JPH0368813B2 - - Google Patents

Info

Publication number
JPH0368813B2
JPH0368813B2 JP59129663A JP12966384A JPH0368813B2 JP H0368813 B2 JPH0368813 B2 JP H0368813B2 JP 59129663 A JP59129663 A JP 59129663A JP 12966384 A JP12966384 A JP 12966384A JP H0368813 B2 JPH0368813 B2 JP H0368813B2
Authority
JP
Japan
Prior art keywords
prepreg
chemical plating
adhesive layer
laminate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59129663A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6110453A (ja
Inventor
Yoshiki Murakami
Hitoshi Doi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Risho Kogyo Co Ltd
Original Assignee
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Co Ltd filed Critical Risho Kogyo Co Ltd
Priority to JP59129663A priority Critical patent/JPS6110453A/ja
Publication of JPS6110453A publication Critical patent/JPS6110453A/ja
Publication of JPH0368813B2 publication Critical patent/JPH0368813B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
JP59129663A 1984-06-22 1984-06-22 化学メツキ用積層板の製造方法 Granted JPS6110453A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59129663A JPS6110453A (ja) 1984-06-22 1984-06-22 化学メツキ用積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59129663A JPS6110453A (ja) 1984-06-22 1984-06-22 化学メツキ用積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS6110453A JPS6110453A (ja) 1986-01-17
JPH0368813B2 true JPH0368813B2 (de) 1991-10-29

Family

ID=15015068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59129663A Granted JPS6110453A (ja) 1984-06-22 1984-06-22 化学メツキ用積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS6110453A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6170303B2 (ja) * 2013-02-01 2017-07-26 富士フイルム株式会社 反射体およびその製造方法

Also Published As

Publication number Publication date
JPS6110453A (ja) 1986-01-17

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