JPH0370883U - - Google Patents

Info

Publication number
JPH0370883U
JPH0370883U JP1989133244U JP13324489U JPH0370883U JP H0370883 U JPH0370883 U JP H0370883U JP 1989133244 U JP1989133244 U JP 1989133244U JP 13324489 U JP13324489 U JP 13324489U JP H0370883 U JPH0370883 U JP H0370883U
Authority
JP
Japan
Prior art keywords
processing device
laser processing
fusing
nozzle
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989133244U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989133244U priority Critical patent/JPH0370883U/ja
Publication of JPH0370883U publication Critical patent/JPH0370883U/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例の側面図、第2図は
本考案の他の実施例の側面図である。 1……レーザー用電源、2……レーザー光源、
3……レーザー光、4……光学顕微鏡、5……半
導体素子、6……微細配線、7……ポンプ、8…
…ノズル、9……加熱器、10……マニユピレー
タ、11……X−Yステージ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子に形成された微細配線をレーザー光
    のエネルギーにより溶断させるレーザー加工装置
    において、溶断箇所に高圧エアーを吹き付けるノ
    ズルを有することを特徴とするレーザー加工装置
    。
JP1989133244U 1989-11-15 1989-11-15 Pending JPH0370883U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989133244U JPH0370883U (ja) 1989-11-15 1989-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989133244U JPH0370883U (ja) 1989-11-15 1989-11-15

Publications (1)

Publication Number Publication Date
JPH0370883U true JPH0370883U (ja) 1991-07-17

Family

ID=31680654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989133244U Pending JPH0370883U (ja) 1989-11-15 1989-11-15

Country Status (1)

Country Link
JP (1) JPH0370883U (ja)

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