JPH0377455U - - Google Patents

Info

Publication number
JPH0377455U
JPH0377455U JP1990126262U JP12626290U JPH0377455U JP H0377455 U JPH0377455 U JP H0377455U JP 1990126262 U JP1990126262 U JP 1990126262U JP 12626290 U JP12626290 U JP 12626290U JP H0377455 U JPH0377455 U JP H0377455U
Authority
JP
Japan
Prior art keywords
runner
lead frame
leads
molding process
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990126262U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPH0377455U publication Critical patent/JPH0377455U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は従来のリードフレーム平面図、第２図
は本考案によるリードフレーム平面図、第３図は
従来のリードフレームを用いてモールド工程を行
つた場合、フラツシユが形成された状態図、第４
図は本考案のリードフレームを用いてモールド工
程を行つた場合、フラツシユが発生しない状態図
。 １，１０……リードフレーム、２，２０……サ
イドレール、３……キヤビテイ、４……ゲート、
５……ランナー、６……ダムバール、８……リー
ド、９……フラツシユ。

Claims (1)

  1. 【実用新案登録請求の範囲】 金型のランナー及びゲートを介してリードフレ
    ーム内のキヤビテイにエポキシー樹脂を供給しモ
    ールド工程を行うために、多数のリードとサイド
    レールを有するリードフレームにおいて、 リードフレームのサイドフレームの各々の端部
    を対角線上に長く形成して、それによつてモール
    ド工程の時、前記ランナー並びにゲートを通じて
    エポキシー樹脂が前記ランナーと多数のリード間
    の各々のリードの間に浸透するのを防止すること
    を特徴とするリードフレーム。
JP1990126262U 1989-11-28 1990-11-28 Pending JPH0377455U (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019890017653U KR920005035Y1 (ko) 1989-11-28 1989-11-28 리드프레임

Publications (1)

Publication Number Publication Date
JPH0377455U true JPH0377455U (ja) 1991-08-05

Family

ID=19292397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990126262U Pending JPH0377455U (ja) 1989-11-28 1990-11-28

Country Status (3)

Country Link
US (1) US5093709A (ja)
JP (1) JPH0377455U (ja)
KR (1) KR920005035Y1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09115936A (ja) * 1995-10-23 1997-05-02 Mitsubishi Electric Corp 半導体装置の樹脂封止用金型
KR100531423B1 (ko) * 2000-10-16 2005-11-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 리드프레임 및 이에 적용되는 몰드다이, 그리고 이를 이용한 패키지 제조장치.
US8205767B2 (en) * 2006-10-31 2012-06-26 Toyota Motor Engineering & Manufacturing North America, Inc. Infinitely adjustable beverage container holder by spin actuation

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125159A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 半導体装置の組立方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59150458A (ja) * 1983-02-03 1984-08-28 Toshiba Corp リ−ドフレ−ム
JPS61104650A (ja) * 1984-10-29 1986-05-22 Rohm Co Ltd リ−ドフレ−ム
JPS61135146A (ja) * 1984-12-06 1986-06-23 Toshiba Corp 半導体リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125159A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 半導体装置の組立方法

Also Published As

Publication number Publication date
KR910009946U (ko) 1991-06-29
US5093709A (en) 1992-03-03
KR920005035Y1 (ko) 1992-07-25

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