JPH0392034U - - Google Patents
Info
- Publication number
- JPH0392034U JPH0392034U JP15324089U JP15324089U JPH0392034U JP H0392034 U JPH0392034 U JP H0392034U JP 15324089 U JP15324089 U JP 15324089U JP 15324089 U JP15324089 U JP 15324089U JP H0392034 U JPH0392034 U JP H0392034U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor
- suction nozzle
- semiconductor chip
- stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図、第３図は従来の移し変え方法を示す説
明図、第２図は本考案の実施例構造図である。図
においては１は半導体ウエハ、１ａは半導体チツ
プ、２は枠体（ウエハ台）、３は樹脂シート、４
は治具、５は基台、６は吸着コレツト、６ａ，６
ｂはその金属パイプ及び絶縁チユーブ、７は駆動
部、８は吸着ノズル、８ａは針、９は駆動部であ
る。
1 and 3 are explanatory diagrams showing a conventional transfer method, and FIG. 2 is a structural diagram of an embodiment of the present invention. In the figure, 1 is a semiconductor wafer, 1a is a semiconductor chip, 2 is a frame (wafer stand), 3 is a resin sheet, and 4 is a semiconductor wafer.
is a jig, 5 is a base, 6 is a suction collet, 6a, 6
Reference numeral b indicates the metal pipe and the insulating tube, 7 is a drive section, 8 is a suction nozzle, 8a is a needle, and 9 is a drive section.
Claims (1)
ハ台の上方及び下方に上下関係に配設された半導
体チツプ吸着コレツト及び半導体ウエハ吸着ノズ
ルを備え、前記吸着コレツト及び吸着ノズルの連
動作用により半導体チツプの移し変えを行う半導
体チツプの移し変装置において、前記半導体ウエ
ハ吸着ノズルの前記ウエハ台との接触面を円弧状
に形成すると共に前記半導体チツプ吸着コレツト
の先端金属パイプ内に絶縁パイプを内設したこと
を特徴とする半導体チツプの移し変装置。 It is equipped with a wafer stand for holding a semiconductor wafer, and a semiconductor chip suction collet and a semiconductor wafer suction nozzle that are arranged above and below the wafer stand in a vertical relationship, and the semiconductor chips can be transferred by the interlocking operation of the suction collet and the suction nozzle. In the device for transferring semiconductor chips, the contact surface of the semiconductor wafer suction nozzle with the wafer stand is formed in an arc shape, and an insulating pipe is installed inside the metal pipe at the tip of the semiconductor chip suction collet. Features: Semiconductor chip transfer device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15324089U JPH0392034U (en) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15324089U JPH0392034U (en) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392034U true JPH0392034U (en) | 1991-09-19 |
Family
ID=31699461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15324089U Pending JPH0392034U (en) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392034U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850751A (en) * | 1981-09-22 | 1983-03-25 | Shinkawa Ltd | Replacing method for die |
| JPS6042737B2 (en) * | 1979-09-12 | 1985-09-25 | アイシン精機株式会社 | Automatic embroidery machine control device |
-
1989
- 1989-12-29 JP JP15324089U patent/JPH0392034U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6042737B2 (en) * | 1979-09-12 | 1985-09-25 | アイシン精機株式会社 | Automatic embroidery machine control device |
| JPS5850751A (en) * | 1981-09-22 | 1983-03-25 | Shinkawa Ltd | Replacing method for die |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0371641U (en) | ||
| JPH0392034U (en) | ||
| CN221848328U (en) | Solenoid valve body deburring tool | |
| JPH03128943U (en) | ||
| JPS63115214U (en) | ||
| JPH0412647U (en) | ||
| JPH0163130U (en) | ||
| JPH01173940U (en) | ||
| JPS63121443U (en) | ||
| JPS62118443U (en) | ||
| JPS63128007U (en) | ||
| JPS6196684U (en) | ||
| JPS6258050U (en) | ||
| JPH0189748U (en) | ||
| JPS6390841U (en) | ||
| JPS6452647U (en) | ||
| JPH0371623U (en) | ||
| JPS6117730U (en) | plasma athering device | |
| JPH0256533U (en) | ||
| JPH0415238U (en) | ||
| JPS6188233U (en) | ||
| JPS62201935U (en) | ||
| JPS6370810U (en) | ||
| JPH04131936U (en) | Wire threading jig | |
| JPS61188358U (en) |