JPH0385643U - - Google Patents
Info
- Publication number
- JPH0385643U JPH0385643U JP14645389U JP14645389U JPH0385643U JP H0385643 U JPH0385643 U JP H0385643U JP 14645389 U JP14645389 U JP 14645389U JP 14645389 U JP14645389 U JP 14645389U JP H0385643 U JPH0385643 U JP H0385643U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- semiconductor chip
- base tape
- carrier tape
- semiconductor chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000002950 deficient Effects 0.000 claims description 4
- 239000012050 conventional carrier Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例におけるキヤリヤ
テープの一部を示す平面図、第２図は第１図の
−線に沿う断面図、第３図はこのキヤリヤテー
プで不良品と判定された半導体チツプを取り除い
た状態を示す断面図、第４図は不良品と判定され
た半導体チツプと交換される半導体チツプを備え
た補助キヤリヤテープを示す断面図、第５図は不
良品と判定された半導体チツプを新たな半導体チ
ツプと交換した状態を示す断面図、第６図は従来
のキヤリヤテープの一例を示す平面図である。
１１，２１……ベーステープ、１２，２２……
開口、１５，２５……フインガリード、１６，２
６……位置合わせ用円孔、１７，２７……半導体
チツプ、１８，２８……バンプ電極。
FIG. 1 is a plan view showing a part of a carrier tape in an embodiment of this invention, FIG. 2 is a sectional view taken along the line - in FIG. 1, and FIG. 3 is a semiconductor chip determined to be defective using this carrier tape. FIG. 4 is a cross-sectional view showing the auxiliary carrier tape with a semiconductor chip to be replaced with a semiconductor chip determined to be defective, and FIG. 5 is a cross-sectional view showing the semiconductor chip determined to be defective. FIG. 6 is a cross-sectional view showing a state in which the semiconductor chip has been replaced with a new semiconductor chip, and FIG. 6 is a plan view showing an example of a conventional carrier tape. 11, 21...Base tape, 12, 22...
Opening, 15, 25...Finger lead, 16, 2
6... Circular hole for positioning, 17, 27... Semiconductor chip, 18, 28... Bump electrode.
Claims (1)
数の半導体チツプが配置されてなるキヤリヤテー
プにおいて、 前記複数の半導体チツプのうち不良品と判定さ
れた半導体チツプをその周囲の前記ベーステープ
と共に取り除き、この取り除いた部分よりも大き
い新たなベーステープをこれに形成されたリード
の他方向に設けられた半導体チツプと共に前記取
り除いた箇所に接合したことを特徴とするキヤリ
ヤテープ。[Claims for Utility Model Registration] In a carrier tape in which a plurality of semiconductor chips are arranged in one direction of a lead formed on a base tape, a semiconductor chip determined to be a defective product among the plurality of semiconductor chips is placed in the surrounding area. A carrier tape characterized in that the carrier tape is removed together with the base tape, and a new base tape larger than the removed portion is bonded to the removed portion along with a semiconductor chip provided in the other direction of the leads formed on the new base tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14645389U JPH0385643U (en) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14645389U JPH0385643U (en) | 1989-12-21 | 1989-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385643U true JPH0385643U (en) | 1991-08-29 |
Family
ID=31693033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14645389U Pending JPH0385643U (en) | 1989-12-21 | 1989-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385643U (en) |
-
1989
- 1989-12-21 JP JP14645389U patent/JPH0385643U/ja active Pending