JPH0367335B2 - - Google Patents

Info

Publication number
JPH0367335B2
JPH0367335B2 JP57151507A JP15150782A JPH0367335B2 JP H0367335 B2 JPH0367335 B2 JP H0367335B2 JP 57151507 A JP57151507 A JP 57151507A JP 15150782 A JP15150782 A JP 15150782A JP H0367335 B2 JPH0367335 B2 JP H0367335B2
Authority
JP
Japan
Prior art keywords
pattern
resist
mask
forming
dummy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57151507A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5941839A (ja
Inventor
Mikio Segawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57151507A priority Critical patent/JPS5941839A/ja
Publication of JPS5941839A publication Critical patent/JPS5941839A/ja
Publication of JPH0367335B2 publication Critical patent/JPH0367335B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP57151507A 1982-08-31 1982-08-31 パタ−ン形成方法 Granted JPS5941839A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57151507A JPS5941839A (ja) 1982-08-31 1982-08-31 パタ−ン形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57151507A JPS5941839A (ja) 1982-08-31 1982-08-31 パタ−ン形成方法

Publications (2)

Publication Number Publication Date
JPS5941839A JPS5941839A (ja) 1984-03-08
JPH0367335B2 true JPH0367335B2 (2) 1991-10-22

Family

ID=15520015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57151507A Granted JPS5941839A (ja) 1982-08-31 1982-08-31 パタ−ン形成方法

Country Status (1)

Country Link
JP (1) JPS5941839A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62194627A (ja) * 1986-02-20 1987-08-27 Fujitsu Ltd 半導体装置の製造方法
JP4521694B2 (ja) * 2004-03-09 2010-08-11 Ｈｏｙａ株式会社 グレートーンマスク及び薄膜トランジスタの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713180A (en) * 1980-06-25 1982-01-23 Fujitsu Ltd Etching method

Also Published As

Publication number Publication date
JPS5941839A (ja) 1984-03-08

Similar Documents

Publication Publication Date Title
KR940008772B1 (ko) 전기적 비아 구조물 및 그 형성방법
JPH0360055A (ja) 集積回路の製造方法
JPS60130144A (ja) 相互接続用スタツド構造体形成方法
US4172758A (en) Magnetic bubble domain device fabrication technique
US6297145B1 (en) Method of forming a wiring layer having an air bridge construction
US4317700A (en) Method of fabrication of planar bubble domain device structures
JPH0367335B2 (2)
JP2000058549A (ja) 集積回路配線の形成方法
US4510231A (en) Method for manufacturing a magnetic bubble memory
JPH04287326A (ja) 半導体装置およびその製造方法
JPH05160271A (ja) 半導体装置
JP3114196B2 (ja) 半導体装置
JPS62136857A (ja) 半導体装置の製造方法
JPS6260241A (ja) 多層配線構造の製造方法
JPS6329549A (ja) 多層配線構造
JPS60124950A (ja) 多層配線構造を有する半導体装置
JPH04364042A (ja) 半導体集積回路装置
JP2699498B2 (ja) 半導体装置の製造方法
JP2521329B2 (ja) 半導体装置の製造方法
JPH01144656A (ja) 多層配線構造およびその製造方法
JPH08111460A (ja) 多層配線の構造および製造方法
JPS59117236A (ja) 半導体装置
JPH04250628A (ja) 半導体装置の製造方法
JPH0267730A (ja) 半導体装置
JPS6148779B2 (2)