JPH0366028B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a coating agent application device for applying an adhesive, a curing agent, etc. to a coating surface.

2. Description of the Related Art A fixed-quantity dispensing device (dispenser) is known as a device for applying a coating agent to a coating surface. As one of these dispensers, the minimum application amount is 0.001 ~
Dispensers capable of dispensing about 0.002 cc are commercially available.

By the way, when applying instant adhesive to the surface of the object to be adhered using such a dispenser, if the surface to be applied is small, the amount of instant adhesive 1 will increase as shown in Figures 1a to 1c. As a result, the instant adhesive 1 discharged from the discharge port 2 of the dispenser flows out from the application surface 4, which is the main surface of the object 3, to the surrounding area. For instant adhesives, the optimum coating thickness is
Since it is about 0.05 mm, even if the minimum amount of 0.001 cc is applied, it will spread over an area of about 5 mm in diameter. Therefore, if the adhesive is applied to a smaller area, the excess adhesive will spread to unnecessary areas and adhere to other objects, resulting in poor appearance. Moreover, instant adhesives harden due to moisture in the atmosphere. In the application mechanism, when the adhesive discharge port is in a moist atmosphere such as air, adhesion begins from around the discharge port. Then, as time passes, the fixed area expands, making it impossible to eject a constant amount, and eventually hardening and blocking the ejection port, making it impossible to eject.

Therefore, an object of the present invention is to provide a coating device that can perform minute coating.

Another object of the present invention is to provide a coating device that can repeatedly apply instant adhesive little by little.

In order to achieve such an objective, the present invention has the following features:
The application surface is directed downward, and the discharge port of the dispenser is brought relatively and temporarily close to the application surface from below, so that the coating material from the discharge port is applied to the application surface. In particular, when an instant adhesive is used as the coating agent, at least the area around the discharge port is kept in a gas atmosphere in which the instant adhesive does not harden.The present invention will be explained below with reference to Examples.

FIGS. 2a to 2c are explanatory views of the operation of an instant adhesive application mechanism according to an embodiment of the present invention. As shown in Figure a, the object 3 to be adhered is held by a generally known method (not shown). At this time, the coating surface 4 is the lower surface. The discharge port 2 of the dispenser is located below this adherend 3, and the instant adhesive 1 is placed from the upper end.
It's starting to push out. Further, since the instant adhesive 1 absorbs moisture and hardens in the peripheral area including the movement area of the discharge port, a low-temperature atmosphere (dotting point area) 5 with little moisture exists.

When applying the instant adhesive 1, as shown in FIG.
After contacting the application surface 4 of the object 3, the discharge port 2 is lowered to form a coating body 7 on the application surface 4 of the object 3, as shown in FIG. The shape and dimensions of the applicator 7 become larger as the diameter of the discharge port 2 becomes larger, and become smaller as the diameter becomes smaller. However, since the viscosity of the instant adhesive 1 also changes depending on its surface tension, there is a limit to its ability to adhere in large quantities.

According to this embodiment, since the instant adhesive 1 is partially applied to the center of the application surface 4 of the object 3 from below by the dispenser, the instant adhesive 1 is applied instantly to the entire application surface 4 during bonding and assembly. Just make sure that the adhesive 1 is spread evenly. Therefore, the instant adhesive does not protrude into unnecessary areas as in the conventional case.

Further, according to this embodiment, the instant adhesive does not harden because the coating work space has a low humidity atmosphere.

According to the present invention, an atmosphere is maintained in which the instant adhesive does not harden, and the dispenser is applied by raising and lowering the adhesive, which prevents a large amount from dripping due to the adhesive's own weight as in the past. This eliminates the problem and allows the adhesive to be applied in a small amount downward on the adhesive surface without curing. As a result, there is no possibility that the discharge port will be blocked by the hardened mass of the instant adhesive, so application can be continued continuously, making it suitable for automated work.

FIG. 3 is a schematic diagram showing a series of automated mechanisms for bonding the semiconductor element 8 to the shank 9 with the instant adhesive 1 and transporting the shank 9 to a discharge position after bonding. In other words, shank 9 in A position.
is lowered obliquely from above, and the instant adhesive 1 is applied to the application surface 4 of the lower surface of the shank on the raised part 6 of the instant adhesive 11 at the discharge port 2 of the dispenser under a low humidity atmosphere 5. When the coating is completed, the shank 9 moves horizontally to the B position, descends onto the semiconductor element 8 positioned in the beret storage tray 11 placed on the XY table 10, and is attached to the shank 9 by the instant adhesive 1. The semiconductor element 8 is bonded to the substrate. after that,
The shank 9 is conveyed to the ejection position of the G position.

Note that the present invention is not limited to the above embodiments. That is, the present invention can be applied not only to bonding of semiconductor elements but also to bonding of minute parts or mere minute coating.

As described above, according to the coating device of the present invention, it is possible to perform minute coating as well as continuous coating of instant adhesive. As a result, it is possible to automate the assembly and bonding work.

[Brief explanation of drawings]

1A to 1C are explanatory diagrams showing the application operation by a conventional dispenser, FIGS. 2A to 2C are explanatory diagrams showing the application operation by the application mechanism of one embodiment of the present invention, and FIG. 8 is an explanatory diagram showing another embodiment. FIG. 1... Instant adhesive, 2... Discharge port, 3... Adhesive object,
4... Coated surface, 5... Low humidity atmosphere, 7... Coated body, 8...
Berets, 9...Shayank.

Claims (1)

[Claims] 1 A coating device for applying instant adhesive to the application surface of an object to be adhered, in which the application surface of the object to be adhered is positioned downward, and a dispenser filled with instant adhesive is raised from below to approach the application surface. The dispenser is configured to apply the instant adhesive to the application surface and then lower the dispenser, and the space where the instant adhesive is exposed forms a gas atmosphere in which the instant adhesive does not harden. A coating device characterized by being configured as follows.