JPH0376796B2 - - Google Patents
Info
- Publication number
- JPH0376796B2 JPH0376796B2 JP4977285A JP4977285A JPH0376796B2 JP H0376796 B2 JPH0376796 B2 JP H0376796B2 JP 4977285 A JP4977285 A JP 4977285A JP 4977285 A JP4977285 A JP 4977285A JP H0376796 B2 JPH0376796 B2 JP H0376796B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- substrates
- substrate
- gap
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 45
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- 238000004080 punching Methods 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4977285A JPS61208287A (ja) | 1985-03-13 | 1985-03-13 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4977285A JPS61208287A (ja) | 1985-03-13 | 1985-03-13 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61208287A JPS61208287A (ja) | 1986-09-16 |
| JPH0376796B2 true JPH0376796B2 (fr) | 1991-12-06 |
Family
ID=12840455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4977285A Granted JPS61208287A (ja) | 1985-03-13 | 1985-03-13 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61208287A (fr) |
-
1985
- 1985-03-13 JP JP4977285A patent/JPS61208287A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61208287A (ja) | 1986-09-16 |
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