JPH0373443U - - Google Patents

Info

Publication number
JPH0373443U
JPH0373443U JP1989134351U JP13435189U JPH0373443U JP H0373443 U JPH0373443 U JP H0373443U JP 1989134351 U JP1989134351 U JP 1989134351U JP 13435189 U JP13435189 U JP 13435189U JP H0373443 U JPH0373443 U JP H0373443U
Authority
JP
Japan
Prior art keywords
wire bonding
clamper
bonding device
pad holder
clamping surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989134351U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989134351U priority Critical patent/JPH0373443U/ja
Publication of JPH0373443U publication Critical patent/JPH0373443U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示すワイヤボンデイ
ング装置の正面図、第２図はそのワイヤボンデイ
ング装置の側面図、第３図はそのワイヤボンデイ
ング装置のクランパの動作を示す図、第４図はそ
のクランパの裏面図、第５図は本考案の他の実施
例を示すワイヤボンデイング装置の構成図、第６
図は従来のワイヤボンデイング装置の正面図、第
７図はそのワイヤボンデイング装置の側面図、第
８図はそのワイヤボデイング装置の動作を示す図
、第９図はそのワイヤボンデイング装置のクラン
パの構成図、第１０図はそのワイヤボンデイング
装置のクランパの状態を示す図、第１１図乃至第
１３図は従来技術の問題点を示す図である。 ３１……クランパ、３３……アーム、３４……
キヤピラリ、３７……第１のクランパ、３８……
第２のクランパ、４１……パツドホルダ、４２…
…棒磁石、４３……コイル、４５……固定側クラ
ンパ、４９……クランプパツド、５０……ストツ
パ。 Fig. 1 is a front view of a wire bonding device showing an embodiment of the present invention, Fig. 2 is a side view of the wire bonding device, Fig. 3 is a view showing the operation of the clamper of the wire bonding device, and Fig. 4 is a diagram showing the operation of the clamper of the wire bonding device. FIG. 5 is a back view of the clamper, and FIG. 6 is a configuration diagram of a wire bonding device showing another embodiment of the present invention.
The figure is a front view of a conventional wire bonding device, FIG. 7 is a side view of the wire bonding device, FIG. 8 is a diagram showing the operation of the wire bonding device, and FIG. 9 is the structure of the clamper of the wire bonding device. 10 are diagrams showing the state of the clamper of the wire bonding apparatus, and FIGS. 11 to 13 are diagrams showing problems in the prior art. 31... Clamper, 33... Arm, 34...
Capillary, 37...First clamper, 38...
Second clamper, 41... Pad holder, 42...
... Bar magnet, 43 ... Coil, 45 ... Fixed side clamper, 49 ... Clamp pad, 50 ... Stopper.

Claims (1)

【実用新案登録請求の範囲】 半導体組立工程で用いるワイヤボンデイング装
置において、 (a) 固定された平面状の第１の挟持面を有する
円筒状の穴が形成されるパツドホルダと、 (b) 該パツドホルダの穴内を往復運動可能な柱
状形の第２の挟持面を有するワイヤクランパとを
具備することを特徴とするワイヤボンデイング装
置。[Claims for Utility Model Registration] A wire bonding device used in a semiconductor assembly process, comprising: (a) a pad holder in which a cylindrical hole having a fixed flat first clamping surface is formed; and (b) the pad holder. A wire bonding apparatus comprising: a wire clamper having a columnar second clamping surface capable of reciprocating within the hole.
JP1989134351U 1989-11-21 1989-11-21 Pending JPH0373443U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989134351U JPH0373443U (en) 1989-11-21 1989-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989134351U JPH0373443U (en) 1989-11-21 1989-11-21

Publications (1)

Publication Number Publication Date
JPH0373443U true JPH0373443U (en) 1991-07-24

Family

ID=31681692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989134351U Pending JPH0373443U (en) 1989-11-21 1989-11-21

Country Status (1)

Country Link
JP (1) JPH0373443U (en)

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