JPH036879U - - Google Patents
Info
- Publication number
- JPH036879U JPH036879U JP2456689U JP2456689U JPH036879U JP H036879 U JPH036879 U JP H036879U JP 2456689 U JP2456689 U JP 2456689U JP 2456689 U JP2456689 U JP 2456689U JP H036879 U JPH036879 U JP H036879U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit device
- resin
- utility
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は従来装置の断面構造図、第２図は本考
案の実施例を示す断面構造図及び斜視構造図であ
り、１……ケース、２……部品、３……配線基板
、４……充填樹脂、５……リード、６……蓋状枠
体、７……空所、Ａ，Ｂ……指定の位置である。
FIG. 1 is a cross-sectional structural diagram of a conventional device, and FIG. 2 is a cross-sectional structural diagram and a perspective structural diagram showing an embodiment of the present invention. 1... Case, 2... Parts, 3... Wiring board, 4... ...filling resin, 5...lead, 6...lid-shaped frame, 7...vacancy, A, B...designated position.
補正 平１．６．１５
図面の簡単な説明を次のように補正する。
明細書第４頁第１３行…「第２図」を…「第２
図及び第３図」と訂正する。Amendment 1.6.15 Hei 1. The brief description of the drawing is amended as follows. Page 4, line 13 of the specification..."Figure 2"..."2
and Figure 3”.
Claims (1)
内に収容し、樹脂により、充填封止した電子回路
装置において、最も背の高い部品の頂部より広い
面積の空所を設けた蓋状枠体をケース開口部を被
い、かつ、蓋空所の内部又は下方に該部品が位置
するごとく該開口部にはめ込むように構成したこ
とを特徴とする樹脂封止型電子回路装置。 (2) 該状枠体にリードを貫通する穴を設けた実
用新案登録請求の範囲第(1)項の樹脂封止型電子
回路装置。[Scope of claim for utility model registration] (1) In an electronic circuit device in which a board on which multiple components are mounted is housed in a box-shaped case and filled and sealed with resin, an area larger than the top of the tallest component. A resin seal characterized in that a lid-like frame with a cavity is configured to cover a case opening and to be fitted into the opening so that the component is located inside or below the lid cavity. Stop type electronic circuit device. (2) The resin-sealed electronic circuit device according to claim (1) of the utility model registration claim, wherein the shaped frame is provided with a hole through which the lead passes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2456689U JPH0631742Y2 (en) | 1989-03-03 | 1989-03-03 | Resin-sealed electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2456689U JPH0631742Y2 (en) | 1989-03-03 | 1989-03-03 | Resin-sealed electronic circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH036879U true JPH036879U (en) | 1991-01-23 |
| JPH0631742Y2 JPH0631742Y2 (en) | 1994-08-22 |
Family
ID=31527528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2456689U Expired - Lifetime JPH0631742Y2 (en) | 1989-03-03 | 1989-03-03 | Resin-sealed electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631742Y2 (en) |
-
1989
- 1989-03-03 JP JP2456689U patent/JPH0631742Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0631742Y2 (en) | 1994-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |