JPH0381673U - - Google Patents
Info
- Publication number
- JPH0381673U JPH0381673U JP14325489U JP14325489U JPH0381673U JP H0381673 U JPH0381673 U JP H0381673U JP 14325489 U JP14325489 U JP 14325489U JP 14325489 U JP14325489 U JP 14325489U JP H0381673 U JPH0381673 U JP H0381673U
- Authority
- JP
- Japan
- Prior art keywords
- molded part
- resin molded
- primary molded
- primary
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図はその−線に沿つた断面図、第３図はこ
の考案の異なる実施例を示す斜視図、第４図およ
び第５図はそれぞれ従来の部品実装状態を示す断
面図である。
１…一次成形部、２…二次成形部、３…導体パ
ターン、４…突起部、５…凹部、６，８…部品。
Fig. 1 is a perspective view showing one embodiment of this invention, Fig. 2 is a sectional view taken along the - line, Fig. 3 is a perspective view showing a different embodiment of this invention, and Figs. 4 and 5. are sectional views each showing a conventional component mounting state. DESCRIPTION OF SYMBOLS 1... Primary molding part, 2... Secondary molding part, 3... Conductor pattern, 4... Protrusion part, 5... Recessed part, 6, 8... Parts.
Claims (1)
部の露出面にメツキ層を設けて必要な導体パター
ンを形成してなる樹脂モールド基板において、回
路部品の実装位置に、所定間隔離れた一対の突起
部を形成するとともに、各突起部の略中央に、部
品端子部がハンダ付けされる凹部を互いに対向す
るように形成したことを特徴とする樹脂モールド
基板。 In a resin molded board consisting of a primary molded part and a secondary molded part, and a plating layer provided on the exposed surface of the primary molded part to form the necessary conductor pattern, a pair of circuit parts are placed at a predetermined distance apart at the mounting position of the circuit component. What is claimed is: 1. A resin molded board, comprising: protrusions formed therein, and a recessed portion to which a component terminal portion is soldered substantially in the center of each protrusion so as to face each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14325489U JPH0381673U (en) | 1989-12-12 | 1989-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14325489U JPH0381673U (en) | 1989-12-12 | 1989-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381673U true JPH0381673U (en) | 1991-08-21 |
Family
ID=31690034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14325489U Pending JPH0381673U (en) | 1989-12-12 | 1989-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381673U (en) |
-
1989
- 1989-12-12 JP JP14325489U patent/JPH0381673U/ja active Pending