JPH0375196A - Card type semiconductor device - Google Patents

Abstract

PURPOSE:To obtain an inexpensive card type semiconductor device excellent in mass productivity by connecting and fixing a terminal member to an element mounting part completed of sealing. CONSTITUTION:Leads 15 for connecting terminal parts and the dam bar 16 mutually fixing said leads are formed to a lead frame 12 in addition to an element loading part 13. Next, enclosed molding of the element loading part 13 and the lead frame 12 is performed so as to expose the leads 15 and the dam bar 16. Subsequently, the dam bar 16 is cut to separate the leads 15. A terminal member 20 is prepared and terminals 21 are formed on the surface thereof. Next, the connection terminals 22 of the terminal member 20 are con nected to the leads 15 electrically and mechanically using a means such as solder or spot welding nd the surface connection parts of the leads 15 are subse quently coated with a seal resin 25. By this constitution, the deterioration of dimensional accuracy in a terminal part forming process or the generation of trouble in a resin sealing process caused thereby can be eliminated and reliability can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a card-type semiconductor device with a thin package structure used in tC cards and the like.

(Prior Art) In recent years, so-called "card-type semiconductor devices", which are semiconductor devices formed into a thin plate-like shape and mounted in such a way that their contact terminals are exposed, have become popular as memory components of various electronic devices. It is becoming popular as a usage.

FIG. 9 is a sectional view of such a conventional card-type semiconductor device, and FIG. 1O is a plan view of a circuit board of the card-type semiconductor device.

First, in FIG. 9, a semiconductor element 1 is adhesively fixed to a predetermined position of a circuit board 2 using an epoxy resin or the like, and connected by wires 3. As shown in FIG. Thereafter, the resin 4 is sealed and molded using means such as transfer molding.

The semiconductor device 5 thus obtained is mounted on a card frame 6, covered with a label 7, and completed. At this time, the terminal portion 8 provided on the circuit board 2 is mounted in such a manner that it is fitted into a through hole 9 provided at a predetermined position of the card frame 6, and the terminal IO is exposed on the surface of the card frame 6. and is used to connect with external equipment.

In order to obtain the above structure, it is naturally necessary to form the terminal part 8 of the circuit board 2 thicker than other parts, but the manufacturing method is as shown in FIG. A method is adopted in which the portion other than the terminal portion 8 of No. 2 (the shaded portion) is ground down to a predetermined thickness using a grinder or the like.

(Problem to be Solved by the Invention) However, in the semiconductor device having the above configuration, as described above, when forming the terminal portion 8, other parts of the circuit board 2 must be cut, so the dimensions after cutting are It was difficult to manage. In addition, depending on the size of the variation in board thickness, it may have a serious effect on the sealing process (crushing of the circuit board when clamped to a mold, occurrence of resin cracks due to a drop in clamping pressure due to insufficient board thickness, etc.) ),
Due to the high degree of difficulty of the cutting process itself, the manufacturing cost of the circuit board was also unparalleled and technically unsatisfactory.

The present invention provides the above-mentioned manufacturing steps in the terminal portion forming process.
In order to eliminate cost problems, we have created a card type that is inexpensive and easy to mass produce by making the terminal part an independent part and connecting and fixing it to the element mounting part that has been sealed in advance. The purpose is to provide semiconductor devices.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a card-type semiconductor device that includes an element mounting component that has undergone sealing molding;
A terminal member connected to the element mounting component is provided, and the terminal member is connected and fixed to the element mounting component.

(Function) According to the present invention, as described above, in a card-type semiconductor device, an externally exposed contact terminal member (hereinafter simply referred to as a terminal member), which has conventionally been integrally formed on a circuit board serving as a main body of the device, can be replaced with an independent one. In the main body of the device, the terminal portion can be constructed by connecting and fixing the terminal member to the element mounting component by molding the frame and the sealing resin without using a circuit board.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

1 to 8 are diagrams showing each process of a card type semiconductor device showing an embodiment of the present invention.

The steps will be explained step by step below.

First, as shown in FIG. 1, the semiconductor element 11 is attached to the element mounting portion 13 of a lead frame 12 obtained by patterning a metal thin plate such as 42 alloy into a predetermined shape using means such as resin bonding. It is fixed and hardwired by wires 14. Further, in addition to the element mounting portion 13, the lead frame 12 is formed with a terminal portion connecting glue 15 and a dam bar 16 for fixing the leads to each other, which will be described later.

Next, as shown in FIG. 2, using means such as transfer molding, the element mounting portion 13 and the lead frame 12 are sealed with a sealing resin 17 such as epoxy in such a manner that the leads 15 and dam bars 16 are exposed. Perform sealing molding.

Next, as shown in FIG. 3, the dam bar 16 is cut using a means such as press cutting, and the leads 15 are separated.

On the other hand, as shown in FIG. 4, a terminal member 20 is prepared. This terminal member 20 is made by applying a predetermined patterning to a base material such as glass epoxy. ) is formed with a terminal 21. This terminal 21 is used for connection with external equipment when the card type semiconductor device is in its final shape. Further, on the back surface of the terminal member 20 (see FIG. 4(b)), connection terminals 22 for connecting to the above-mentioned board 15 are formed so as to be electrically connected to each of the terminals 21. A through hole 23 connects the terminal 22 and the terminal 21 .

Next, as shown in FIG. 5, the connection terminal 22 of the terminal member 20 is electrically and mechanically connected to the lead 15 described above using means such as solder or spot welding.

Next, as shown in FIG. 6, the connection portions on the front side of the leads 15 are covered with a sealing resin 25.

Although the solid pieces may be divided before this step and sent to the carding step, this step is performed in order to increase the reliability of the connection portion.

Next, as shown in FIG. 7, the lead frame 12 is divided into solid pieces. That is, the card type semiconductor device divided into solid pieces has the semiconductor element 11 mounted on the element mounting portion 13 as described above.
is mounted and connected to the lead 15 via the wire 14, and the sealing resin 17 is mounted on the lead 15 except for the terminal connection part of the lead 15.
A terminal member 20 having a terminal 21 is provided on the back side of the terminal connection part [No. 7 shown in cross section].
(see FIG. 7(b)), and its front side is molded with a sealing resin 25 (see FIG. 7(a)).

Thereafter, as shown in FIG. 8, the element mounting portion 13 is covered with a card frame 26 and a label 27, as in the conventional case, to complete the card-type semiconductor device. Note that FIG. 8(a) is a plan view, and FIG. 8(b) is a sectional view.

In addition, as shown in FIG. 11, in the process of molding the semiconductor element 11 with resin, a mold is used whose outer shape after molding is similar to the final shape after being assembled into the card frame. , resin molded body 2 in place of card frame
8, the card frame itself becomes unnecessary and a more advantageous structure can be achieved in terms of cost.

Here, FIG. 11(a) is a plan view, and FIG. 11(b) is a sectional view.

Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described above in detail, according to the present invention, the following effects can be achieved.

(1) Conventionally, in the circuit board manufacturing process, the terminal part obtained by cutting the parts other than the terminal part to make it thin is made into an independent component, and the semiconductor element is mounted using a molding method using a lead frame and sealing resin. Furthermore, since the structure is such that these are connected and fixed, it is possible to eliminate deterioration of dimensional accuracy in the terminal forming process and the occurrence of defects in the resin sealing process due to this, and improve reliability. can.

(2) There is no need to use an expensive circuit board that has undergone cutting, etc., and the elements are mounted using an inexpensive lead frame and sealing resin, which is very advantageous in terms of cost.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the first step of a card-type semiconductor device according to an embodiment of the present invention, FIG. 2 is a diagram showing the second step, and FIG.
The figure shows the third step, FIG. 4 shows the fourth step, FIG. 5 shows the fifth step, FIG. 6 shows the sixth step, and FIG. The figure shows the seventh step, and the eighth
The figure shows the eighth step, FIG. 9 is a cross-sectional view of a conventional card-type semiconductor device, FIG. 1O is a plan view of a circuit board of a conventional card-type semiconductor device, and FIG. FIG. 1 is a configuration diagram of a card-type semiconductor device showing an example. 11... Semiconductor element, 12... Lead frame, 1
3...Element mounting part, 14...Wire, 15...9
- code, 16... dam bar, 17... sealing resin, 20
...Terminal member, 21...Terminal, 22...Connection terminal, 23...Through hole, 25...Sealing resin, 26
...Card frame, 27...Label, 2B...
Resin forming body. Figure 3

Claims (1)

[Scope of Claims] A card-type semiconductor device in which connection terminals are formed so as to protrude from the main surface of the device body, comprising: (a) an element mounting part formed by sealing molding; and (b) the element mounting part. and a terminal member connected to the
A card type semiconductor device in which the terminal member is connected and fixed to the element mounting component.