JPH0375539U - - Google Patents

Info

Publication number
JPH0375539U
JPH0375539U JP13679589U JP13679589U JPH0375539U JP H0375539 U JPH0375539 U JP H0375539U JP 13679589 U JP13679589 U JP 13679589U JP 13679589 U JP13679589 U JP 13679589U JP H0375539 U JPH0375539 U JP H0375539U
Authority
JP
Japan
Prior art keywords
semiconductor
recess
sealing resin
resin
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13679589U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13679589U priority Critical patent/JPH0375539U/ja
Publication of JPH0375539U publication Critical patent/JPH0375539U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案による半導体搭載用基板の概念
を示す上面図で、第２図は本考案による基板に半
導体チツプを搭載し樹脂封止したパツケージの断
面図である。また、第３図は従来の半導体搭載用
基板の概念を示す上面図で、第４図は従来の半導
体搭載用基板に半導体チツプを搭載し樹脂封止し
たパツケージの断面図である。

Claims (1)

    【実用新案登録請求の範囲】
  1. プリント配線板に凹部を設け、該凹部に半導体
    チツプを搭載した後、凹部周辺のボンデイングパ
    ツドを取り囲む位置に樹脂枠を貼りつけ封止樹脂
    を注入してパツケージを形成する半導体搭載用基
    板において、半導体封止樹脂及び樹脂枠の上に被
    せたキヤツプによつて覆われる領域内の回路パタ
    ーン厚みが３０〜１００μｍであることを特徴と
    する半導体搭載用基板。
JP13679589U 1989-11-28 1989-11-28 Pending JPH0375539U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13679589U JPH0375539U (ja) 1989-11-28 1989-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13679589U JPH0375539U (ja) 1989-11-28 1989-11-28

Publications (1)

Publication Number Publication Date
JPH0375539U true JPH0375539U (ja) 1991-07-29

Family

ID=31683984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13679589U Pending JPH0375539U (ja) 1989-11-28 1989-11-28

Country Status (1)

Country Link
JP (1) JPH0375539U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008147077A (ja) * 2006-12-12 2008-06-26 Matsushita Electric Ind Co Ltd 車載電子装置
JP2009110862A (ja) * 2007-10-31 2009-05-21 Kenwood Corp 電子機器の外部接続コネクタホルダ
JP2010050110A (ja) * 2009-12-01 2010-03-04 Japan Aviation Electronics Industry Ltd コネクタ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008147077A (ja) * 2006-12-12 2008-06-26 Matsushita Electric Ind Co Ltd 車載電子装置
JP2009110862A (ja) * 2007-10-31 2009-05-21 Kenwood Corp 電子機器の外部接続コネクタホルダ
JP2010050110A (ja) * 2009-12-01 2010-03-04 Japan Aviation Electronics Industry Ltd コネクタ

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