç»ååçŸæ§ã®äœäžãããããã The appropriate thickness of the silicone rubber layer is approximately 0.5 to 100ÎŒ, preferably approximately 0.5 to 10ÎŒ; if it is too thin, problems may occur in terms of printing durability, while if it is too thick, it is economically disadvantageous. Not only is
It becomes difficult to remove the silicone rubber layer during development, resulting in a decrease in image reproducibility.
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ãæ·»å ãããããããšãå¯èœã§ããã In the lithographic printing plate of the present invention, adhesion between the support and the photosensitive layer is very important for basic plate performance such as image reproducibility and printing durability, so an adhesive layer may be provided as necessary. It is also possible to add adhesion-improving components to each layer.
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ã°ãæœããŠæ¯æäœãšããããšãå¯èœã§ããã The support must be flexible enough to be set in a normal lithographic printing machine and capable of withstanding the load applied during printing. As a typical example,
Examples include metal plates such as aluminum, copper, and steel, plastic films such as polyethylene terephthalate, coated paper, and rubber. The support may be composite. It is also possible to provide a support by further applying a coating to these sheets for antihalation and other purposes.
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ãã A thin protective film may be laminated on the surface of the silicone rubber layer for the purpose of protecting the silicone rubber layer forming the surface of the planographic printing plate that does not require dampening water and is constructed as described above.
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ãããã As explained above, the lithographic printing plate that does not require dampening water and is used in the present invention is manufactured, for example, as follows.
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ã©ãããŒã¿çãçšããŠã«ããŒããã First, a composition solution to form a photosensitive layer is applied onto the support using a conventional coater such as a reverse roll coater, air knife coater, Meyer bar coater, or a rotary coater such as a Whaler, and then dried and coated as necessary. After heat curing, an adhesive layer is applied on the photosensitive layer in the same manner, and after drying, a silicone rubber solution is applied on the adhesive layer in the same manner, followed by heat treatment at a temperature of usually 70 to 140°C for several minutes. and sufficiently cured to form a silicone rubber layer. If necessary, cover the silicone rubber layer with a protective film using a laminator or the like.
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ãšãã§ããã The thus produced lithographic printing plate, which does not require dampening water, is exposed to actinic light through, for example, a negative film sealed in vacuum. The light source used in this exposure process emits abundant ultraviolet light, and can be a mercury lamp, a carbon arc lamp, a xenon lamp, a metal halide lamp, a fluorescent lamp, or the like.
次ãã§çé¢ãçŸåæ¶²ãå«ãã çŸåçšãããã§ã
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ããã€ã³ãå容éšãšãªãã Next, when the plate surface is rubbed with a developing pad containing a developer, the silicone rubber layer or photosensitive layer in the exposed area is removed, and the photosensitive layer surface or substrate surface is exposed and becomes an ink receiving area.
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ãããã€ãŠãã©ã³ã¹ããšããå°å·çã§ããã The printing plate of the present invention not only has strong adhesion between the photosensitive layer and the silicone rubber layer, but also allows the silicone rubber layer to be selectively and easily peeled off from the areas to be removed during the development operation.
Therefore, it is a well-balanced printed edition.
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ããããšãå¯èœã§ããã Furthermore, a wide range of conditions can be adopted when applying the adhesive layer.
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ãŠãæ¿ãããšãªããæ§èœãä¿æããã Furthermore, the adhesive layer coating solution has very good stability as a stock solution, and when an alcohol such as n-butanol is added as a coating solvent, it does not become cloudy and retains its performance even when left in the air for a long time.
以äžã宿œäŸã«ããæ¬çºæãããã«è©³ãã説æ
ããã Hereinafter, the present invention will be explained in more detail with reference to Examples.
宿œäŸ ïŒ
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床60ïŒã·ãšã¢ïŒ¡ïŒã®ã¯ãããã¬ã³ãŽã å±€ãèšãã
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å±€ãèšãããExample 1 A phenol novolac resin (manufactured by Sumitomo Bakelite: manufactured by Sumitomo Bakelite: violet resin
PR50235) naphthoquinone-1,2-diamide
A 10% by weight solution of 5-sulfonic acid ester in dioxane was applied and dried in hot air at 60°C to form a photosensitive layer with a thickness of 3 Όm.
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ãèšããã On top of this, 0.4% by weight of di-n-butoxy bis(acetylacetonato)titanium (Etsuo Chemical Co., Ltd.)
A solution of "Isoper E" (manufactured by aliphatic hydrocarbon solvent) was applied and dried at 120°C to form an adhesive layer with a thickness of 0.1Ό.
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ãªã³ãŒã³ãŽã å±€ãèšããã Furthermore, a 10% by weight n-hexane solution of a silicone rubber composition having the following composition is applied on top of this,
A silicone rubber layer with a thickness of 2.5 Όm was provided by heat curing in hot air at 120° C. for 4 minutes.
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ã ãå¿ å®ã«åçŸããå°å·çãåŸãã(a) Dimethylpolysiloxane (molecular weight 30,000, terminal hydroxyl group) 100 parts (b) Methyltriacetoxysilane 6 parts (c) Dibutyltin acetate 0.2 parts Exposure was carried out for 90 seconds from a distance of 1 m using a high-pressure mercury lamp (jet light 2 kW). When the exposed plate is wetted with a developer consisting of 65 parts of ethanol/35 parts of Isopar E and lightly rubbed with a developer pad, the exposed areas are easily removed and the rubber layer is exposed, while the unexposed areas are left unexposed. A printing plate was obtained in which the silicone rubber layer remained firmly and faithfully reproduced the negative film.
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ã§ãã·ã€ãŒããªç»åãæããå°å·ç©ãåŸãããã This printing plate was attached to a regular flatbed letterpress printing machine and printed directly onto coated paper using waterless lithographic ink "Alpo G" (manufactured by Toka Shiki Kagaku Kogyo). A printed matter with a good inking state and a sharp image was obtained.
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å±€ã圢æãããExample 2 Naphthoquinone of phenol novolac resin (Sumitomo Durez: Sumiresin PR50235) with a degree of esterification of 44% was applied to a chemically treated aluminum plate (manufactured by Sumitomo Light Metals).
A 3 wt% dioxane solution of 1,2-diamido-5-sulfonic acid ester (ethanol soluble component: 9.7 wt%) was spin-coated using a Whaler and dried.
A 1.2 ÎŒm photosensitive layer was formed.
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å転å¡åžã也ç¥ãããŠ0.05ÎŒã®æ¥çå±€ã圢æããã On top of this, 0.2% by weight of di-n-butoxy bis(acetylacetonato)titanium (Etsuo Chemical Co., Ltd.)
Manufactured by: Aliphatic hydrocarbon solvent) âIsopar Eâ/
A solution of n-butanol in a weight ratio of 80/20 was spin-coated using a Whaler and dried to form an adhesive layer of 0.05 ÎŒm.
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ã·ãªã³ãŒã³ãŽã å±€ãåŸãã A 7% Isopar E solution of a silicone rubber composition having the following composition was spin-coated onto this using a Whaler. After drying, it was cured by heating at 120°C for 4 minutes to obtain a 2.2ÎŒ silicone rubber layer.
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匷åºã«æ®åããŠããããã¬ãã€ã«ã ãå¿ å®ã«åçŸ
ããç»åãåŸãããã(a) Dimethylpolysiloxane (molecular weight 80,000, terminal hydroxyl group) 100 parts (b) Vinyl tri(methyl ethyl ketoxime) silane 6 parts (c) Dibutyltin diacetate 0.2 part 150 The film was irradiated for 60 seconds from a distance of 1 m using a metal halide lamp (manufactured by Iwasaki Electric: Idolfin 2000) through a negative film having a line halftone image. The exposed plate was developed using a developer consisting of 8 parts of ethanol and 2 parts of Isopar E through an automatic developing machine at a transport speed of 30 cm/min. The exposed area was easily removed and the chemical conversion treated aluminum surface was exposed. On the other hand, the silicone rubber layer remained firmly in the unexposed areas, and an image faithfully reproducing the negative film was obtained.
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ã§ãã€ãã When this printing plate was attached to an offset printing machine (Komori Sprint 2 Color) and printed using Toyo Ink's "Aquares ST Indigo" without using dampening water, 5 to 95% of the 150-line halftone dots were reproduced. A printed matter with an extremely good image was obtained. Even after 10,000 copies had been printed, no scumming or damage to the plate surface was observed, and printing could continue.
宿œäŸ ïŒ
(A) åã¿0.24mmã®ã¢ã«ãæ¿ïŒäœå軜éå±è£œïŒã«ã¬
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ããExample 3 (A) A resol resin (Sumilight Resin PC-1, manufactured by Sumitomo Decorez) was applied to a thickness of 1.7 ÎŒm on an aluminum plate (manufactured by Sumitomo Light Metals) with a thickness of 0.24 mm, and it was cured at 180°C for 3 minutes and supported. As a body. On this support, the following photosensitive layer composition was spin-coated at 120°C.
It was cured by heating for a minute to form a photosensitive layer with a thickness of 2.3 ÎŒm.
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0.2ÎŒã®æ¥çå±€ãèšããã(a) Naphthoquinone-1,2-diazide-5- of phenol novolak resin (Sumilight Resin PR50235, manufactured by Sumitomo Decorez) with a degree of esterification of 48%
Sulfonic acid ester 100 parts (b) 4,4'-diphenylmethane diisocyanate
30 parts (c) 0.2 parts of dibutyltin dilaurate (d) 2000 parts of dioxane (B) Next, apply a 5% by weight Isopar E solution of tetra-iso-propoxy titanium on this using a Meyer bar coater, and then heat at 120°C for 1 minute. Heat and thicken
An adhesive layer of 0.2Ό was provided.
(C) ããã«ç¶ããŠãã®äžã«äžèšã®çµæã®ã·ãªã³ãŒ
ã³ãŽã çµæç©ãã¡ãŒã€ããŒã³ãŒã¿ã§å¡åžåŸã
120âãDP30âãïŒåã§å ç±ç¡¬åããŠåã¿2.3ÎŒ
ã®ã·ãªã³ãŒã³ãŽã å±€ãèšããã(C) Then, after applying a silicone rubber composition with the composition below using a Meyer bar coater,
Heat cured at 120â, DP30â, 4 minutes to a thickness of 2.3ÎŒ
A silicone rubber layer was provided.
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ããåç»ãã€ã«ã ã«å¿ å®ãªç»åãåŸãããã(a) Dimethylpolysiloxane (molecular weight 25,000, terminal hydroxyl group) 100 parts (b) Ethyltriacetoxysilane 6 parts (c) Dibutyltin acetate 0.2 parts The printing original plate obtained as above had a 150-line halftone image. The negative film was vacuum-adhered according to a conventional method, and imagewise exposed using a metal halide lamp. Next, this plate is immersed in Ethyl Cellosolp/Isopar E (manufactured by Etsuo Chemical Co., Ltd.) (5/95) developer and rubbed lightly with a pad to remove the exposed silicone rubber layer and expose the surface of the photosensitive layer, forming the original film. A faithful image was obtained.
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ããšãªãåªããå°å·ç©ãåŸãããã The unexposed silicone rubber layer of this plate is not attacked by the developer, and the surface of the silicone rubber layer is not scratched during development. Moreover, the printing plate obtained in this manner can provide excellent printed matter without scratches on the plate surface due to paper dust etc. even during printing.
Claims (1)
æå å±€ãæ¥çå±€ããã³ã·ãªã³ãŒã³ãŽã å±€ããã®é
ã«èšããŠãªãæ¹¿ãæ°ŽäžèŠå¹³çå°å·çã«ãããŠãå
èšæ¥çå±€ãææ©ãã¿ããŒããå«ãããšãç¹åŸŽãšã
ãæ¹¿ãæ°ŽäžèŠå¹³çå°å·çã ïŒ ææ©ãã¿ããŒããæ¬¡åŒã§ç€ºãããååç©ã®å°
ãªããšãïŒçš®ã§ããããšãç¹åŸŽãšããç¹èš±è«æ±ã®
ç¯å²ç¬¬ïŒé èšèŒã®æ¹¿ãæ°ŽäžèŠå¹³çå°å·çã TiïŒOR1ïŒ4ïŒTiïŒOR2ïŒoïŒOCOR3ïŒ4-oïŒTi
ïŒOR2ïŒoL4-o ãããã§ãR1ãR3ã¯ççŽ æ°ïŒã20ã®ã¢ã«ãã«ã
ã¢ãªãŒã«ãã·ã¯ãã¢ã«ãã«ãŸãã¯ã¢ã«ã±ãã«åº R2ã¯æ°ŽçŽ ãççŽ æ°ïŒã20ã®ã¢ã«ãã«ãã¢ãªãŒ
ã«ãã·ã¯ãã¢ã«ãã«ãŸãã¯ã¢ã«ã±ãã«åº ã¯ãã¬ãŒãé äœå ïœã¯ïŒãïŒã§ãããã[Scope of Claims] 1. A dampening water-free lithographic printing plate comprising a support, a photosensitive layer containing an orthoquinonediazide compound, an adhesive layer, and a silicone rubber layer in this order, characterized in that the adhesive layer contains an organic titanate. A lithographic printing plate that does not require dampening water. 2. The dampening water-free lithographic printing plate according to claim 1, wherein the organic titanate is at least one compound represented by the following formula. Ti(OR 1 ) 4 , Ti(OR 2 ) o (OCOR 3 ) 4-o , Ti
(OR 2 ) o L 4-o [Here, R 1 and R 3 are alkyl having 1 to 20 carbon atoms,
Aryl, cycloalkyl or alkenyl group R 2 is hydrogen, alkyl having 1 to 20 carbon atoms, aryl, cycloalkyl or alkenyl group L is a chelate ligand n is 0 to 3. ]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15816982A JPS5948768A (en) | 1982-09-13 | 1982-09-13 | Lithographic printing plate requiring no dampening water |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15816982A JPS5948768A (en) | 1982-09-13 | 1982-09-13 | Lithographic printing plate requiring no dampening water |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948768A JPS5948768A (en) | 1984-03-21 |
| JPH0365539B2 true JPH0365539B2 (en) | 1991-10-14 |
Family
ID=15665778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15816982A Granted JPS5948768A (en) | 1982-09-13 | 1982-09-13 | Lithographic printing plate requiring no dampening water |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948768A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4612380A (en) * | 1981-03-11 | 1986-09-16 | Hoffmann-La Roche Inc. | 7-fluoro-prostacyclin analogs |
| US5213617A (en) * | 1991-06-13 | 1993-05-25 | Dow Corning Corporation | Primer for silicone substrates |
| US5238708A (en) * | 1991-06-13 | 1993-08-24 | Dow Corning Corporation | Primer for silicone substrates |
| GB9719644D0 (en) * | 1997-09-17 | 1997-11-19 | Horsell Graphic Ind Ltd | Planographic printing |
-
1982
- 1982-09-13 JP JP15816982A patent/JPS5948768A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948768A (en) | 1984-03-21 |
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