JPH0367435U - - Google Patents
Info
- Publication number
- JPH0367435U JPH0367435U JP1989129776U JP12977689U JPH0367435U JP H0367435 U JPH0367435 U JP H0367435U JP 1989129776 U JP1989129776 U JP 1989129776U JP 12977689 U JP12977689 U JP 12977689U JP H0367435 U JPH0367435 U JP H0367435U
- Authority
- JP
- Japan
- Prior art keywords
- air cylinder
- air
- bonding tool
- bonding
- regulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図は第１図の平面図、第３図は第１図の要部の拡
大図、第４図は第１図の要部の斜視図、第５図は
エアシリンダ２１，２２の配管系統を示す部分断
面系統図である。
１……ボンデイング装置、２……テープ、２ａ
……接着部、２ｂ……リード線、３……チツプ、
１０……制御装置、１６……ボンデイングツール
、３１，３２……分岐管、２１，２２……エアシ
リンダ、３３……レギユレータ、３４……供給源
、３５，３６……開閉弁。
Figure 1 is a front view showing one embodiment of the present invention;
The figure is a plan view of Fig. 1, Fig. 3 is an enlarged view of the main part of Fig. 1, Fig. 4 is a perspective view of the main part of Fig. 1, and Fig. 5 shows the piping system of the air cylinders 21 and 22. FIG. 1... Bonding device, 2... Tape, 2a
... Adhesive part, 2b ... Lead wire, 3 ... Chip,
DESCRIPTION OF SYMBOLS 10... Control device, 16... Bonding tool, 31, 32... Branch pipe, 21, 22... Air cylinder, 33... Regulator, 34... Supply source, 35, 36... Open/close valve.
Claims (1)
ボンデイングツールを押下げるエアシリンダと、
前記エアシリンダに供給するエア圧を調整するレ
ギユレータとを備え、上記エアシリンダにエア圧
を導入して上記ボンデイングツールを降下させ、
上記エア圧に応じた加圧力でチツプとリード線と
を相互に圧着させるようにしたボンデイング装置
において、 上記エアシリンダを複数個設けて各エアシリン
ダを上記ボンデイングツールに連動させるととも
に、上記レギユレータを分岐管を介してそれぞれ
エアシリンダに連通させ、さらに上記分岐管に開
閉弁を設けたことを特徴とするボンデイング装置
の加圧装置。[Scope of claim for utility model registration] A bonding tool that can be raised and lowered, an air cylinder that presses down the bonding tool,
a regulator that adjusts air pressure supplied to the air cylinder, and lowers the bonding tool by introducing air pressure into the air cylinder,
In a bonding device that crimps a chip and a lead wire to each other with a pressure corresponding to the air pressure, a plurality of the air cylinders are provided, each air cylinder is linked to the bonding tool, and the regulator is branched. A pressurizing device for a bonding device, characterized in that each of the branch pipes is connected to an air cylinder through a pipe, and an on-off valve is provided in the branch pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989129776U JPH0536271Y2 (en) | 1989-11-07 | 1989-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989129776U JPH0536271Y2 (en) | 1989-11-07 | 1989-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0367435U true JPH0367435U (en) | 1991-07-01 |
| JPH0536271Y2 JPH0536271Y2 (en) | 1993-09-14 |
Family
ID=31677382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989129776U Expired - Lifetime JPH0536271Y2 (en) | 1989-11-07 | 1989-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536271Y2 (en) |
-
1989
- 1989-11-07 JP JP1989129776U patent/JPH0536271Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0536271Y2 (en) | 1993-09-14 |
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