JPH0366840B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention is applied to an electronic component mounting apparatus for mounting electronic components on a printed circuit board.

[Prior art] In mounting equipment for mounting electronic components on the surface of a printed circuit board, in order to mount electronic components of many different sizes on the same board, multiple devices equipped with heads of a size suitable for the size of the components to be mounted are used. were placed on the line.

[Problems to be Solved by the Invention] For this reason, with the above-mentioned conventional device, the line becomes long, and depending on the electronic components to be mounted, the head must be manually replaced with the head holder. Sex wasn't good either.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus that can mount electronic components of many sizes with a single device.

[Means for Solving the Problems] In order to achieve the above object, the present invention includes a plurality of heads for mounting electronic components on a board, and selects an appropriate head from among the heads at any time to mount the electronic components. An electronic component mounting apparatus for mounting a plurality of heads on a board includes a head mounting section on which a plurality of the heads are placed, a drive device that drives the head mounting section up and down, a head holder that couples the heads, and a head holder and the heads. and a main body for moving the head holder onto the board and the head mounting section, the head is provided with a suction nozzle that sucks the electronic component and slides up and down, A suction nozzle operating body for operating the suction nozzle is disposed within the head holder, and a lever for vertically operating the suction nozzle operating body and a drive device for rotating the lever are provided in the main body, and electronic components stored in advance are provided. Based on the data regarding the size of the head, the head holder is moved onto the head mount, after which the head mount is driven upwards, and a device for locking and unlocking the head is activated to allow the head to be installed or replaced in the head holder. The method is further characterized in that the downward stroke of the suction nozzle is controlled in accordance with the height of the electronic component when mounting the electronic component on the board.

[Function] With the above configuration, the head is automatically replaced based on the component size during mounting, and electronic components of many sizes can be mounted accurately and efficiently with a small number of devices.

[Example] Hereinafter, an example of the present invention will be described based on the drawings.

Figure 1 is a side view to explain the components around the main body, Figure 2 is a side view showing the cam part of the operating lever, Figure 2 is a front view showing the mounting configuration of the head, and Figure 4 is the control system. FIG. 5 is a flowchart explaining the main operation of this embodiment.

In FIG. 1, a head holder 2 and a head 3 fitted into the head holder 2 are provided on the side of a main body 1 that is movable in the X-Y directions. These heads 3 can mount different electronic components at a range of heights, each being one head.

The head holder 2 is supported by the main body 1, and supports a nozzle actuating body 4b for actuating the suction nozzle 4 and an actuating cylinder body 6 for actuating the chucking arm 5 so as to be vertically movable and rotatable.

The suction nozzle 4 consists of a suction part 4a and a nozzle operating body 4b connected to a vacuum device (not shown) via a tube 7, and sucks electronic components at the end of the suction part 4a, It is moved up and down by the first operating lever 8.

Further, the actuating cylinder 6 is made up of an upper cylinder 6a and a lower cylinder 6b, as will be described later, and is moved up and down by a second actuation lever 9.

The first operating lever 8 and the second operating lever 9 are driven by a servo motor 10 provided in the main body 1. Specifically, a drive pulley 11 is fixed to the output shaft of a servo motor 10, and two cams 12 and 13 are supported between the drive pulley 11 and the two operating levers 8 and 9 shown in FIG. A driven pulley 15 provided on the shaft 14 is connected via a belt 16. 17 is a belt 1 between the driving pulley 11 and the driven pulley 15;
This is an intermediate pulley that presses 6.

Of the cams 12 and 13, the large diameter cam 12 is in elastic contact with a first roller 20 provided on the first operating lever 8,
Further, the small diameter cam 13 comes into elastic contact with a second roller 21 provided on the second operating lever 9, and a flat portion 12a is formed on the large diameter cam 12. The actuation timing is determined so that the first actuation lever 8 descends.

Further, a head mounting portion 23 is disposed below the main body 1 near the table 22 on which the printed circuit board is placed, so as to be able to protrude from the upper surface of the table 22. A plurality of heads 3 having sizes corresponding to the sizes of electronic components to be mounted are mounted on the head mounting section 23.

The structure of the head holder 2 is as shown in FIG.

That is, a bearing 24 is provided within the head holder 2, and an outer cylinder 26 is rotatably provided on the bearing 24. A receiving plate 25 is provided at the lower part of the outer cylinder 26, and an upper cylinder 6a of the operating cylinder 6 is provided inside the outer cylinder 26 so as to be movable up and down. A nozzle actuating body 4b of the suction nozzle 4 is provided. The upper cylinder body 6
a and the upper protrusion of the nozzle operating body 4b have the first
A receiver 4c that engages with the operating lever 8 and a receiver 6c that engages with the second operating lever 9 are each fixed. 28 is a pulley that receives a driving force for rotating the outer cylinder 26.

A plurality of holes 26a are provided at the lower side of the outer cylinder 26, into which balls 27, which partially protrude into the outer cylinder 26, are loosely fitted.
A sliding cylinder 18 is provided on the outside of the outer cylinder 26 so as to cover the hole 26a and the ball 27. This sliding cylinder 18 is driven by an appropriate means (not shown) and engages with one end of an operating arm 19 that is rotatably provided with respect to the main body 1. It is operated by. The upper opening 18a of the sliding cylinder 18 has a larger diameter than the inner hole 18b, and when the operating arm 19 rotates, the sliding cylinder 18 descends, and the upper opening 18a opens into a ball. When the ball 27 moves to the position 27, a part of the ball 27 can escape from the inside of the outer cylinder 26 to the outside. Reference numeral 29 is a spring stretched between the receiving plate 25 and the sliding cylinder 18, and always acts in a direction to raise the sliding cylinder 18.

The structure of the head 3 will be explained with reference to FIG.

In the figure, the upper end of the head main body 30 is inserted into the lower opening of the outer cylinder 26, and the ball 27 is inserted into the lower opening of the outer cylinder 26.
is engaged with a part of the receiving groove 30a. The upper outer periphery 30b of the head body 30 has a conical shape, and is adapted to closely engage with the conical inner periphery 26a of the outer cylinder 26.

Further, a support portion 31 for rotatably supporting the chucking arm 5 is provided at the lower part of the head body 30. The chucking arm 5 is pressed by the elastic force of a spring 33 via a pressing body 32 which is in elastic contact with the upper end, and is normally urged to close inward.

A suction part 4a of a suction nozzle 4 is provided inside the chucking arm 5. The suction portion 4a can be attached to and detached from the nozzle operating body 4b within the upper portion of the head body 30. In this attachment/detachment part, a connecting cylinder 34 and a small bearing 35 are interposed.
The suction part 4a can be rotated, the suction part 4a and the nozzle actuating body 4b can be easily attached and detached, and they are closely connected to prevent air leakage. Further, the end portion of the actuating cylinder 6 is brought into contact with the upper cylinder 6a on the outside of this attachment/detachment portion.

The tip 36 of the lower cylindrical body 6b has a tapered shape, and the tip 36 comes into contact with the protrusion 5a formed on the chucking arm 5, so that the protrusion 5a
By pressing , the chucking arm 5 opens outward.

The operations of the above-mentioned parts are controlled by a central processing unit (CPU) 40 which is a control means. In other words, as shown in Figure 4, CPU4
0, data is exchanged between the main body drive section 41 for moving the main body 1 in the X-Y direction, the motor drive section 42 for driving the servo motor 10, the vacuum device drive section 43, and the drive section 44 for the operation arm 19. There is an exchange.

Furthermore, the CPU 40 has a RAM 45 which is a storage element, and the operator stores information such as the mounting position of the electronic component and the component size through the operation unit 46.

Next, the operation of the above embodiment will be explained based on the flowchart shown in FIG.

At the start, the CPU 40 determines whether or not the head 3 fitted in the head holder 2 is suitable for the electronic component to be mounted, based on pre-stored data (5-1), and selects an appropriate head. If so, search for the feeder position of the corresponding part to be mounted (5-2).

Specifically, the main body 1 is moved, the servo motor 10 is driven at the corresponding feeder position, the second operating lever 9 is rotated clockwise by the small diameter cam 13 via the belt 16, and the upper cylinder 6a is lowered. . Then, the lower cylindrical body 6b also descends, so that its tip 36
contacts the protrusion 5a of the tracking arm 5, and the tracking arm 5 is opened outward. After this,
When the first operating lever 8 is operated by the large-diameter cam 12, the nozzle operating body 4b is lowered, and the suction part 4
a is made to protrude downward from the tracking arm 5 (5-3).

At this time, the downward stroke of the suction nozzle 4 is controlled by the CPU 40 based on the height of the relevant part (5-4). That is, based on data on the size (height) of the electronic component stored in advance, the rotation of the servo motor 10 is detected by an appropriate means such as an encoder, and is input to the motor drive unit 42 to control the rotation. do. For this reason, servo motor 1
The downward stroke of the suction portion 4a is controlled by the operation of the first actuating lever 8 driven by 0.

The lowered opening of the suction section 4a is depressurized by the vacuum device via the nozzle operating body 4b and the decompression passage of the tube 7, thereby suctioning the corresponding component. Thereafter, the suction portion 4a rises, the chucking arm 5 closes, and the corresponding component is held by the chucking arm 5. At this point, the relevant parts are aligned (5-5).

In this state, the main body 1 moves the head 3 fitted into the head holder 2 to a predetermined mounting position on the board (5-6), and moves the above-mentioned tracking arm 5 to a predetermined mounting position on the board.
is released and the suction part 4a is lowered (5-7),
Further, the above-described downward stroke is controlled (5-8).

Conventionally, the above-mentioned downward stroke is constant, and due to differences in the height of the electronic component, the suction section may push the electronic component too much or not enough, resulting in a suction error or a mounting error.

However, in this embodiment, since the downward stroke is appropriately controlled depending on the size of the electronic component, the above-mentioned conventional problem can be solved.

By lowering the suction section 4a, the corresponding component is mounted at a predetermined mounting position (5-9).

By the way, if it is decided to mount an electronic component of a size that does not correspond to the size of head 3 while the above-mentioned mounting operation is being performed or at the start of operation (5-1), the following head will be exchanged.

That is, a signal is sent from the CPU 40 to the main body drive section 41, and the main body 1 is moved to move the head holder 2.
is placed on the head mounting section 23 (5-10).
Then, the head 3 currently fitted in the head holder 2 is stored in a predetermined storage section of the head mounting section 23 (5-11). Specifically, when the head holder 2 reaches the above-mentioned position, the head mounting section 23 rises, and on the other hand, a signal is sent to the drive section 44 of the operating arm 19, causing the operating arm 19 to rotate clockwise and slide. The cylindrical body 18 is lowered. Then, as described above, the upper opening 18a of the sliding cylinder 18 is positioned to the side of the ball 27 so that the engagement between the ball 27 of the outer cylinder 26 and the receiving groove 30a of the head main body 30 is released. I will do it. In this state, the head 3 becomes free and falls into the storage section. In order to prevent impact from being applied to the head when the head 3 falls, it is preferable to provide a shock absorbing mechanism in the head mounting portion 23.

Next, when the head holder 2 is moved to the head mounting section 23 in which the head 3 corresponding to the size of the electronic component to be mounted is housed, and the head mounting section 23 is raised, the upper end of the head body 30 of the head 3 is removed. Even if the ball 2 is inserted into the lower opening of the tube 26,
7 and the receiving groove 30a are engaged (5-12). In this state, since no operating force is applied to the sliding cylinder 18 by the operation arm 19, the sliding cylinder 18 is moved between the ball 27 and the receiving groove 30 by the action of the spring 29.
It rises to maintain engagement with a.

After head 3 is replaced in this way,
The main body 1 is controlled by the CPU 40 in order to perform the mounting operation similar to that described above. The above operation is then repeated until all parts have been mounted (5-13).

When replacing the head 3 described above, the connecting cylinder 34 is fixed to the upper end of the suction part 4a, and this connecting cylinder 34 can be attached to and removed from the lower end of the nozzle operating body 4b. Since they fit tightly together to prevent leakage, the replacement can be carried out reliably.

[Effects of the Invention] As explained above, the present invention makes it possible to appropriately select the optimum head from among a plurality of heads placed on the head placement section, and the head that is just placed can be easily compared to other heads. Furthermore, since it is possible to mount electronic components of different heights on one head, it is possible to accurately and efficiently mount electronic components of different sizes with one device. It is also possible to provide an electronic component mounting apparatus that has great practical effects in terms of management.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention; FIG. 1 is a side view for explaining the constituent members around the main body, FIG. A front view showing the installation configuration of the
FIG. 4 is a block diagram showing the control system, and FIG. 5 is a flowchart explaining the main operation. 2...Head holder, 3...Head, 23...
...Head mounting section, 40...Control means, 41, 44
...driving means.

Claims (1)

[Claims] 1. In an electronic component mounting apparatus that is equipped with a plurality of heads for mounting electronic components on a board, and selects an appropriate head from among the heads at any time to mount the electronic component, a head mounting method in which a plurality of the heads are mounted. a drive device for driving the head mounting section up and down; a head holder for coupling the head; a device for locking and unlocking the connection between the head holder and the head; A main body for moving a head holder, the head is provided with a suction nozzle that adsorbs electronic components and slides up and down, a suction nozzle actuator for operating the suction nozzle is arranged in the head holder, and A lever that moves the suction nozzle operating body up and down and a drive device that rotates the lever are provided, and the head holder is moved onto the head mounting section based on data related to the size of the electronic component stored in advance, and then the head holder is moved onto the head mounting section. The mounting section is driven upwards, and the device that locks and unlocks the head works to attach or replace the head to the head holder.Furthermore, when mounting the electronic component on the board, the downward stroke of the suction nozzle moves the electronic component. An electronic component mounting device characterized by being controlled according to height.