JPH0455136U - - Google Patents
Info
- Publication number
- JPH0455136U JPH0455136U JP1320190U JP1320190U JPH0455136U JP H0455136 U JPH0455136 U JP H0455136U JP 1320190 U JP1320190 U JP 1320190U JP 1320190 U JP1320190 U JP 1320190U JP H0455136 U JPH0455136 U JP H0455136U
- Authority
- JP
- Japan
- Prior art keywords
- atmosphere
- cover
- gas supply
- workpiece
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案の一実施例にかかる可動用カ
バーの斜視図、第２図は、第１図−線に沿う
断面図、第３図は、本考案の一実施例にかかるワ
イヤボンデイング装置の固定カバー及び可動カバ
ーを除去した状態における平面図、第４図は、同
装置の側面説明図、第５図は、同実施例の前記固
定カバー及び可動カバーを装着した状態の要部平
面図、第６図は、半導体製造ラインを示す工程ブ
ロツク図である。
１１……ワイヤボンデイング、２５……可動カ
バー、４３……ボンデイング用開口部、４６……
吹出口、４７，４８……雰囲気ガス供給配管。
FIG. 1 is a perspective view of a movable cover according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line shown in FIG. 1, and FIG. 3 is a wire bonding diagram according to an embodiment of the present invention. FIG. 4 is a side view of the device, and FIG. 5 is a plan view of the main part of the same embodiment with the fixed cover and movable cover attached. 6 are process block diagrams showing a semiconductor manufacturing line. 11... Wire bonding, 25... Movable cover, 43... Bonding opening, 46...
Air outlet, 47, 48...atmosphere gas supply piping.
補正 平３．１０．２４
図面の簡単な説明を次のように補正する。
明細書第１８頁第４行目から同頁第６行目に「
、第６図は、半導体製造ラインを示す工程ブロツ
ク図」とあるを削除する。Amendment 3/10/24 The brief description of the drawing is amended as follows. From line 4 of page 18 of the specification to line 6 of the same page, “
, ``Figure 6 is a process block diagram showing a semiconductor manufacturing line'' has been deleted.
Claims (1)
化防止ガスの雰囲気中で、搬送されたワークにワ
イヤを圧着するワイヤボンデイング装置において
、該ワイヤボンデイング装置に、摺動自在であつ
て前記ワークを覆う可動カバーを設け、該可動カ
バーにボンデイング用開口部と、雰囲気ガス供給
配管とを設けるとともに、該雰囲気ガス供給配管
から給送された雰囲気ガスを、前記ボンデイング
開口部の周部から略水平方向に吹き出させる吹出
口を設けたことを特徴とするボンダの雰囲気カバ
ー。 (2) 半導体製造ラインに配置されたダイボンデ
イング装置に、請求項１記載の前記ボンデイング
用開口部と前記雰囲気用配管、及び吹出口を有す
る固定カバーを設けたことを特徴とするボンダの
雰囲気カバー。 (3) 前記雰囲気ガス供給配管を、前記吹出口の
両側部位に設けたことを特徴とする請求項１又は
２記載の雰囲気カバー。[Claims for Utility Model Registration] (1) In a wire bonding device that is placed in a semiconductor manufacturing line and crimps a wire to a transported workpiece in an atmosphere of workpiece oxidation-preventing gas, the wire bonding device A movable cover that is movable and covers the workpiece is provided, and the movable cover is provided with a bonding opening and an atmospheric gas supply pipe, and the atmospheric gas supplied from the atmospheric gas supply pipe is supplied to the bonding opening. An atmosphere cover for a bonder, characterized in that an air outlet is provided to emit air from the periphery in a substantially horizontal direction. (2) A bonder atmosphere cover, characterized in that a fixed cover having the bonding opening, the atmosphere piping, and the air outlet according to claim 1 is provided in a die bonding apparatus disposed in a semiconductor manufacturing line. . (3) The atmosphere cover according to claim 1 or 2, wherein the atmosphere gas supply pipes are provided on both sides of the outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1320190U JPH0755001Y2 (en) | 1990-02-14 | 1990-02-14 | Bond atmosphere cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1320190U JPH0755001Y2 (en) | 1990-02-14 | 1990-02-14 | Bond atmosphere cover |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0455136U true JPH0455136U (en) | 1992-05-12 |
| JPH0755001Y2 JPH0755001Y2 (en) | 1995-12-18 |
Family
ID=31747520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1320190U Expired - Lifetime JPH0755001Y2 (en) | 1990-02-14 | 1990-02-14 | Bond atmosphere cover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755001Y2 (en) |
-
1990
- 1990-02-14 JP JP1320190U patent/JPH0755001Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755001Y2 (en) | 1995-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |