JPH0375545U - - Google Patents
Info
- Publication number
- JPH0375545U JPH0375545U JP13750889U JP13750889U JPH0375545U JP H0375545 U JPH0375545 U JP H0375545U JP 13750889 U JP13750889 U JP 13750889U JP 13750889 U JP13750889 U JP 13750889U JP H0375545 U JPH0375545 U JP H0375545U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- bending
- vibrating
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Wire Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係るリード折曲げ装置の正面
図、第２図は微小振動が加えられているときの半
導体装置の部分正面図である。第３図は半導体装
置の斜視図、第４図は従来のリード折曲げ装置の
側面図、第５図は面実装された半導体装置の側面
図である。
１……半導体装置、２……外装樹脂材、２ａ…
…側壁、２ｂ……底部、２ｃ……上部、３……リ
ード、３ａ……基端部、３ｃ……遊端部、１１…
…ダイ、１２……押え部材、１３……折曲げパン
チ、１４……ガイドブロツク、１５……振動機構
。
FIG. 1 is a front view of a lead bending device according to the present invention, and FIG. 2 is a partial front view of a semiconductor device when micro vibrations are applied. FIG. 3 is a perspective view of a semiconductor device, FIG. 4 is a side view of a conventional lead bending device, and FIG. 5 is a side view of a surface-mounted semiconductor device. 1...Semiconductor device, 2...Exterior resin material, 2a...
...Side wall, 2b...Bottom, 2c...Top, 3...Lead, 3a...Proximal end, 3c...Free end, 11...
...Die, 12...Press member, 13...Bending punch, 14...Guide block, 15...Vibration mechanism.
Claims (1)
導出した半導体装置のリードを折曲げる装置であ
つて、 リードの基端部を挾持するダイ並びに押え部材
と、 ガイドブロツクに保着され、リードの遊端部で
昇降動し、リード中間部を押圧して折曲成形する
折曲げパンチと、 前記ガイドブロツクに掛止し、上記曲げパンチ
をリードの配列方向に微小振動させる振動機構と
を具備したことを特徴とするリード折曲げ装置。[Scope of Claim for Utility Model Registration] A device for bending the leads of a semiconductor device in which multiple leads are drawn out in parallel from the side wall of an exterior resin material, comprising a die and a holding member that clamps the base ends of the leads, and a guide. a bending punch that is held on the block and moves up and down at the free end of the lead to press the middle part of the lead to form a bend; A lead bending device characterized by comprising a vibrating mechanism for vibrating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13750889U JPH0375545U (en) | 1989-11-27 | 1989-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13750889U JPH0375545U (en) | 1989-11-27 | 1989-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375545U true JPH0375545U (en) | 1991-07-29 |
Family
ID=31684662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13750889U Pending JPH0375545U (en) | 1989-11-27 | 1989-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375545U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023551067A (en) * | 2020-12-11 | 2023-12-06 | ジャン，ジエン | Angle shaping device |
-
1989
- 1989-11-27 JP JP13750889U patent/JPH0375545U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023551067A (en) * | 2020-12-11 | 2023-12-06 | ジャン，ジエン | Angle shaping device |