JPH0367451U - - Google Patents

Info

Publication number
JPH0367451U
JPH0367451U JP1989130092U JP13009289U JPH0367451U JP H0367451 U JPH0367451 U JP H0367451U JP 1989130092 U JP1989130092 U JP 1989130092U JP 13009289 U JP13009289 U JP 13009289U JP H0367451 U JPH0367451 U JP H0367451U
Authority
JP
Japan
Prior art keywords
die pad
frame
lead
semiconductor device
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989130092U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989130092U priority Critical patent/JPH0367451U/ja
Publication of JPH0367451U publication Critical patent/JPH0367451U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体装置
用リードフレームを示す部分拡大図、第２図は第
１図のリードフレームを用いて、実際に半導体装
置を組み立てた場合を示した部分拡大図、第３図
はこの考案の他の実施例を示す同じく部分拡大図
、第４図〜第８図は従来のリードフレームあるい
は、従来のリードフレームを用いて半導体装置を
組み立てた場合を示したそれぞれ部分拡大図であ
る。 図において、１……ダイスパツト、２……イン
ナーリード、３……吊りリード、４……半導体素
子あるいは集積回路、５……電極、６……金属細
線示す。なお、図中、同一符号は同一、又は相当
部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子もしくは集積回路を固着するダイパ
    ツト部と、半導体素子もしくは集積回路の各電極
    と金属細線等で接続される複数のリード部を有す
    る半導体装置用リードフレームにおいて、前記ダ
    イパツト部より延在して、フレーム枠に繋がつて
    いる吊りリードがダイパツト端に対し垂直部分を
    ２ケ所設け、前記垂直部分を曲げ加工したことを
    特徴とする半導体装置用リードフレーム。
JP1989130092U 1989-11-06 1989-11-06 Pending JPH0367451U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989130092U JPH0367451U (ja) 1989-11-06 1989-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989130092U JPH0367451U (ja) 1989-11-06 1989-11-06

Publications (1)

Publication Number Publication Date
JPH0367451U true JPH0367451U (ja) 1991-07-01

Family

ID=31677687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989130092U Pending JPH0367451U (ja) 1989-11-06 1989-11-06

Country Status (1)

Country Link
JP (1) JPH0367451U (ja)

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