JPH0387665U - - Google Patents

Info

Publication number
JPH0387665U
JPH0387665U JP14782889U JP14782889U JPH0387665U JP H0387665 U JPH0387665 U JP H0387665U JP 14782889 U JP14782889 U JP 14782889U JP 14782889 U JP14782889 U JP 14782889U JP H0387665 U JPH0387665 U JP H0387665U
Authority
JP
Japan
Prior art keywords
tape
semiconductor device
adhesive
adhesive member
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14782889U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14782889U priority Critical patent/JPH0387665U/ja
Publication of JPH0387665U publication Critical patent/JPH0387665U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Packages (AREA)

Description

【図面の簡単な説明】
第１図ａはテーピング状態を示す平面図、第１
図ｂは本考案の一実施例のＡＡ′線断面図、第２
図は別の実施例の断面図、第３図は別の実施例の
断面図である。 １……テープ、２……接着部材、３……非粘着
性テープ、４……パツケージ本体、５……外部リ
ード、６……開口部、８……ソルダペースト。

Claims (1)

    【実用新案登録請求の範囲】
  1. フラツトパツケージ型の半導体装置を基板へ実
    装するときの仮止め接着部材として流用可能な接
    着部材を、パツケージ本体のフラツト面に設けた
    半導体装置が、テープ開口部に配置され、テープ
    裏側から前記接着部材を利用してテープに固定さ
    れていることを特徴とする半導体装置のテーピン
    グ構造。
JP14782889U 1989-12-22 1989-12-22 Pending JPH0387665U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14782889U JPH0387665U (ja) 1989-12-22 1989-12-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14782889U JPH0387665U (ja) 1989-12-22 1989-12-22

Publications (1)

Publication Number Publication Date
JPH0387665U true JPH0387665U (ja) 1991-09-06

Family

ID=31694303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14782889U Pending JPH0387665U (ja) 1989-12-22 1989-12-22

Country Status (1)

Country Link
JP (1) JPH0387665U (ja)

Similar Documents

Publication Publication Date Title
JPH0387665U (ja)
JPS58191645U (ja) 半導体装置のパツケ−ジ
JPS62177044U (ja)
JPH0397939U (ja)
JPS6193467U (ja)
JPH0323945U (ja)
JPS6447057U (ja)
JPH0470738U (ja)
JPH0369231U (ja)
JPH0273166U (ja)
JPS61119957U (ja)
JPS6096810U (ja) 電子部品
JPS63178383U (ja)
JPS61196541U (ja)
JPH0456347U (ja)
JPS61174753U (ja)
JPS6382948U (ja)
JPH01133746U (ja)
JPS6194348U (ja)
JPS63107964U (ja)
JPS63132433U (ja)
JPS6122342U (ja) 半導体装置
JPS6210450U (ja)
JPS6387844U (ja)
JPS6251752U (ja)