JPH0241432U - - Google Patents
Info
- Publication number
- JPH0241432U JPH0241432U JP1988119669U JP11966988U JPH0241432U JP H0241432 U JPH0241432 U JP H0241432U JP 1988119669 U JP1988119669 U JP 1988119669U JP 11966988 U JP11966988 U JP 11966988U JP H0241432 U JPH0241432 U JP H0241432U
- Authority
- JP
- Japan
- Prior art keywords
- pair
- piezoelectric elements
- bonding device
- wire bonding
- clamper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示す構成図、第２
図は従来のカムのリフトを利用したワイヤクラン
パを示す平面図、第３図は従来の電磁ソレノイド
を利用したワイヤクランパを示す平面図である。
１…圧電素子、２…クランプチツプ、３…ワイ
ヤ、４…導線、５…電圧コントロール部。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
This figure is a plan view showing a conventional wire clamper using a cam lift, and FIG. 3 is a plan view showing a conventional wire clamper using an electromagnetic solenoid. DESCRIPTION OF SYMBOLS 1... Piezoelectric element, 2... Clamp chip, 3... Wire, 4... Conductive wire, 5... Voltage control part.
Claims (1)
ンプするワイヤクランパにおいて、電圧の印加に
より互いに接近する方向にひずみを生ずる一対の
圧電素子と、該一対の圧電素子の内端にそれぞれ
装着した一対のクランプチツプとを有することを
特徴とする半導体ワイヤボンデイング装置のワイ
ヤクランパ。 A wire clamper for clamping wires of a semiconductor wire bonding device includes a pair of piezoelectric elements that produce strain in a direction toward each other when a voltage is applied, and a pair of clamp chips respectively attached to the inner ends of the pair of piezoelectric elements. A wire clamper for a semiconductor wire bonding device, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988119669U JPH0241432U (en) | 1988-09-12 | 1988-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988119669U JPH0241432U (en) | 1988-09-12 | 1988-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241432U true JPH0241432U (en) | 1990-03-22 |
Family
ID=31365100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988119669U Pending JPH0241432U (en) | 1988-09-12 | 1988-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241432U (en) |
-
1988
- 1988-09-12 JP JP1988119669U patent/JPH0241432U/ja active Pending
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